EP3SL200F1517I4 - 200K LE Stratix III L FPGA | Intel (Altera)
MPN: EP3SL200F1517I4 ✗ Cuối đờiEP3SL200F1517I4 Tóm tắt
A Field Programmable Gate Array (FPGA) is a semiconductor IC whose logic functionality is defined by the customer after manufacturing. Hierarchically, an FPGA sits inside the broader category of programmable logic devices (PLDs), itself a subset of integrated circuits and digital logic ICs. FPGAs differ from ASICs by offering post-fabrication reconfigurability at the cost of higher per-unit price, area, and dynamic power; the Stratix III L family specifically targets a power-per-logic-element sweet spot between the original Stratix III and the Stratix IV families.
Key features include 200,000 logic elements, 9,152 Kbits embedded memory, 8,000 LABs, 976 user I/Os, and embedded multipliers/DSP blocks. Internal frequency is rated at up to 450 MHz. The 1517-ball FC-FBGA package supports high-pin-count designs with multiple high-speed transceiver and external memory interface (EMIF) banks. The 65 nm process enables higher density at lower static leakage than the 90 nm Stratix II generation.
Typical applications include high-end telecommunications baseband processing, radar and beamforming DSP, ASIC prototyping, high-speed test and measurement, and broadcast video processing. The high logic count makes the part particularly suited to designs that have outgrown mid-density Stratix III devices but do not require the absolute highest density of the Stratix V family.
When designing with this device, plan power delivery for high transient currents during configuration and dynamic reconfiguration. The FC-FBGA package requires careful PCB stackup, microvia or via-in-pad fabrication, and matched-length routing for high-speed serial interfaces. Quartus II is the canonical design toolchain.
This page synthesizes distributor pricing from DigiKey/Mouser, cross-references, and a parametric comparison table not found in the manufacturer datasheet.
Bộ thay thế dễ dàng lắp đặt cho EP3SL200F1517I4 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP3SL200F1517I4 (cùng hình factor và footprint) — khác nhau ở Package, Embedded Memory Bits, Process Technology, Speed Grade, Logic Elements.
EP3SL200F1517I3N
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP3SE260F1517I4N
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP3SE260F1517I4
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP3SE110F1517I3N
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
EP3SL200F1517C4N
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
EP3SL200F1517I4 Tỷ lệ tối đa & tính chất điện
| Family | Stratix III L |
| Logic Elements | 200,000 |
| Logic Array Blocks (LABs) | 8000 |
| Embedded Memory | 10,901,504 bits (~10.4 Mbit) |
| Maximum User I/Os | 976 |
| Process Node | 65 nm |
| Core Voltage | 1.1 V |
| Internal Frequency | up to 450 MHz |
| Hộp | 1517-ball FC-FBGA |
| Kiểu lắp đặt | Surface Mount |
| Nhiệt độ hoạt động | -40C to +100C (Industrial) |
| Supply Voltage Range | 0.9 V to 1.1 V core |
| Trạng thái RoHS | Compliant |
| Lead-Free | Yes |
| Cấp MSL | 3 |
| Device Type | FPGA - Field Programmable Gate Array |
Hướng dẫn cấu hình chân EP3SL200F1517I4 1517-ball fc-fbga
Cấu hình chân cho EP3SL200F1517I4 (1517-ball fc-fbga gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EP3SL200F1517I4.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EP3SL200F1517I4 phù hợp cho 6 Áp dụngs: ASIC Prototyping, Telecommunications Baseband Processing, Radar and Beamforming DSP, High-Speed Test and Measurement, Broadcast Video Processing, Industrial Control and Automation.
ASIC Prototyping
The EP3SL200F1517I4's 200K logic elements and 10.4 Mbit embedded memory make it a strong fit for ASIC prototyping where engineers need high logic capacity, fast iteration, and Quartus II verification flows. With up to 976 user I/Os, designers can map large multi-million-gate ASICs to a single Stratix III L device, partitioning logic across LABs and TriMatrix memory blocks while preserving timing closure. The 65 nm process and 1.1 V core deliver low static leakage versus older 90 nm FPGA families, which is meaningful when prototyping power-sensitive ASIC designs. Compared to ASIC tape-out, this FPGA approach cuts iteration time from weeks to hours, accepting higher per-unit cost for development-cycle agility.
Được đề xuất
Telecommunications Baseband Processing
The EP3SL200F1517I4's 200K logic elements and embedded DSP blocks make it well-suited for 3G/4G wireless baseband signal processing, including channel coding, modulation/demodulation, and FFT/iFFT pipelines. With 976 user I/Os and multiple high-speed transceiver banks, the device interfaces cleanly to external ADC/DAC converters, RF front-ends, and CPRI/OBSAI links. The Stratix III L power-optimized architecture delivers lower static leakage than the Stratix III E family, which matters in thermally constrained outdoor base-station enclosures. Designers can leverage Altera's DSP Builder and pre-verified IP cores for turbo decoding and crest-factor reduction.
Được đề xuất
Radar and Beamforming DSP
The EP3SL200F1517I4's combination of 200K logic elements, embedded multipliers, and 10.4 Mbit memory suits phased-array radar beamforming and pulse-Doppler signal-processing implementations. With 976 user I/Os, designers can aggregate many LVDS data lanes from multi-channel ADCs and route them through parallel FIR filter banks into detection logic. The device's 450 MHz internal frequency supports real-time beam-steering update rates required by modern AESA radars. Compared to GPU-based approaches, this FPGA implementation offers deterministic latency critical for closed-loop beam control. Quartus II DSP Builder accelerates floating-point to fixed-point conversion.
Được đề xuất
High-Speed Test and Measurement
The EP3SL200F1517I4's 976 user I/Os and high internal logic capacity suit high-channel-count protocol analyzers, logic analyzers, and bit-error-rate testers where the FPGA must aggregate and process data from dozens of high-speed serial links simultaneously. Its embedded TriMatrix memory blocks provide flexible FIFO depths for capturing protocol bursts, while the LVDS-capable I/Os drive multi-Gbps sample rates from external ADC front-ends. The 65 nm process yields sufficient timing margin for 1+ GHz internal datapaths. Compared to discrete logic implementations, this FPGA approach reduces PCB area by an order of magnitude while improving test-pattern flexibility.
Được đề xuất
Broadcast Video Processing
The EP3SL200F1517I4's logic density and embedded memory suit broadcast video switchers, multi-format frame synchronizers, and SD/HD/3G-SDI routing matrices that require real-time processing at full broadcast frame rates. The 976 user I/Os accommodate many SDI streams routed in parallel, while the embedded memory blocks implement line buffers and look-up tables for color-space conversion. Compared to CPU-based processing, FPGA-based broadcast equipment delivers deterministic frame latency and faster switching between video standards. The Stratix III L architecture provides the low-static-power profile required in always-on broadcast racks.
Được đề xuất
Industrial Control and Automation
The EP3SL200F1517I4 suits complex industrial controllers for high-axis motion control, multi-protocol industrial networking, and machine-vision inspection systems. With 200K logic elements, designers can integrate EtherCAT, PROFINET, and EtherNet/IP stacks alongside multi-axis servo loops on a single FPGA. The 976 user I/Os accommodate many encoder, GPIO, and high-speed LVDS sensor lanes, while embedded memory implements deterministic position buffers. The -40C to +100C industrial temperature grade supports deployment in factory-floor enclosures without additional thermal management beyond standard heatsinking.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP3SL200F1517I4 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP3SL200F1517I3N | EP3SE260F1517I4N | EP3SE110F1517I3N | EP3SL200F1517C4N |
|---|---|---|---|---|---|
| Package | 1517-ball FC-FBGA | 1517-ball FC-FBGA | 1517-ball FC-FBGA | 1517-ball FC-FBGA | 1517-ball FC-FBGA |
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Family | Stratix III L | Stratix III L | Stratix III E | Stratix III E | Stratix III L |
| Logic Elements | 200,000 | 200,000 | 260,000 | 110,000 | 200,000 |
| Speed Grade | -4 (fastest) | -3 | -4 | -3 | -4 |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C | -40C to +100C | -40C to +100C | 0C to +85C (Commercial) |
| Embedded Memory | 10.4 Mbit | 10.4 Mbit | 14.0 Mbit | 6.0 Mbit | 10.4 Mbit |
| User I/Os | 976 | 976 | 976 | 744 | 976 |
| Process Node | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
Bảo phân biệt quan trọng
- Highest-density Stratix III L device with 200K LE (vsEP3SL150F1152C4N)
- Lower static power than Stratix III E family at equivalent logic capacity (vsEP3SE260F1517I4N)
- Industrial temperature grade versus commercial-only equivalent (vsEP3SL200F1517C4N)
- Largest pin-count package (1517-ball) for highest I/O density (vsEP3SL200F1152I4N)
Ghi chú thiết kế
Estimated: The 1517-ball FC-FBGA package has 1.0 mm ball pitch. PCB fabrication must support microvia (laser-drilled) or via-in-pad technology. Stackup should be designed for high-speed signal integrity with matched impedance (50 ohm single-ended, 100 ohm differential). Use at least 8 PCB layers with continuous reference planes for transceiver and EMIF signals.
Estimated: At 1.1 V core with 200K LE fully utilized, transient currents during configuration and dynamic reconfiguration can exceed 20 A. Use a buck regulator with at least 30 A capability and place decoupling capacitors (per Quartus II pin connection guidelines) within 100 mils of every power pin. Add 0.1 uF, 1 uF, and 10 uF ceramic caps per power rail per the Stratix III device handbook recommendations.
Estimated: At typical 0.9-1.1 V core with 200K LE utilization, the 1517-ball FC-FBGA dissipates 5-15 W depending on toggle rate. The exposed-die flip-chip BGA requires thermal vias under the package center to conduct heat to internal copper planes. For high-utilization designs, attach a heat spreader or small heatsink; for full-power designs, forced airflow is required.
Estimated: Match-length routing is critical for LVDS and transceiver interfaces. Quartus II Fitter reports will flag skew violations; route within 25 mils of target lengths for LVDS pairs and within tighter tolerances for transceiver channels. Reference-pin placement for differential pairs should follow the Stratix III device handbook pin connection guidelines to avoid signal-integrity issues.
Do not confuse the 'I4' speed/temperature suffix pattern with other Stratix families. Verify Quartus II device support version compatibility (Stratix III support runs through Quartus Prime 16.x). The 1517-ball FC-FBGA package requires factory-programmed MSL3 handling for unopened trays, and assembled boards should be baked before rework to avoid 'popcorn' damage to the package.
Thông tin tuân thủ
RoHS compliant and lead-free per Altera/Intel product page and DigiKey environmental data. Halogen-free status should be confirmed with manufacturer's latest material declaration for current programs. AEC-Q100 not applicable for FPGA logic devices.
