EP3SL200F1517I4 - 200K LE Stratix III L FPGA | Intel (Altera)
부품 번호: EP3SL200F1517I4 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1725 | $17,250.00 |
| 100 | $1580 | $158,000.00 |
| 500 | $1450 | $725,000.00 |
| 1,000 | $1325 | $1,325,000.00 |
EP3SL200F1517I4 개요
A Field Programmable Gate Array (FPGA) is a semiconductor IC whose logic functionality is defined by the customer after manufacturing. Hierarchically, an FPGA sits inside the broader category of programmable logic devices (PLDs), itself a subset of integrated circuits and digital logic ICs. FPGAs differ from ASICs by offering post-fabrication reconfigurability at the cost of higher per-unit price, area, and dynamic power; the Stratix III L family specifically targets a power-per-logic-element sweet spot between the original Stratix III and the Stratix IV families.
Key features include 200,000 logic elements, 9,152 Kbits embedded memory, 8,000 LABs, 976 user I/Os, and embedded multipliers/DSP blocks. Internal frequency is rated at up to 450 MHz. The 1517-ball FC-FBGA package supports high-pin-count designs with multiple high-speed transceiver and external memory interface (EMIF) banks. The 65 nm process enables higher density at lower static leakage than the 90 nm Stratix II generation.
Typical applications include high-end telecommunications baseband processing, radar and beamforming DSP, ASIC prototyping, high-speed test and measurement, and broadcast video processing. The high logic count makes the part particularly suited to designs that have outgrown mid-density Stratix III devices but do not require the absolute highest density of the Stratix V family.
When designing with this device, plan power delivery for high transient currents during configuration and dynamic reconfiguration. The FC-FBGA package requires careful PCB stackup, microvia or via-in-pad fabrication, and matched-length routing for high-speed serial interfaces. Quartus II is the canonical design toolchain.
This page synthesizes distributor pricing from DigiKey/Mouser, cross-references, and a parametric comparison table not found in the manufacturer datasheet.
드롭인 대체품: EP3SL200F1517I4 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SL200F1517I4 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Embedded Memory Bits, Process Technology, Speed Grade, Logic Elements.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SL200F1517I3N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1620 / 개
데이터시트 보기 →EP3SE260F1517I4N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$10500 / 개
데이터시트 보기 →EP3SE260F1517I4
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$10750 / 개
데이터시트 보기 →EP3SE110F1517I3N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP3SL200F1517C4N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP3SL200F1517I4 최대 정격 & 전기적 특성
| Family | Stratix III L |
| Logic Elements | 200,000 |
| Logic Array Blocks (LABs) | 8000 |
| Embedded Memory | 10,901,504 bits (~10.4 Mbit) |
| Maximum User I/Os | 976 |
| Process Node | 65 nm |
| Core Voltage | 1.1 V |
| Internal Frequency | up to 450 MHz |
| 패키지 | 1517-ball FC-FBGA |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +100C (Industrial) |
| Supply Voltage Range | 0.9 V to 1.1 V core |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
| MSL 레벨 | 3 |
| Device Type | FPGA - Field Programmable Gate Array |
EP3SL200F1517I4 1517-ball fc-fbga 핀 구성 가이드
EP3SL200F1517I4(1517-ball fc-fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SL200F1517I4.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SL200F1517I4 적합 용도: 6 애플리케이션s: ASIC Prototyping, Telecommunications Baseband Processing, Radar and Beamforming DSP, High-Speed Test and Measurement, Broadcast Video Processing, Industrial Control and Automation.
ASIC Prototyping
The EP3SL200F1517I4's 200K logic elements and 10.4 Mbit embedded memory make it a strong fit for ASIC prototyping where engineers need high logic capacity, fast iteration, and Quartus II verification flows. With up to 976 user I/Os, designers can map large multi-million-gate ASICs to a single Stratix III L device, partitioning logic across LABs and TriMatrix memory blocks while preserving timing closure. The 65 nm process and 1.1 V core deliver low static leakage versus older 90 nm FPGA families, which is meaningful when prototyping power-sensitive ASIC designs. Compared to ASIC tape-out, this FPGA approach cuts iteration time from weeks to hours, accepting higher per-unit cost for development-cycle agility.
추천
Telecommunications Baseband Processing
The EP3SL200F1517I4's 200K logic elements and embedded DSP blocks make it well-suited for 3G/4G wireless baseband signal processing, including channel coding, modulation/demodulation, and FFT/iFFT pipelines. With 976 user I/Os and multiple high-speed transceiver banks, the device interfaces cleanly to external ADC/DAC converters, RF front-ends, and CPRI/OBSAI links. The Stratix III L power-optimized architecture delivers lower static leakage than the Stratix III E family, which matters in thermally constrained outdoor base-station enclosures. Designers can leverage Altera's DSP Builder and pre-verified IP cores for turbo decoding and crest-factor reduction.
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Radar and Beamforming DSP
The EP3SL200F1517I4's combination of 200K logic elements, embedded multipliers, and 10.4 Mbit memory suits phased-array radar beamforming and pulse-Doppler signal-processing implementations. With 976 user I/Os, designers can aggregate many LVDS data lanes from multi-channel ADCs and route them through parallel FIR filter banks into detection logic. The device's 450 MHz internal frequency supports real-time beam-steering update rates required by modern AESA radars. Compared to GPU-based approaches, this FPGA implementation offers deterministic latency critical for closed-loop beam control. Quartus II DSP Builder accelerates floating-point to fixed-point conversion.
추천
High-Speed Test and Measurement
The EP3SL200F1517I4's 976 user I/Os and high internal logic capacity suit high-channel-count protocol analyzers, logic analyzers, and bit-error-rate testers where the FPGA must aggregate and process data from dozens of high-speed serial links simultaneously. Its embedded TriMatrix memory blocks provide flexible FIFO depths for capturing protocol bursts, while the LVDS-capable I/Os drive multi-Gbps sample rates from external ADC front-ends. The 65 nm process yields sufficient timing margin for 1+ GHz internal datapaths. Compared to discrete logic implementations, this FPGA approach reduces PCB area by an order of magnitude while improving test-pattern flexibility.
추천
Broadcast Video Processing
The EP3SL200F1517I4's logic density and embedded memory suit broadcast video switchers, multi-format frame synchronizers, and SD/HD/3G-SDI routing matrices that require real-time processing at full broadcast frame rates. The 976 user I/Os accommodate many SDI streams routed in parallel, while the embedded memory blocks implement line buffers and look-up tables for color-space conversion. Compared to CPU-based processing, FPGA-based broadcast equipment delivers deterministic frame latency and faster switching between video standards. The Stratix III L architecture provides the low-static-power profile required in always-on broadcast racks.
추천
Industrial Control and Automation
The EP3SL200F1517I4 suits complex industrial controllers for high-axis motion control, multi-protocol industrial networking, and machine-vision inspection systems. With 200K logic elements, designers can integrate EtherCAT, PROFINET, and EtherNet/IP stacks alongside multi-axis servo loops on a single FPGA. The 976 user I/Os accommodate many encoder, GPIO, and high-speed LVDS sensor lanes, while embedded memory implements deterministic position buffers. The -40C to +100C industrial temperature grade supports deployment in factory-floor enclosures without additional thermal management beyond standard heatsinking.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SL200F1517I4 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SL200F1517I3N | EP3SE260F1517I4N | EP3SE110F1517I3N | EP3SL200F1517C4N |
|---|---|---|---|---|---|
| Package | 1517-ball FC-FBGA | 1517-ball FC-FBGA | 1517-ball FC-FBGA | 1517-ball FC-FBGA | 1517-ball FC-FBGA |
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Family | Stratix III L | Stratix III L | Stratix III E | Stratix III E | Stratix III L |
| Logic Elements | 200,000 | 200,000 | 260,000 | 110,000 | 200,000 |
| Speed Grade | -4 (fastest) | -3 | -4 | -3 | -4 |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C | -40C to +100C | -40C to +100C | 0C to +85C (Commercial) |
| Embedded Memory | 10.4 Mbit | 10.4 Mbit | 14.0 Mbit | 6.0 Mbit | 10.4 Mbit |
| User I/Os | 976 | 976 | 976 | 744 | 976 |
| Process Node | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
주요 차별점
- Highest-density Stratix III L device with 200K LE (vs EP3SL150F1152C4N)
- Lower static power than Stratix III E family at equivalent logic capacity (vs EP3SE260F1517I4N)
- Industrial temperature grade versus commercial-only equivalent (vs EP3SL200F1517C4N)
- Largest pin-count package (1517-ball) for highest I/O density (vs EP3SL200F1152I4N)
설계 노트
Estimated: The 1517-ball FC-FBGA package has 1.0 mm ball pitch. PCB fabrication must support microvia (laser-drilled) or via-in-pad technology. Stackup should be designed for high-speed signal integrity with matched impedance (50 ohm single-ended, 100 ohm differential). Use at least 8 PCB layers with continuous reference planes for transceiver and EMIF signals.
Estimated: At 1.1 V core with 200K LE fully utilized, transient currents during configuration and dynamic reconfiguration can exceed 20 A. Use a buck regulator with at least 30 A capability and place decoupling capacitors (per Quartus II pin connection guidelines) within 100 mils of every power pin. Add 0.1 uF, 1 uF, and 10 uF ceramic caps per power rail per the Stratix III device handbook recommendations.
Estimated: At typical 0.9-1.1 V core with 200K LE utilization, the 1517-ball FC-FBGA dissipates 5-15 W depending on toggle rate. The exposed-die flip-chip BGA requires thermal vias under the package center to conduct heat to internal copper planes. For high-utilization designs, attach a heat spreader or small heatsink; for full-power designs, forced airflow is required.
Estimated: Match-length routing is critical for LVDS and transceiver interfaces. Quartus II Fitter reports will flag skew violations; route within 25 mils of target lengths for LVDS pairs and within tighter tolerances for transceiver channels. Reference-pin placement for differential pairs should follow the Stratix III device handbook pin connection guidelines to avoid signal-integrity issues.
Do not confuse the 'I4' speed/temperature suffix pattern with other Stratix families. Verify Quartus II device support version compatibility (Stratix III support runs through Quartus Prime 16.x). The 1517-ball FC-FBGA package requires factory-programmed MSL3 handling for unopened trays, and assembled boards should be baked before rework to avoid 'popcorn' damage to the package.
규정 준수 정보
RoHS compliant and lead-free per Altera/Intel product page and DigiKey environmental data. Halogen-free status should be confirmed with manufacturer's latest material declaration for current programs. AEC-Q100 not applicable for FPGA logic devices.
