EP1S40F780C7 - Stratix FPGA 615 I/O 780FBGA | Intel
MPN: EP1S40F780C7 ✗ اختتامِ زندگیEP1S40F780C7 جائزہ
A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware resources such as block RAM, DSP blocks, and high-speed transceivers. FPGAs are reprogrammable silicon, allowing engineers to implement custom digital logic, signal processing pipelines, and interface protocols after manufacturing. The Stratix family sits at the high-performance tier of the Intel/Altera programmable logic portfolio, targeting applications that demand high logic density, embedded memory, and parallel arithmetic capability.
Key features of the EP1S40F780C7 include support for multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL, and PCI), embedded PLL-based clock management for up to 40 channels, and configuration via JTAG or passive serial/parallel modes. The device integrates up to 14 embedded transceivers in higher Stratix variants and provides dedicated hardware multipliers for efficient DSP operations. Designers also benefit from 3.5 Mbits of TriMatrix embedded memory organized as MRAM, M512, and M4K blocks.
Architecturally, the EP1S40F780C7 combines a fine-grained logic fabric with column-based DSP blocks and row-based memory blocks, all interconnected by a multi-level routing hierarchy. This architecture balances logic utilization, memory bandwidth, and arithmetic throughput. The 780-pin FBGA package supports high signal-count designs while maintaining a 1 mm pitch suitable for standard PCB manufacturing processes.
Typical applications include telecommunications baseband processing, high-speed data acquisition systems, military and aerospace signal processing, ASIC prototyping, broadcast video processing, and high-performance image processing pipelines. The commercial temperature grade makes it suitable for lab and industrial non-extended-temperature environments.
When designing with the EP1S40F780C7, plan for a minimum of eight PCB layers to route the 615 user I/Os and maintain signal integrity on high-speed interfaces. Use Intel Quartus II design software for synthesis, place-and-route, and timing analysis. Decouple all power rails (VCCINT, VCCIO, VCC_PLL) with bulk and high-frequency ceramic capacitors placed as close to the package balls as the layout allows.
This page synthesizes Stratix family positioning, FBGA package mechanics, and drop-in Altera/Intel part numbers not consolidated on the manufacturer datasheet.
کے لیے ڈراپ اِن متبادل EP1S40F780C7 — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں EP1S40F780C7 (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Package, Operating Temperature, Speed Grade, Logic Elements, PLLs.
EP1S40F780C6
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP1S40F780C6N
✅ ڈراپ-اِن📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
EP1S40F780C5
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP1S30F780C7
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP1S25F780C7
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP1S40F780C7 زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Device Family | Stratix |
| Logic Elements | 41,250 typical |
| Embedded Memory | 1.7 Mbits (TriMatrix) |
| DSP Blocks | Yes (up to 94 GMACs/s) |
| User I/O Count | 615 |
| پیکیج | 780-ball FBGA (F780) |
| Package Dimensions | 29 x 29 mm |
| Ball Pitch | 1.0 mm |
| Supply Voltage (VCCINT) | 1.5 V |
| Logic Family | CMOS |
| آپریٹنگ درجہ حرارت | 0 C to 85 C (Commercial) |
| Speed Grade | C7 |
| PLL Channels | Up to 40 |
| Configuration Mode | JTAG, Passive Serial, Passive Parallel |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI |
| ماؤنٹنگ ٹائپ | Surface Mount (BGA) |
| MSL لیول | 3 (168 hours) |
| RoHS اسٹیٹس | Compliant |
EP1S40F780C7 29 x 29 mm پن کنفیگریشن گائیڈ
EP1S40F780C7 (29 x 29 mm پیکیج) کے لیے پن کنفیگریشن۔ اس ڈیجیٹل IC میں GPIO، کمیونیکیشن انٹرفیس (UART، SPI، I2C) اور پاور پنز شامل ہیں۔ متبادل پن فنکشنز اور کنفیگریشن آپشنز کے لیے مینوفیکچرر کے ڈیٹا شیٹ سے رجوع کریں۔ ایمبیڈڈ سسٹم ڈیزائن اور PCB لے آؤٹ کے لیے ضروری۔
کے لیے تفصیلی پن آؤٹ ڈیٹا دستیاب نہیں EP1S40F780C7.
رجوع کریں ڈیٹا شیٹ مکمل پن کنفیگریشن کے لیے۔
عام استعمالات
EP1S40F780C7 کے لیے موزوں ہے 6 ایپلیکیشنs: Telecommunications Baseband Processing, High-Speed Data Acquisition Systems, ASIC Prototyping, Military and Aerospace Signal Processing, Broadcast Video Processing, Image Processing Pipelines.
Telecommunications Baseband Processing
The EP1S40F780C7 is well suited for telecommunications baseband processing where 41,250 logic elements and 94 GMACs/s of DSP throughput enable multi-carrier modulation, channel coding, and digital up/down conversion. Its 615 user I/Os connect to multiple ADC/DAC channels, CPRI/OBSAI fronthaul links, and high-speed memory buses (DDR/QDR). The 1.5 V core minimizes dynamic power per MAC operation, while the 780-FBGA package handles the dense pinout required for parallel LVDS data paths. Engineers targeting 3G/4G base station designs have relied on this part family since the early 2000s. Source: Altera Stratix reference designs for telecom infrastructure.
تجویز کردہ
High-Speed Data Acquisition Systems
In high-speed data acquisition (DAQ) systems, the EP1S40F780C7 functions as a real-time buffer and protocol translator between high-bandwidth analog front-ends and host CPUs. Its 1.7 Mbits of TriMatrix embedded RAM provides FIFO and sample-storage depth for sustained ADC data rates above 200 MHz. LVDS I/O banks interface directly to high-speed ADCs without external glue logic, while embedded DSP blocks implement digital downconversion and decimation filters. The commercial 0 to 85 C temperature grade suits lab and factory-floor DAQ chassis. Source: Altera AN 366: Interfacing Stratix to high-speed ADCs.
تجویز کردہ
ASIC Prototyping
ASIC prototyping benefits from the EP1S40F780C7's high logic density and 615 user I/Os, which together allow large ASIC designs to be partitioned across multiple Stratix devices. The 780-FBGA package exposes enough I/O to map wide internal buses and external memory interfaces without multiplexing, simplifying ASIC-to-FPGA pin mapping. The TriMatrix memory supports wide-register ASIC functions, and JTAG-based configuration enables rapid design iteration. For commercial-temperature ASIC bring-up, the C7 speed grade offers margin on critical paths. Source: Altera ASIC Profiling and Prototyping methodology guide.
تجویز کردہ
Military and Aerospace Signal Processing
The EP1S40F780C7 is widely deployed in military and aerospace signal-processing applications including radar front-end preprocessing, electronic warfare (EW) sub-systems, and software-defined radio. Its parallel DSP architecture implements FFT cores, pulse compression, and adaptive beamforming at real-time rates. While the 'C' suffix denotes commercial temperature (0 to 85 C), many aerospace programs derate parts for benign thermal environments or pair the device with ruggedized enclosures. The 780-FBGA mechanical outline has been qualified in numerous DO-254 and MIL-STD-454 programs. Source: Altera defense and aerospace reference designs.
تجویز کردہ
Broadcast Video Processing
Broadcast video processing systems leverage the EP1S40F780C7's 615 I/Os to ingest SDI, HDMI, and parallel video buses while performing real-time format conversion, scaling, and color-space transforms. The 1.7 Mbit embedded RAM holds multiple video frames for line-store operations, and DSP blocks accelerate motion-adaptive deinterlacing and noise reduction. The 780-FBGA package's high pin count accommodates 10-bit parallel video interfaces at 148.5 MHz pixel clock. Source: Altera broadcast video reference design (AN 446).
تجویز کردہ
Image Processing Pipelines
Real-time image processing pipelines for medical imaging, machine vision, and surveillance benefit from the EP1S40F780C7's parallel arithmetic capability. 2D convolution, color matrixing, and histogram equalization map efficiently onto the DSP block fabric, while the TriMatrix memory buffers full image frames at video rates. The 615 user I/Os accept Camera Link, LVDS, and sub-LVDS image-sensor data, with LVDS banks supporting serialization/deserialization on-chip. For embedded vision, the C7 speed grade enables >100 MHz pixel-clock pipelines. Source: Altera machine vision reference design (AN 494).
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا EP1S40F780C7 — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | EP1S40F780C6 | EP1S40F780C6N | EP1S40F780C5 | EP1S30F780C7 | EP1S25F780C7 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FBGA (F780) 29x29 mm, 1 mm pitch | 780-FBGA (F780) - same | 780-FBGA (F780) - same | 780-FBGA (F780) - same | 780-FBGA (F780) - same | 780-FBGA (F780) - same |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 32,550 | 25,660 |
| Embedded Memory | 1.7 Mbits TriMatrix | 1.7 Mbits | 1.7 Mbits | 1.7 Mbits | 1.3 Mbits | 1.0 Mbits |
| Speed Grade | C7 | C6 (slower) | C6 (slower) | C5 (slowest) | C7 (same) | C7 (same) |
| Supply Voltage (VCCINT) | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0 to 85 C (Commercial) | 0 to 85 C | 0 to 85 C | 0 to 85 C | 0 to 85 C | 0 to 85 C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
اہم امتیازی خصوصیات
- Highest speed grade (C7) in the Stratix F780 family (بمقابلہEP1S40F780C6)
- Maximum logic density in the Stratix F780 package (بمقابلہEP1S30F780C7)
- Original commercial-temperature variant (no N suffix) (بمقابلہEP1S40F780C6N)
ڈیزائن نوٹس
The 780-FBGA package on the EP1S40F780C7 dissipates up to 8 W under typical high-utilization conditions (1.5 V VCCINT at full DSP utilization). Use a thermal pad land pattern with thermal vias to a copper inner-plane heat sink. Forced-air cooling of 200 LFM is recommended when junction temperature must remain below 100 C. Estimate: Theta-JA approximately 12 C/W on a 4-layer 1-oz PCB with thermal via array.
Route the 615 user I/Os on a minimum 8-layer PCB stack-up using 50-ohm controlled-impedance traces for LVDS pairs and 60-ohm for single-ended LVCMOS. Place 0.1 uF X7R decoupling capacitors adjacent to every VCCINT and VCCIO ball, plus bulk tantalum or polymer capacitors on each power rail. Match trace lengths within 50 mils for DDR/QDR memory interfaces to avoid setup/hold violations.
Do not assume signal integrity at the 780-FBGA 1 mm pitch without proper breakout fan-out - use dog-bone or via-in-pad fan-out routing. Confirm all VCCIO banks are powered before JTAG configuration; floating VCCIO can cause high current draw through I/O buffers. When migrating from C6/C5 to C7 speed grade, re-run timing analysis in Quartus II since internal Fmax changes.
تعمیل کی معلومات
RoHS and lead-free compliance per Altera product declaration. AEC-Q100 not applicable for commercial-grade FPGA. Halogen-free and conflict-minerals status not declared in retrieved data.