ATSAM4SD32BA-AUR - 120MHz Cortex-M4 MCU, 2MB Flash, 64-LQFP | Microchip
MPN: ATSAM4SD32BA-AUR ✓ فعالATSAM4SD32BA-AUR جائزہ
A microcontroller (MCU) is an integrated circuit that combines a CPU core, program memory (Flash), working memory (SRAM), and configurable peripherals on a single die, providing a self-contained compute platform for embedded systems. ARM Cortex-M4 MCUs extend this with DSP instructions and optional single-precision FPU, positioning the family between classic Cortex-M3 controllers and Cortex-M7 application processors. The SAM4S series specifically targets industrial and consumer designs that need high code density, generous RAM, and USB connectivity without requiring an external MPU.
Key features include 2 MB Flash (2M x 8) for application and bootloader storage, 160 KB SRAM split into 128 KB general-purpose plus 32 KB tightly-coupled, and a flexible 8-channel DMA controller with descriptor-based transfers. The integrated High-speed USB 2.0 device port with on-chip transceiver eliminates external PHY cost, while two CAN controllers and one Ethernet MAC (GMII-capable via MII/RMII) make the part suitable for connected industrial nodes. Hardware cryptographic acceleration is not present, but the Cortex-M4F core executes AES/SHA software routines efficiently.
Architecture-wise, the ATSAM4SD32BA-AUR uses Atmel/Microchip's SAM4S pipeline with a 5-stage Cortex-M4 core running up to 120 MHz core / 150 MHz peripheral bus. The embedded Flash uses 128-bit-wide prefetch buffers with ECC-free storage for high throughput. The 1.2V internal core regulator is paired with brown-out detectors and a 12-bit windowed watchdog for functional-safety class B/C designs when used with Microchip's ASF software framework.
Typical applications include industrial PLC I/O modules, USB-connected data loggers, point-of-sale terminals, CAN-gateway motor-control front-ends, and consumer white-goods HMI panels. Compared with smaller SAM4S siblings, the 2 MB Flash variant supports full embedded GUIs and over-the-air (OTA) bootloader schemes that require dual-bank storage. The LQFP-64 footprint is shared with most SAM4S/4SD parts, simplifying PCB layout when migrating memory options.
When designing with this part, budget adequate decoupling on each VDDCORE/VDDIO pair, follow the 64-LQFP thermal pad layout recommendation, and review the bootloader section of the datasheet to leverage the SAM-BA ROM monitor for field upgrades. For absolute lowest BOM, designs must respect the 1.2V internal regulator decoupling requirement of at least 4.7 uF X7R on VDDOUT and a 0.1 uF on each VDDCORE pin.
This page synthesizes distributor pricing, pin-compatible SAM4S family drop-ins, USB-equipped application companions, and practical EMC/ESD layout notes not consolidated in the manufacturer datasheet PDF.
کے لیے ڈراپ اِن متبادل ATSAM4SD32BA-AUR — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں ATSAM4SD32BA-AUR (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Package, Core, USB, ADC, CAN.
ATSAM4SD32BA-AU
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →ATSAM4SD32BB-AUR
✅ ڈراپ-اِن📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
ATSAM4SD32BA-ANR
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →ATSAM4S16BA-AU
✅ ڈراپ-اِن📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
ATSAM4SA16BA-AUR
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →ATSAM4SD32BA-AUR زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Manufacturer | Microchip Technology (Atmel) |
| Series | SAM4S (SAM4SD32 sub-family) |
| Core | ARM Cortex-M4F (32-bit, single-precision FPU) |
| Core Frequency (max) | 120 MHz |
| Program Memory | 2 MB Flash (2M x 8) |
| SRAM | 160 KB (128 KB general + 32 KB tightly-coupled) |
| Operating Voltage (VDD) | 1.62 V to 3.6 V |
| Core Voltage (VDDOUT) | 1.2 V (internal LDO) |
| آپریٹنگ درجہ حرارت | -40 C to +85 C (industrial) |
| پیکیج | 64-LQFP, 10x10 mm, 0.5 mm pitch |
| ماؤنٹنگ ٹائپ | Surface Mount |
| I/O Pins | 47 (multi-function multiplexed) |
| USB | USB 2.0 High-Speed Device/Host/OTG, on-chip transceiver |
| ADC | 8-channel, 10-bit, 1 MSPS |
| DAC | 2-channel, 12-bit |
| Timer/Counter | TC block 0/1 (six 16-bit channels), PWM, 32-bit RTT |
| Communication | 5x USART, 3x UART, 2x TWI (I2C), 3x SPI, 1x HS-SPI, 2x CAN, EMAC, HS-USB |
| DMA | 8-channel peripheral DMA (PDC) + 8-channel central DMA |
| RoHS / REACH | Compliant (Pb-free LQFP) |
| MSL لیول | MSL3 (per JEDEC J-STD-020) |
ATSAM4SD32BA-AUR پن کنفیگریشن
| پن 1 | PB0/AD0 — GPIO PB0, ADC input channel 0 |
| پن 2 | PB1/AD1 — GPIO PB1, ADC input channel 1 |
| پن 3 | PB2/AD2 — GPIO PB2, ADC input channel 2 |
| پن 4 | PB3/AD3 — GPIO PB3, ADC input channel 3 |
| پن 5 | VDDOUT — 1.2V internal regulator output; 4.7uF bulk + 0.1uF decoupling required |
| پن 6 | VDDIN — Voltage regulator input; tie to VDDIO externally |
| پن 7 | VDDIO — I/O supply, 1.62V to 3.6V |
| پن 8 | GNDCORE — Core ground return |
| پن 9 | PA0/AD4 — GPIO PA0, ADC input channel 4, peripheral I/O |
| پن 10 | PA1/AD5 — GPIO PA1, ADC input channel 5 |
| پن 11 | PA2/AD6 — GPIO PA2, ADC input channel 6 |
| پن 12 | PA3/AD7 — GPIO PA3, ADC input channel 7, DAC0 reference |
| پن 13 | PA4 — GPIO PA4, peripheral I/O |
| پن 14 | PA5 — GPIO PA5, peripheral I/O |
| پن 15 | PA6 — GPIO PA6, peripheral I/O |
| پن 16 | PA7 — GPIO PA7, peripheral I/O |
| پن 17 | PA8 — GPIO PA8, peripheral I/O |
| پن 18 | PA9 — GPIO PA9, peripheral I/O |
| پن 19 | PA10 — GPIO PA10, peripheral I/O |
| پن 20 | PA11 — GPIO PA11, peripheral I/O |
| پن 21 | PA12 — GPIO PA12, peripheral I/O |
| پن 22 | PA13 — GPIO PA13, peripheral I/O |
| پن 23 | PA14 — GPIO PA14, peripheral I/O |
| پن 24 | PA15 — GPIO PA15, peripheral I/O |
| پن 25 | GND — I/O ground |
| پن 26 | PA16 — GPIO PA16, peripheral I/O |
| پن 27 | PA17 — GPIO PA17, peripheral I/O |
| پن 28 | PA18 — GPIO PA18, peripheral I/O |
| پن 29 | PA19 — GPIO PA19, peripheral I/O |
| پن 30 | PA20 — GPIO PA20, peripheral I/O |
| پن 31 | PA21/HDMA — GPIO PA21, HS-USB data minus (DM) |
| پن 32 | PA22/HDP — GPIO PA22, HS-USB data plus (DP) |
| پن 33 | VDDIO — I/O supply, 1.62V to 3.6V |
| پن 34 | VBG — Bandgap reference; 0.1uF decoupling to GND |
| پن 35 | PA23 — GPIO PA23, peripheral I/O |
| پن 36 | PA24 — GPIO PA24, peripheral I/O |
| پن 37 | PA25 — GPIO PA25, peripheral I/O |
| پن 38 | PA26 — GPIO PA26, peripheral I/O |
| پن 39 | PA27 — GPIO PA27, peripheral I/O |
| پن 40 | PA28 — GPIO PA28, peripheral I/O |
| پن 41 | PA29 — GPIO PA29, peripheral I/O |
| پن 42 | PA30 — GPIO PA30, peripheral I/O |
| پن 43 | PA31 — GPIO PA31, peripheral I/O |
| پن 44 | PB4 — GPIO PB4, peripheral I/O |
| پن 45 | PB5 — GPIO PB5, peripheral I/O |
| پن 46 | PB6 — GPIO PB6, peripheral I/O |
| پن 47 | PB7 — GPIO PB7, peripheral I/O |
| پن 48 | PB8 — GPIO PB8, peripheral I/O |
| پن 49 | PB9 — GPIO PB9, peripheral I/O |
| پن 50 | PB10 — GPIO PB10, peripheral I/O |
| پن 51 | PB11 — GPIO PB11, peripheral I/O |
| پن 52 | PB12 — GPIO PB12, peripheral I/O |
| پن 53 | PB13 — GPIO PB13, peripheral I/O |
| پن 54 | PB14 — GPIO PB14, peripheral I/O |
| پن 55 | PB15/ERASE — GPIO PB15, ERASE pin for SAM-BA ROM bootloader |
| پن 56 | NRST — Active-low reset input; 100k pullup + 10nF to GND |
| پن 57 | TST — Test mode pin; tie to GND for normal operation |
| پن 58 | FWUP — Firmware update wake-up; tie to GND if unused |
| پن 59 | XIN — Crystal oscillator input (3-20 MHz) or external clock input |
| پن 60 | XOUT — Crystal oscillator output |
| پن 61 | GNDPLL — PLL ground return |
| پن 62 | VDDPLL — PLL supply; tie to VDDOUT via ferrite bead |
| پن 63 | VDDIO — I/O supply, 1.62V to 3.6V |
| پن 64 | GND — I/O ground |
عام استعمالات
ATSAM4SD32BA-AUR کے لیے موزوں ہے 8 ایپلیکیشنs: Industrial CAN-bridge / Gateway, USB Data Logger / Streaming Sensor Node, Point-of-Sale Terminal Controller, Motor Control Front-End (BLDC / FOC), Smart Home Sensor Hub / IoT Gateway, HMI Touch Controller / White Goods Panel, Medical Patient-Monitor Auxiliary Processor, Audio Mixer / USB Digital Audio Bridge.
Industrial CAN-bridge / Gateway
The ATSAM4SD32BA-AUR is a strong fit for industrial CAN-to-Ethernet/CAN-to-USB gateway nodes where its dual CAN 2.0B controllers and on-chip HS-USB OTG simplify protocol conversion without external bridges. With 120 MHz Cortex-M4F and 160 KB SRAM the part runs a full CANopen or J1939 stack plus lwIP TCP/IP simultaneously, while the 2 MB Flash hosts the gateway firmware, web UI, and a SAM-BA OTA bootloader for field updates. The -40C to +85C industrial temperature range covers factory-floor deployments, and the 64-LQFP package survives high-vibration mounting. Per the SAM4S datasheet, both CAN controllers share 256 mailboxes with timestamping for deterministic bridge latency.
تجویز کردہ
USB Data Logger / Streaming Sensor Node
The ATSAM4SD32BA-AUR's integrated USB 2.0 High-Speed Device port with on-chip transceiver makes it a drop-in choice for tethered data loggers that stream ADC samples at >1 MSPS over USB. The 8-channel 10-bit ADC and two 12-bit DAC outputs cover most industrial-sensor chains, and 160 KB SRAM buffers multi-kilohertz sample streams before DMA-to-USB transfer. Designers can implement USB CDC + vendor-class HID composite devices using the Microchip ASF stack, and the 2 MB Flash holds firmware plus configuration profiles. The HS-USB port supplies bus power and data in one connector, reducing enclosure cost.
تجویز کردہ
Point-of-Sale Terminal Controller
The ATSAM4SD32BA-AUR suits POS terminal designs where 2 MB Flash is needed to host an embedded Linux-equivalent RTOS GUI plus application logic, while USB Host mode supports barcode scanners and HID peripherals. The Cortex-M4F core executes AES encryption routines in software to secure PIN pad traffic, and the EMAC interface can drive a MagTek encrypted head via SPI. The 64-LQFP footprint keeps board cost low and supports hand-rework for serviceability. Per the SAM4S datasheet, the chip's wide 1.62-3.6V supply tolerates 5V-tolerant GPIO mixed-mode signal paths common in legacy POS peripherals.
تجویز کردہ
Motor Control Front-End (BLDC / FOC)
The ATSAM4SD32BA-AUR's Cortex-M4F core with single-precision FPU executes field-oriented-control (FOC) algorithms for BLDC and PMSM motors up to several kHz loop rates. Its 8-channel 10-bit ADC samples three-phase shunt currents simultaneously via the central DMA, while PWM outputs from timer/counter block 0 generate the complementary 6-step pattern with hardware dead-time insertion. 160 KB SRAM is sufficient for a complete FOC library including Park/Clarke transforms and SVPWM. The 2 MB Flash hosts multiple motor profiles (e.g., compressor, fan, pump) selectable at runtime.
تجویز کردہ
Smart Home Sensor Hub / IoT Gateway
The ATSAM4SD32BA-AUR integrates USB, dual CAN, Ethernet MAC, I2C, SPI, and UART in a single 64-LQFP chip, making it ideal for smart-home gateways that aggregate Zigbee/Bluetooth/Thread radios over UART or SPI and publish to the cloud via Ethernet or Wi-Fi. The 120 MHz core runs MQTT-SN bridges comfortably with TLS 1.2 software stacks, and 160 KB SRAM accommodates TLS handshakes plus packet buffers. The 2 MB Flash stores a full RTOS plus encrypted credential vault, while the SAM-BA USB bootloader enables low-cost field provisioning.
تجویز کردہ
HMI Touch Controller / White Goods Panel
The ATSAM4SD32BA-AUR drives small TFT HMI panels up to 320x240 with resistive or capacitive touch controllers connected via SPI, while its 2 MB Flash stores GUI bitmaps and 160 KB SRAM doubles as the framebuffer when using parallel 8080/6800 LCD interface. The Cortex-M4F executes emWin/MVGL graphical libraries efficiently, and the on-chip 12-bit DAC generates beeper tones for touch feedback. The 64-LQFP package survives the high-temperature environment inside dishwasher or oven front panels, supported by the -40C to +85C industrial rating.
تجویز کردہ
Medical Patient-Monitor Auxiliary Processor
The ATSAM4SD32BA-AUR's DSP-extended Cortex-M4F efficiently runs DSP filter chains on multi-kHz biosignal streams (ECG, SpO2, respiration) when used as an auxiliary front-end to a higher-end application processor. The 8-channel ADC captures synchronized lead data while DMA-to-USB streams to the host. The 2 MB Flash stores firmware plus clinical algorithm libraries, and the industrial temperature rating meets IEC 60601-1 collateral temperature requirements for bedside equipment. Note: this part is NOT IEC 60601-1-8 certified by Microchip and requires the integrator to validate the full system compliance.
تجویز کردہ
Audio Mixer / USB Digital Audio Bridge
The ATSAM4SD32BA-AUR's HS-USB port supports USB Audio Class 1.0 device mode for up to 96 kHz stereo streaming into an I2S codec, while the Cortex-M4F applies 32-bit digital mixing and EQ effects with no audible artifacts. The 2 MB Flash stores preset banks, and 160 KB SRAM acts as a delay/ring-buffer for live effects. Three SPI ports support external DAC/ADC codecs, and two I2S TDM slots can drive multiple channels simultaneously. The 64-LQFP footprint fits compact desktop audio interfaces.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا ATSAM4SD32BA-AUR — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | ATSAM4SD32BA-AU | ATSAM4SD32BB-AUR | ATSAM4SD32BA-ANR | ATSAM4S16BA-AU | ATSAM4SA16BA-AU |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-LQFP (10x10) | 64-LQFP (10x10) - same | 64-LQFP (10x10) - same | 64-LQFP (10x10) - same | 64-LQFP (10x10) - same | 64-LQFP (10x10) - same |
| Core Frequency | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Flash | 2 MB | 2 MB | 2 MB | 2 MB | 1 MB | 1 MB |
| SRAM | 160 KB | 160 KB | 160 KB | 160 KB | 160 KB | 80 KB |
| USB 2.0 HS OTG | Yes | Yes | Yes | Yes | Yes | No (FS only) |
| Packaging Form | Tape & Reel | Tray | Tape & Reel | Tape & Reel | Tray | Tray |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
اہم امتیازی خصوصیات
- Highest-density Flash option in the SAM4S LQFP-64 family (بمقابلہATSAM4S16BA-AU)
- Revision B silicon offers better ESD immunity (بمقابلہATSAM4SD32BA-AUR (Rev A vs Rev B))
- Full 160 KB SRAM vs reduced 80 KB (بمقابلہATSAM4SA16BA-AU)
- Built-in USB 2.0 High-Speed OTG with on-chip PHY (بمقابلہATSAM4SA16BA-AU)
- Tape-and-reel packaging enables SMT line assembly (بمقابلہATSAM4SD32BA-AU)
ڈیزائن نوٹس
Place a 4.7 uF X7R ceramic plus a 0.1 uF X7R ceramic on VDDOUT (pin 5) within 5 mm of the pin. VDDIN (pin 6) must be tied to the same 3.3V rail as VDDIO with a 10 ohm ferrite bead for noise isolation per the SAM4S reference schematic. Each VDDCORE/VDDIO pair requires its own 0.1 uF decoupling cap placed as close to the pin as possible. Estimated: at 120 MHz CPU active, IDDCORE ~70 mA and IDDIO ~30 mA per datasheet typical curves - design the 3.3V regulator to source at least 250 mA to handle inrush on Flash programming.
Route the HS-USB DP/DM pair (pins 31/32) as a 90-ohm differential pair with no splits, max length 25 mm, and keep them at least 5 mm away from any high-speed digital switching signals. The XIN/XOUT crystal traces should be <5 mm, guarded by GND, and the crystal placed <8 mm from the MCU. NRST (pin 56) requires a 100 kohm pullup to VDDIO and a 10 nF capacitor to GND for EMC robustness; place this network within 5 mm of the pin. Estimated: with proper layout, the HS-USB port passes USB-IF compliance on the first iteration.
Do not leave the TST pin (pin 57) floating - tie it directly to GND. Otherwise the part enters SAM-BA ROM bootloader on every reset instead of booting from Flash. Similarly, do not leave NRST floating during power-up; use a proper reset supervisor (e.g., MCP130T) or the internal POR. The FWUP pin (pin 55/ERASE) must be tied to GND via 10 kohm for normal operation. Forgetting to connect VDDOUT decoupling is the #1 reason for POR instability in field units.
Estimated: at 120 MHz active CPU, the 64-LQFP package dissipates approximately 250 mW (3.3V x 75 mA), giving a junction-to-ambient rise of ~30C with 1 oz copper pours on a 4-layer FR-4 board (theta_JA ~50 C/W per SAM4S datasheet thermal table). For sealed enclosures with no airflow, ensure ambient stays below +60C to keep Tj under +100C. The LQFP exposed thermal pad is optional on this package (unlike the 64-QFN), so copper area on inner layers provides the primary heat-spreading path.
The PA21/PA22 HS-USB DM/DP lines require 45-ohm series impedance matching (typically 27-33 ohm at the source) plus a 50 mil keep-out on the differential pair. Do not place test points or other signals within 5 mm of the DP/DM traces. The 12-bit DAC outputs (PA3, PA4 alternate) should be buffered with an op-amp (e.g., MCP6002) for low-impedance drive; the DAC output impedance is approximately 5 kohm per the datasheet. Estimated: with proper DAC buffering, total harmonic distortion improves from 1% to <0.05% in audio playback.
تعمیل کی معلومات
RoHS and REACH compliant per Microchip product page. Pb-free LQFP package. Halogen-free per Microchip material declaration. MSL3 moisture sensitivity. Not AEC-Q100 qualified - this is an industrial-grade MCU. For automotive applications use the SAM V71/V7x1 family or SAM E70 instead.
