ATSAM4SD32BA-AUR - 120MHz Cortex-M4 MCU, 2MB Flash, 64-LQFP | Microchip
MPN: ATSAM4SD32BA-AUR ✓ Hoạt độngATSAM4SD32BA-AUR Tóm tắt
A microcontroller (MCU) is an integrated circuit that combines a CPU core, program memory (Flash), working memory (SRAM), and configurable peripherals on a single die, providing a self-contained compute platform for embedded systems. ARM Cortex-M4 MCUs extend this with DSP instructions and optional single-precision FPU, positioning the family between classic Cortex-M3 controllers and Cortex-M7 application processors. The SAM4S series specifically targets industrial and consumer designs that need high code density, generous RAM, and USB connectivity without requiring an external MPU.
Key features include 2 MB Flash (2M x 8) for application and bootloader storage, 160 KB SRAM split into 128 KB general-purpose plus 32 KB tightly-coupled, and a flexible 8-channel DMA controller with descriptor-based transfers. The integrated High-speed USB 2.0 device port with on-chip transceiver eliminates external PHY cost, while two CAN controllers and one Ethernet MAC (GMII-capable via MII/RMII) make the part suitable for connected industrial nodes. Hardware cryptographic acceleration is not present, but the Cortex-M4F core executes AES/SHA software routines efficiently.
Architecture-wise, the ATSAM4SD32BA-AUR uses Atmel/Microchip's SAM4S pipeline with a 5-stage Cortex-M4 core running up to 120 MHz core / 150 MHz peripheral bus. The embedded Flash uses 128-bit-wide prefetch buffers with ECC-free storage for high throughput. The 1.2V internal core regulator is paired with brown-out detectors and a 12-bit windowed watchdog for functional-safety class B/C designs when used with Microchip's ASF software framework.
Typical applications include industrial PLC I/O modules, USB-connected data loggers, point-of-sale terminals, CAN-gateway motor-control front-ends, and consumer white-goods HMI panels. Compared with smaller SAM4S siblings, the 2 MB Flash variant supports full embedded GUIs and over-the-air (OTA) bootloader schemes that require dual-bank storage. The LQFP-64 footprint is shared with most SAM4S/4SD parts, simplifying PCB layout when migrating memory options.
When designing with this part, budget adequate decoupling on each VDDCORE/VDDIO pair, follow the 64-LQFP thermal pad layout recommendation, and review the bootloader section of the datasheet to leverage the SAM-BA ROM monitor for field upgrades. For absolute lowest BOM, designs must respect the 1.2V internal regulator decoupling requirement of at least 4.7 uF X7R on VDDOUT and a 0.1 uF on each VDDCORE pin.
This page synthesizes distributor pricing, pin-compatible SAM4S family drop-ins, USB-equipped application companions, and practical EMC/ESD layout notes not consolidated in the manufacturer datasheet PDF.
Bộ thay thế dễ dàng lắp đặt cho ATSAM4SD32BA-AUR — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với ATSAM4SD32BA-AUR (cùng hình factor và footprint) — khác nhau ở Package, Core, USB, ADC, CAN.
ATSAM4SD32BA-AU
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →ATSAM4SD32BB-AUR
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
ATSAM4SD32BA-ANR
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →ATSAM4S16BA-AU
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
ATSAM4SA16BA-AUR
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →ATSAM4SD32BA-AUR Tỷ lệ tối đa & tính chất điện
| Manufacturer | Microchip Technology (Atmel) |
| Series | SAM4S (SAM4SD32 sub-family) |
| Core | ARM Cortex-M4F (32-bit, single-precision FPU) |
| Core Frequency (max) | 120 MHz |
| Program Memory | 2 MB Flash (2M x 8) |
| SRAM | 160 KB (128 KB general + 32 KB tightly-coupled) |
| Operating Voltage (VDD) | 1.62 V to 3.6 V |
| Core Voltage (VDDOUT) | 1.2 V (internal LDO) |
| Nhiệt độ hoạt động | -40 C to +85 C (industrial) |
| Hộp | 64-LQFP, 10x10 mm, 0.5 mm pitch |
| Kiểu lắp đặt | Surface Mount |
| I/O Pins | 47 (multi-function multiplexed) |
| USB | USB 2.0 High-Speed Device/Host/OTG, on-chip transceiver |
| ADC | 8-channel, 10-bit, 1 MSPS |
| DAC | 2-channel, 12-bit |
| Timer/Counter | TC block 0/1 (six 16-bit channels), PWM, 32-bit RTT |
| Communication | 5x USART, 3x UART, 2x TWI (I2C), 3x SPI, 1x HS-SPI, 2x CAN, EMAC, HS-USB |
| DMA | 8-channel peripheral DMA (PDC) + 8-channel central DMA |
| RoHS / REACH | Compliant (Pb-free LQFP) |
| Cấp MSL | MSL3 (per JEDEC J-STD-020) |
Cấu hình chân ATSAM4SD32BA-AUR
| Chân 1 | PB0/AD0 — GPIO PB0, ADC input channel 0 |
| Chân 2 | PB1/AD1 — GPIO PB1, ADC input channel 1 |
| Chân 3 | PB2/AD2 — GPIO PB2, ADC input channel 2 |
| Chân 4 | PB3/AD3 — GPIO PB3, ADC input channel 3 |
| Chân 5 | VDDOUT — 1.2V internal regulator output; 4.7uF bulk + 0.1uF decoupling required |
| Chân 6 | VDDIN — Voltage regulator input; tie to VDDIO externally |
| Chân 7 | VDDIO — I/O supply, 1.62V to 3.6V |
| Chân 8 | GNDCORE — Core ground return |
| Chân 9 | PA0/AD4 — GPIO PA0, ADC input channel 4, peripheral I/O |
| Chân 10 | PA1/AD5 — GPIO PA1, ADC input channel 5 |
| Chân 11 | PA2/AD6 — GPIO PA2, ADC input channel 6 |
| Chân 12 | PA3/AD7 — GPIO PA3, ADC input channel 7, DAC0 reference |
| Chân 13 | PA4 — GPIO PA4, peripheral I/O |
| Chân 14 | PA5 — GPIO PA5, peripheral I/O |
| Chân 15 | PA6 — GPIO PA6, peripheral I/O |
| Chân 16 | PA7 — GPIO PA7, peripheral I/O |
| Chân 17 | PA8 — GPIO PA8, peripheral I/O |
| Chân 18 | PA9 — GPIO PA9, peripheral I/O |
| Chân 19 | PA10 — GPIO PA10, peripheral I/O |
| Chân 20 | PA11 — GPIO PA11, peripheral I/O |
| Chân 21 | PA12 — GPIO PA12, peripheral I/O |
| Chân 22 | PA13 — GPIO PA13, peripheral I/O |
| Chân 23 | PA14 — GPIO PA14, peripheral I/O |
| Chân 24 | PA15 — GPIO PA15, peripheral I/O |
| Chân 25 | GND — I/O ground |
| Chân 26 | PA16 — GPIO PA16, peripheral I/O |
| Chân 27 | PA17 — GPIO PA17, peripheral I/O |
| Chân 28 | PA18 — GPIO PA18, peripheral I/O |
| Chân 29 | PA19 — GPIO PA19, peripheral I/O |
| Chân 30 | PA20 — GPIO PA20, peripheral I/O |
| Chân 31 | PA21/HDMA — GPIO PA21, HS-USB data minus (DM) |
| Chân 32 | PA22/HDP — GPIO PA22, HS-USB data plus (DP) |
| Chân 33 | VDDIO — I/O supply, 1.62V to 3.6V |
| Chân 34 | VBG — Bandgap reference; 0.1uF decoupling to GND |
| Chân 35 | PA23 — GPIO PA23, peripheral I/O |
| Chân 36 | PA24 — GPIO PA24, peripheral I/O |
| Chân 37 | PA25 — GPIO PA25, peripheral I/O |
| Chân 38 | PA26 — GPIO PA26, peripheral I/O |
| Chân 39 | PA27 — GPIO PA27, peripheral I/O |
| Chân 40 | PA28 — GPIO PA28, peripheral I/O |
| Chân 41 | PA29 — GPIO PA29, peripheral I/O |
| Chân 42 | PA30 — GPIO PA30, peripheral I/O |
| Chân 43 | PA31 — GPIO PA31, peripheral I/O |
| Chân 44 | PB4 — GPIO PB4, peripheral I/O |
| Chân 45 | PB5 — GPIO PB5, peripheral I/O |
| Chân 46 | PB6 — GPIO PB6, peripheral I/O |
| Chân 47 | PB7 — GPIO PB7, peripheral I/O |
| Chân 48 | PB8 — GPIO PB8, peripheral I/O |
| Chân 49 | PB9 — GPIO PB9, peripheral I/O |
| Chân 50 | PB10 — GPIO PB10, peripheral I/O |
| Chân 51 | PB11 — GPIO PB11, peripheral I/O |
| Chân 52 | PB12 — GPIO PB12, peripheral I/O |
| Chân 53 | PB13 — GPIO PB13, peripheral I/O |
| Chân 54 | PB14 — GPIO PB14, peripheral I/O |
| Chân 55 | PB15/ERASE — GPIO PB15, ERASE pin for SAM-BA ROM bootloader |
| Chân 56 | NRST — Active-low reset input; 100k pullup + 10nF to GND |
| Chân 57 | TST — Test mode pin; tie to GND for normal operation |
| Chân 58 | FWUP — Firmware update wake-up; tie to GND if unused |
| Chân 59 | XIN — Crystal oscillator input (3-20 MHz) or external clock input |
| Chân 60 | XOUT — Crystal oscillator output |
| Chân 61 | GNDPLL — PLL ground return |
| Chân 62 | VDDPLL — PLL supply; tie to VDDOUT via ferrite bead |
| Chân 63 | VDDIO — I/O supply, 1.62V to 3.6V |
| Chân 64 | GND — I/O ground |
Ứng dụng tiêu biểu
ATSAM4SD32BA-AUR phù hợp cho 8 Áp dụngs: Industrial CAN-bridge / Gateway, USB Data Logger / Streaming Sensor Node, Point-of-Sale Terminal Controller, Motor Control Front-End (BLDC / FOC), Smart Home Sensor Hub / IoT Gateway, HMI Touch Controller / White Goods Panel, Medical Patient-Monitor Auxiliary Processor, Audio Mixer / USB Digital Audio Bridge.
Industrial CAN-bridge / Gateway
The ATSAM4SD32BA-AUR is a strong fit for industrial CAN-to-Ethernet/CAN-to-USB gateway nodes where its dual CAN 2.0B controllers and on-chip HS-USB OTG simplify protocol conversion without external bridges. With 120 MHz Cortex-M4F and 160 KB SRAM the part runs a full CANopen or J1939 stack plus lwIP TCP/IP simultaneously, while the 2 MB Flash hosts the gateway firmware, web UI, and a SAM-BA OTA bootloader for field updates. The -40C to +85C industrial temperature range covers factory-floor deployments, and the 64-LQFP package survives high-vibration mounting. Per the SAM4S datasheet, both CAN controllers share 256 mailboxes with timestamping for deterministic bridge latency.
Được đề xuất
USB Data Logger / Streaming Sensor Node
The ATSAM4SD32BA-AUR's integrated USB 2.0 High-Speed Device port with on-chip transceiver makes it a drop-in choice for tethered data loggers that stream ADC samples at >1 MSPS over USB. The 8-channel 10-bit ADC and two 12-bit DAC outputs cover most industrial-sensor chains, and 160 KB SRAM buffers multi-kilohertz sample streams before DMA-to-USB transfer. Designers can implement USB CDC + vendor-class HID composite devices using the Microchip ASF stack, and the 2 MB Flash holds firmware plus configuration profiles. The HS-USB port supplies bus power and data in one connector, reducing enclosure cost.
Được đề xuất
Point-of-Sale Terminal Controller
The ATSAM4SD32BA-AUR suits POS terminal designs where 2 MB Flash is needed to host an embedded Linux-equivalent RTOS GUI plus application logic, while USB Host mode supports barcode scanners and HID peripherals. The Cortex-M4F core executes AES encryption routines in software to secure PIN pad traffic, and the EMAC interface can drive a MagTek encrypted head via SPI. The 64-LQFP footprint keeps board cost low and supports hand-rework for serviceability. Per the SAM4S datasheet, the chip's wide 1.62-3.6V supply tolerates 5V-tolerant GPIO mixed-mode signal paths common in legacy POS peripherals.
Được đề xuất
Motor Control Front-End (BLDC / FOC)
The ATSAM4SD32BA-AUR's Cortex-M4F core with single-precision FPU executes field-oriented-control (FOC) algorithms for BLDC and PMSM motors up to several kHz loop rates. Its 8-channel 10-bit ADC samples three-phase shunt currents simultaneously via the central DMA, while PWM outputs from timer/counter block 0 generate the complementary 6-step pattern with hardware dead-time insertion. 160 KB SRAM is sufficient for a complete FOC library including Park/Clarke transforms and SVPWM. The 2 MB Flash hosts multiple motor profiles (e.g., compressor, fan, pump) selectable at runtime.
Được đề xuất
Smart Home Sensor Hub / IoT Gateway
The ATSAM4SD32BA-AUR integrates USB, dual CAN, Ethernet MAC, I2C, SPI, and UART in a single 64-LQFP chip, making it ideal for smart-home gateways that aggregate Zigbee/Bluetooth/Thread radios over UART or SPI and publish to the cloud via Ethernet or Wi-Fi. The 120 MHz core runs MQTT-SN bridges comfortably with TLS 1.2 software stacks, and 160 KB SRAM accommodates TLS handshakes plus packet buffers. The 2 MB Flash stores a full RTOS plus encrypted credential vault, while the SAM-BA USB bootloader enables low-cost field provisioning.
Được đề xuất
HMI Touch Controller / White Goods Panel
The ATSAM4SD32BA-AUR drives small TFT HMI panels up to 320x240 with resistive or capacitive touch controllers connected via SPI, while its 2 MB Flash stores GUI bitmaps and 160 KB SRAM doubles as the framebuffer when using parallel 8080/6800 LCD interface. The Cortex-M4F executes emWin/MVGL graphical libraries efficiently, and the on-chip 12-bit DAC generates beeper tones for touch feedback. The 64-LQFP package survives the high-temperature environment inside dishwasher or oven front panels, supported by the -40C to +85C industrial rating.
Được đề xuất
Medical Patient-Monitor Auxiliary Processor
The ATSAM4SD32BA-AUR's DSP-extended Cortex-M4F efficiently runs DSP filter chains on multi-kHz biosignal streams (ECG, SpO2, respiration) when used as an auxiliary front-end to a higher-end application processor. The 8-channel ADC captures synchronized lead data while DMA-to-USB streams to the host. The 2 MB Flash stores firmware plus clinical algorithm libraries, and the industrial temperature rating meets IEC 60601-1 collateral temperature requirements for bedside equipment. Note: this part is NOT IEC 60601-1-8 certified by Microchip and requires the integrator to validate the full system compliance.
Được đề xuất
Audio Mixer / USB Digital Audio Bridge
The ATSAM4SD32BA-AUR's HS-USB port supports USB Audio Class 1.0 device mode for up to 96 kHz stereo streaming into an I2S codec, while the Cortex-M4F applies 32-bit digital mixing and EQ effects with no audible artifacts. The 2 MB Flash stores preset banks, and 160 KB SRAM acts as a delay/ring-buffer for live effects. Three SPI ports support external DAC/ADC codecs, and two I2S TDM slots can drive multiple channels simultaneously. The 64-LQFP footprint fits compact desktop audio interfaces.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho ATSAM4SD32BA-AUR — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | ATSAM4SD32BA-AU | ATSAM4SD32BB-AUR | ATSAM4SD32BA-ANR | ATSAM4S16BA-AU | ATSAM4SA16BA-AU |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-LQFP (10x10) | 64-LQFP (10x10) - same | 64-LQFP (10x10) - same | 64-LQFP (10x10) - same | 64-LQFP (10x10) - same | 64-LQFP (10x10) - same |
| Core Frequency | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Flash | 2 MB | 2 MB | 2 MB | 2 MB | 1 MB | 1 MB |
| SRAM | 160 KB | 160 KB | 160 KB | 160 KB | 160 KB | 80 KB |
| USB 2.0 HS OTG | Yes | Yes | Yes | Yes | Yes | No (FS only) |
| Packaging Form | Tape & Reel | Tray | Tape & Reel | Tape & Reel | Tray | Tray |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Bảo phân biệt quan trọng
- Highest-density Flash option in the SAM4S LQFP-64 family (vsATSAM4S16BA-AU)
- Revision B silicon offers better ESD immunity (vsATSAM4SD32BA-AUR (Rev A vs Rev B))
- Full 160 KB SRAM vs reduced 80 KB (vsATSAM4SA16BA-AU)
- Built-in USB 2.0 High-Speed OTG with on-chip PHY (vsATSAM4SA16BA-AU)
- Tape-and-reel packaging enables SMT line assembly (vsATSAM4SD32BA-AU)
Ghi chú thiết kế
Place a 4.7 uF X7R ceramic plus a 0.1 uF X7R ceramic on VDDOUT (pin 5) within 5 mm of the pin. VDDIN (pin 6) must be tied to the same 3.3V rail as VDDIO with a 10 ohm ferrite bead for noise isolation per the SAM4S reference schematic. Each VDDCORE/VDDIO pair requires its own 0.1 uF decoupling cap placed as close to the pin as possible. Estimated: at 120 MHz CPU active, IDDCORE ~70 mA and IDDIO ~30 mA per datasheet typical curves - design the 3.3V regulator to source at least 250 mA to handle inrush on Flash programming.
Route the HS-USB DP/DM pair (pins 31/32) as a 90-ohm differential pair with no splits, max length 25 mm, and keep them at least 5 mm away from any high-speed digital switching signals. The XIN/XOUT crystal traces should be <5 mm, guarded by GND, and the crystal placed <8 mm from the MCU. NRST (pin 56) requires a 100 kohm pullup to VDDIO and a 10 nF capacitor to GND for EMC robustness; place this network within 5 mm of the pin. Estimated: with proper layout, the HS-USB port passes USB-IF compliance on the first iteration.
Do not leave the TST pin (pin 57) floating - tie it directly to GND. Otherwise the part enters SAM-BA ROM bootloader on every reset instead of booting from Flash. Similarly, do not leave NRST floating during power-up; use a proper reset supervisor (e.g., MCP130T) or the internal POR. The FWUP pin (pin 55/ERASE) must be tied to GND via 10 kohm for normal operation. Forgetting to connect VDDOUT decoupling is the #1 reason for POR instability in field units.
Estimated: at 120 MHz active CPU, the 64-LQFP package dissipates approximately 250 mW (3.3V x 75 mA), giving a junction-to-ambient rise of ~30C with 1 oz copper pours on a 4-layer FR-4 board (theta_JA ~50 C/W per SAM4S datasheet thermal table). For sealed enclosures with no airflow, ensure ambient stays below +60C to keep Tj under +100C. The LQFP exposed thermal pad is optional on this package (unlike the 64-QFN), so copper area on inner layers provides the primary heat-spreading path.
The PA21/PA22 HS-USB DM/DP lines require 45-ohm series impedance matching (typically 27-33 ohm at the source) plus a 50 mil keep-out on the differential pair. Do not place test points or other signals within 5 mm of the DP/DM traces. The 12-bit DAC outputs (PA3, PA4 alternate) should be buffered with an op-amp (e.g., MCP6002) for low-impedance drive; the DAC output impedance is approximately 5 kohm per the datasheet. Estimated: with proper DAC buffering, total harmonic distortion improves from 1% to <0.05% in audio playback.
Thông tin tuân thủ
RoHS and REACH compliant per Microchip product page. Pb-free LQFP package. Halogen-free per Microchip material declaration. MSL3 moisture sensitivity. Not AEC-Q100 qualified - this is an industrial-grade MCU. For automotive applications use the SAM V71/V7x1 family or SAM E70 instead.
