5M1270ZF256I5N - MAX V CPLD 980 Macro Cells 201MHz | Intel
MPN: 5M1270ZF256I5N ✓ فعال5M1270ZF256I5N جائزہ
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that belongs to the broader family of programmable logic devices (PLDs), which sit alongside FPGAs in the digital logic hierarchy. Within the taxonomy: CPLD -> PLD -> programmable logic -> digital IC -> semiconductor. MAX V CPLDs use a classic Look-Up Table (LUT) and macro-cell fabric with a deterministic routing architecture, providing predictable pin-to-pin timing of approximately 5-7 ns that makes them ideal for glue-logic, bus-interface bridging, and control-plane tasks rather than high-throughput data-path processing.
Key features include 980 logic elements (LEs), 8 Kbits of user flash memory (UFM), 1.8 V core voltage with multi-voltage I/O support (1.5 V to 3.3 V), JTAG and in-system programmability, and industrial temperature range (-40C to +100C). The device is built on a 0.18 um CMOS process and consumes approximately 17 mW typical quiescent power, dramatically lower than legacy MAX II parts.
The 5M1270ZF256I5N uses a non-volatile flash-based configuration cell that holds the bitstream inside the device. Designers typically enter logic via Quartus II Web Edition or the newer Quartus Prime Lite using VHDL, Verilog, or schematic entry, then synthesize to a JEDEC/STAPL/POF bitstream that loads via JTAG, Active Serial, or Active Parallel modes.
Typical applications include I/O expansion and bus bridging in industrial control boards, power-sequencer state machines for telecom line cards, display-panel timing controllers for LCD/OLED modules, and address decoding glue-logic between microprocessors and memory. Designers frequently pair the 5M1270ZF256I5N with a Cyclone V SoC for boot-mode strap handling, with discrete logic ICs for I2C/SPI level shifting, and with Intel MAX 10 or Cyclone 10 LP FPGAs for downstream processing.
When designing with this device, ensure that VCCINT (1.8 V) and VCCIO banks (1.5-3.3 V) are decoupled with 100 nF ceramic capacitors placed as close as possible to the BGA balls. Unused I/O pins should be configured as outputs driving ground via the Quartus pin-assignment editor to minimize in-rush current at power-up. Verify all JTAG chain lengths if multiple MAX V devices share TDI/TDO.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
کے لیے ڈراپ اِن متبادل 5M1270ZF256I5N — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں 5M1270ZF256I5N (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Operating Temperature, Package, Programming Interface, Configuration Memory, Family.
5M1270ZF256C5N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →5M1270ZF256C4N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →5M1270ZF256A5N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →5M1270ZF256I5N
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →5M1270ZF256I5N زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Product Type | CPLD (Complex Programmable Logic Device) |
| Family | MAX V |
| Macro Cells | 980 |
| Maximum Operating Frequency | 201.1 MHz |
| Core Supply Voltage (VCCINT) | 1.8 V |
| I/O Bank Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| User Flash Memory (UFM) | 8 Kbits |
| User I/O Pins (max) | 212 |
| پیکیج | 256-ball FBGA |
| Configuration Memory | Non-volatile flash (instant-on) |
| Programming Interface | JTAG, Active Serial, Active Parallel |
| Process Technology | 0.18 um CMOS |
| آپریٹنگ درجہ حرارت | -40C to +100C (Industrial) |
| RoHS اسٹیٹس | Compliant |
| Lead-Free | Yes |
5M1270ZF256I5N 256-ball fbga پن کنفیگریشن گائیڈ
5M1270ZF256I5N (256-ball fbga پیکیج) کے لیے پن کنفیگریشن۔ اس ڈیجیٹل IC میں GPIO، کمیونیکیشن انٹرفیس (UART، SPI، I2C) اور پاور پنز شامل ہیں۔ متبادل پن فنکشنز اور کنفیگریشن آپشنز کے لیے مینوفیکچرر کے ڈیٹا شیٹ سے رجوع کریں۔ ایمبیڈڈ سسٹم ڈیزائن اور PCB لے آؤٹ کے لیے ضروری۔
کے لیے تفصیلی پن آؤٹ ڈیٹا دستیاب نہیں 5M1270ZF256I5N.
رجوع کریں ڈیٹا شیٹ مکمل پن کنفیگریشن کے لیے۔
عام استعمالات
5M1270ZF256I5N کے لیے موزوں ہے 6 ایپلیکیشنs: I/O Expansion and Bus Bridging, Power Sequencing and Supervisor Logic, Display Panel Timing Controller, Address Decoding and Memory Glue Logic, Motor Control Interface and PWM Generation, Telecom Line Card Glue Logic.
I/O Expansion and Bus Bridging
The 5M1270ZF256I5N excels at I/O expansion and bus bridging in industrial control boards where a microcontroller or SoC lacks sufficient GPIO or peripheral channels. With 980 macro cells and 212 user I/O pins, the device can implement multi-master I2C/SPI bridges, UART-to-parallel converters, and 8/16/32-bit address decoder arrays in a single chip. The MAX V architecture provides deterministic 5-7 ns pin-to-pin delay, which simplifies timing closure for asynchronous bus interfaces like 8086 or 6800 buses. Multi-voltage I/O banks (1.5 V to 3.3 V) allow direct connection to legacy 5 V-tolerant peripherals via external clamping. Designers typically pair the CPLD with a 100 MHz host MCU for sub-microsecond interrupt latency.
تجویز کردہ
Power Sequencing and Supervisor Logic
The 5M1270ZF256I5N is widely deployed as a power-sequencer state machine in telecom line cards, ATCA shelves, and high-availability server backplanes. Each macro cell stores one step of the rail-up/rail-down sequence (typical systems need 6-12 rails), and the non-volatile flash configuration guarantees deterministic startup from cold-boot without external firmware load. The 1.8 V core plus 3.3 V-tolerant I/O banks allow direct interface to PMBus supervisors and MOSFET drivers. PG (power-good) feedback signals can be routed to the 980-element logic array to implement fault interlocks within ~10 ns response, faster than equivalent MCU firmware loops.
تجویز کردہ
Display Panel Timing Controller
In LCD, OLED, and e-ink display modules, the 5M1270ZF256I5N implements the panel timing controller (TCON) function - generating HSYNC/VSYNC/DE timing, gamma-correction lookup tables in UFM, and bidirectional LVDS-to-parallel conversion. The 201 MHz internal frequency comfortably drives 1080p60 panels at 148.5 MHz pixel clock while leaving headroom for OSD overlay logic. Industrial temperature grade (-40C to +100C) supports outdoor signage and automotive cluster applications. The 256-ball FBGA package's low-EMI ball grid also suits tightly-routed multi-lane display PCBs.
تجویز کردہ
Address Decoding and Memory Glue Logic
The 5M1270ZF256I5N is a textbook choice for address-decoding glue logic between microprocessors, ASICs, and memory banks in legacy and modern systems alike. A single 980-macro-cell device can decode a full 24-bit address space into 16-32 chip-select signals with sub-nanosecond propagation, replacing dozens of 74-series TTL gates. The non-volatile configuration makes the decoder table field-updatable via JTAG during board bring-up, allowing late-stage firmware changes without PCB rework. Industrial designers commonly pair this CPLD with Intel 80186, NXP MPC8xx, or modern ARM SoCs.
تجویز کردہ
Motor Control Interface and PWM Generation
The 5M1270ZF256I5N's deterministic timing and 212 I/O pins make it ideal for motor-control front-end logic: PWM generation up to 200 kHz, Hall-sensor decoding, quadrature-encoder counting, and BLDC commutation state machines. The 980 macro cells easily hold a 6-channel center-aligned PWM with dead-time insertion, and the 8 Kbit UFM stores calibration tables for back-EMF compensation. Multi-voltage I/O banks allow direct interface to 3.3 V gate drivers and 5 V Hall sensors from the same device. Industrial motor drives up to ~3 kW typically fit in this single CPLD without external logic.
تجویز کردہ
Telecom Line Card Glue Logic
In telecom line cards and ATCA/AMC modules, the 5M1270ZF256I5N handles rear-transition-module (RTM) interface bridging, EEPROM emulation, JTAG chain management, and shelf-management controller (ShMC) auxiliary logic. The 256-ball FBGA package's compact 17x17 mm footprint fits in space-constrained line-card faceplates, and the 1.8 V core plus 3.3 V I/O enables direct connection to legacy Zarlink/Microsemi telecom ASICs without level shifters. Industrial temperature grade and long-term Intel/Altera lifecycle support suit the 10-15 year deployment windows typical in carrier networks.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا 5M1270ZF256I5N — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | 5M1270ZF256C5N | 5M1270ZF256C4N | 5M1270ZF256A5N | 5M1270ZF256I5N |
|---|---|---|---|---|---|
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Package | 256-ball FBGA | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same |
| Macro Cells | 980 | 980 - same | 980 - same | 980 - same | 980 - same |
| Maximum Frequency | 201.1 MHz | 201.1 MHz | ~180 MHz (speed grade 4) | 201.1 MHz | 201.1 MHz |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Automotive (-40C to +125C) | Industrial (-40C to +100C) |
| Core Voltage (VCCINT) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| User I/O (max) | 212 | 212 | 212 | 212 | 212 |
| User Flash Memory | 8 Kbit | 8 Kbit | 8 Kbit | 8 Kbit | 8 Kbit |
اہم امتیازی خصوصیات
- Largest macro-cell density in the MAX V family (بمقابلہ5M570ZT144I5N)
- Non-volatile flash configuration with instant-on (بمقابلہCyclone 10 LP FPGA)
- Deterministic pin-to-pin timing (بمقابلہMicrocontroller-based glue logic)
ڈیزائن نوٹس
The 5M1270ZF256I5N requires two supply rails: VCCINT at 1.8 V (core) and one or more VCCIO rails at 1.5-3.3 V for I/O banks. Decouple each rail with a 100 nF X7R ceramic capacitor placed within 3 mm of the corresponding BGA ball, plus a 10 uF bulk tantalum or ceramic capacitor near the device. The on-chip voltage regulator simplifies the board design but in-rush current at power-up can reach ~50 mA per bank; sequence VCCINT before VCCIO for predictable JTAG configuration behavior.
The 256-ball FBGA package has a 1.0 mm ball pitch. Use a 4- or 6-layer PCB with at least two inner ground planes for return-path continuity, and via-in-pad micro-vias for BGA breakout. Fanout the inner balls on a 0.5 mm via grid with dog-bone fan-out where cost dictates 4-layer stackup. Maintain 50 ohm single-ended impedance on high-speed clock and JTAG traces routed on the top layer over an unbroken ground plane.
Do not leave unused I/O pins floating - configure them in the Quartus pin-assignment file as outputs driving ground, or as inputs with weak pull-ups enabled, to avoid in-rush transients during configuration. The JTAG TDI/TDO chain must include proper 4.7 kohm pull-ups on TCK and TMS, and TCK should be buffered if driving more than three MAX V devices in series. Verify the JTAG chain IDCODE before attempting erase/program operations to avoid corrupting adjacent devices.
تعمیل کی معلومات
RoHS compliant and lead-free per Intel MAX V family material declaration. Choose 5M1270ZF256A5N for AEC-Q100 automotive qualification - the I5N part itself is industrial-grade only.
