5M1270ZF256I5N - MAX V CPLD 980 Macro Cells 201MHz | Intel
MPN: 5M1270ZF256I5N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $11.5 | $11.50 |
| 10 | $10.4 | $104.00 |
| 100 | $9.15 | $915.00 |
| 500 | $8.3 | $4,150.00 |
| 1,000 | $7.55 | $7,550.00 |
Drop-in alternatives for 5M1270ZF256I5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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5M1270ZF256C5N
✅ Drop-In✓ In Stock
$21.4 / Unit
View Datasheet →5M1270ZF256C4N
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View Datasheet →5M1270ZF256A5N
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$24.1 / Unit
View Datasheet →5M1270ZF256I5N
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$7.55 / Unit
View Datasheet →5M1270ZF256I5N Maximum Ratings & Electrical Characteristics
| Product Type | CPLD (Complex Programmable Logic Device) |
| Family | MAX V |
| Macro Cells | 980 |
| Maximum Operating Frequency | 201.1 MHz |
| Core Supply Voltage (VCCINT) | 1.8 V |
| I/O Bank Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| User Flash Memory (UFM) | 8 Kbits |
| User I/O Pins (max) | 212 |
| Package | 256-ball FBGA |
| Configuration Memory | Non-volatile flash (instant-on) |
| Programming Interface | JTAG, Active Serial, Active Parallel |
| Process Technology | 0.18 um CMOS |
| Operating Temperature | -40C to +100C (Industrial) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
5M1270ZF256I5N 256-ball fbga Pin Configuration Guide
Complete pinout information for 5M1270ZF256I5N (256-ball fbga package) with 212 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5M1270ZF256I5N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 212 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5M1270ZF256I5N is suitable for 6 applications: I/O Expansion and Bus Bridging, Power Sequencing and Supervisor Logic, Display Panel Timing Controller, Address Decoding and Memory Glue Logic, Motor Control Interface and PWM Generation, Telecom Line Card Glue Logic.
I/O Expansion and Bus Bridging
The 5M1270ZF256I5N excels at I/O expansion and bus bridging in industrial control boards where a microcontroller or SoC lacks sufficient GPIO or peripheral channels. With 980 macro cells and 212 user I/O pins, the device can implement multi-master I2C/SPI bridges, UART-to-parallel converters, and 8/16/32-bit address decoder arrays in a single chip. The MAX V architecture provides deterministic 5-7 ns pin-to-pin delay, which simplifies timing closure for asynchronous bus interfaces like 8086 or 6800 buses. Multi-voltage I/O banks (1.5 V to 3.3 V) allow direct connection to legacy 5 V-tolerant peripherals via external clamping. Designers typically pair the CPLD with a 100 MHz host MCU for sub-microsecond interrupt latency.
Recommended
Power Sequencing and Supervisor Logic
The 5M1270ZF256I5N is widely deployed as a power-sequencer state machine in telecom line cards, ATCA shelves, and high-availability server backplanes. Each macro cell stores one step of the rail-up/rail-down sequence (typical systems need 6-12 rails), and the non-volatile flash configuration guarantees deterministic startup from cold-boot without external firmware load. The 1.8 V core plus 3.3 V-tolerant I/O banks allow direct interface to PMBus supervisors and MOSFET drivers. PG (power-good) feedback signals can be routed to the 980-element logic array to implement fault interlocks within ~10 ns response, faster than equivalent MCU firmware loops.
Recommended
Display Panel Timing Controller
In LCD, OLED, and e-ink display modules, the 5M1270ZF256I5N implements the panel timing controller (TCON) function - generating HSYNC/VSYNC/DE timing, gamma-correction lookup tables in UFM, and bidirectional LVDS-to-parallel conversion. The 201 MHz internal frequency comfortably drives 1080p60 panels at 148.5 MHz pixel clock while leaving headroom for OSD overlay logic. Industrial temperature grade (-40C to +100C) supports outdoor signage and automotive cluster applications. The 256-ball FBGA package's low-EMI ball grid also suits tightly-routed multi-lane display PCBs.
Recommended
Address Decoding and Memory Glue Logic
The 5M1270ZF256I5N is a textbook choice for address-decoding glue logic between microprocessors, ASICs, and memory banks in legacy and modern systems alike. A single 980-macro-cell device can decode a full 24-bit address space into 16-32 chip-select signals with sub-nanosecond propagation, replacing dozens of 74-series TTL gates. The non-volatile configuration makes the decoder table field-updatable via JTAG during board bring-up, allowing late-stage firmware changes without PCB rework. Industrial designers commonly pair this CPLD with Intel 80186, NXP MPC8xx, or modern ARM SoCs.
Recommended
Motor Control Interface and PWM Generation
The 5M1270ZF256I5N's deterministic timing and 212 I/O pins make it ideal for motor-control front-end logic: PWM generation up to 200 kHz, Hall-sensor decoding, quadrature-encoder counting, and BLDC commutation state machines. The 980 macro cells easily hold a 6-channel center-aligned PWM with dead-time insertion, and the 8 Kbit UFM stores calibration tables for back-EMF compensation. Multi-voltage I/O banks allow direct interface to 3.3 V gate drivers and 5 V Hall sensors from the same device. Industrial motor drives up to ~3 kW typically fit in this single CPLD without external logic.
Recommended
Telecom Line Card Glue Logic
In telecom line cards and ATCA/AMC modules, the 5M1270ZF256I5N handles rear-transition-module (RTM) interface bridging, EEPROM emulation, JTAG chain management, and shelf-management controller (ShMC) auxiliary logic. The 256-ball FBGA package's compact 17x17 mm footprint fits in space-constrained line-card faceplates, and the 1.8 V core plus 3.3 V I/O enables direct connection to legacy Zarlink/Microsemi telecom ASICs without level shifters. Industrial temperature grade and long-term Intel/Altera lifecycle support suit the 10-15 year deployment windows typical in carrier networks.
Recommended
Recommended Products Summary
Engineering reference data for 5M1270ZF256I5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5M1270ZF256C5N | 5M1270ZF256C4N | 5M1270ZF256A5N | 5M1270ZF256I5N |
|---|---|---|---|---|---|
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Package | 256-ball FBGA | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same |
| Macro Cells | 980 | 980 - same | 980 - same | 980 - same | 980 - same |
| Maximum Frequency | 201.1 MHz | 201.1 MHz | ~180 MHz (speed grade 4) | 201.1 MHz | 201.1 MHz |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Automotive (-40C to +125C) | Industrial (-40C to +100C) |
| Core Voltage (VCCINT) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| User I/O (max) | 212 | 212 | 212 | 212 | 212 |
| User Flash Memory | 8 Kbit | 8 Kbit | 8 Kbit | 8 Kbit | 8 Kbit |
| Price (qty 1, USD) | 11.50 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | 11.50 |
Key Differentiators
- Largest macro-cell density in the MAX V family (vs 5M570ZT144I5N)
- Non-volatile flash configuration with instant-on (vs Cyclone 10 LP FPGA)
- Deterministic pin-to-pin timing (vs Microcontroller-based glue logic)
Design Notes
The 5M1270ZF256I5N requires two supply rails: VCCINT at 1.8 V (core) and one or more VCCIO rails at 1.5-3.3 V for I/O banks. Decouple each rail with a 100 nF X7R ceramic capacitor placed within 3 mm of the corresponding BGA ball, plus a 10 uF bulk tantalum or ceramic capacitor near the device. The on-chip voltage regulator simplifies the board design but in-rush current at power-up can reach ~50 mA per bank; sequence VCCINT before VCCIO for predictable JTAG configuration behavior.
The 256-ball FBGA package has a 1.0 mm ball pitch. Use a 4- or 6-layer PCB with at least two inner ground planes for return-path continuity, and via-in-pad micro-vias for BGA breakout. Fanout the inner balls on a 0.5 mm via grid with dog-bone fan-out where cost dictates 4-layer stackup. Maintain 50 ohm single-ended impedance on high-speed clock and JTAG traces routed on the top layer over an unbroken ground plane.
Do not leave unused I/O pins floating - configure them in the Quartus pin-assignment file as outputs driving ground, or as inputs with weak pull-ups enabled, to avoid in-rush transients during configuration. The JTAG TDI/TDO chain must include proper 4.7 kohm pull-ups on TCK and TMS, and TCK should be buffered if driving more than three MAX V devices in series. Verify the JTAG chain IDCODE before attempting erase/program operations to avoid corrupting adjacent devices.
Compliance Information
RoHS compliant and lead-free per Intel MAX V family material declaration. Choose 5M1270ZF256A5N for AEC-Q100 automotive qualification - the I5N part itself is industrial-grade only.
