EP1S30F780C7 - Stratix 32K LE FPGA, 780-FBGA | Altera / Intel
MPN: EP1S30F780C7 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $195 | $195.00 |
| 10 | $178 | $1,780.00 |
| 100 | $162 | $16,200.00 |
| 500 | $148 | $74,000.00 |
| 1,000 | $135 | $135,000.00 |
Drop-in alternatives for EP1S30F780C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S30F780C6N
✅ Drop-In✓ In Stock
$185 / Unit
View Datasheet →EP1S30F780C6GA
✅ Drop-In✓ In Stock
$1100 / Unit
View Datasheet →EP1S30F780C6
✅ Drop-In✓ In Stock
$1125 / Unit
View Datasheet →EP1S25F780C7
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP1S25F780I6
✅ Drop-In✓ In Stock
$162 / Unit
View Datasheet →EP1S30F780C7 Maximum Ratings & Electrical Characteristics
| Series | Stratix |
| Family | Stratix (EP1S) |
| Logic Elements (LE) | 32,470 |
| Total RAM Bits | 3,317,184 bits |
| Number of LABs | 3,247 |
| User I/O Count | 597 |
| Number of I/O Banks | 8 |
| Number of DLL/PLLs | 8 / 2 |
| Supply Voltage (Core) | 1.5 V |
| Supply Voltage (I/O) | Multiple banks, 1.5V-3.3V standards |
| Package Type | 780-BBGA, FCBGA (29 x 29 mm, 1 mm pitch) |
| Process Technology | 0.13 µm CMOS |
| Operating Temperature | 0 °C to +85 °C (Commercial) |
| Mounting Type | Surface Mount (BGA) |
EP1S30F780C7 780-bbga, fcbga (29 x 29 mm, 1 mm pitch) Pin Configuration Guide
Complete pinout information for EP1S30F780C7 (780-bbga, fcbga (29 x 29 mm, 1 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S30F780C7.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S30F780C7 is suitable for 6 applications: Wired Telecom Baseband Processing, Wireless Base Station PHY Layer, High-Speed Serial Interface Bridging, Video and Imaging Pipelines, ASIC Prototyping and Emulation, Industrial Control and Test Instrumentation.
Wired Telecom Baseband Processing
The EP1S30F780C7 is well suited to wired telecom baseband and channel-card designs, where the 32,470 logic elements, 224 dedicated 18x18 multipliers, and 3.3 Mbit of TriMatrix memory handle multi-carrier DSP and forward-error-correction pipelines. The 12 integrated Rocket I/O transceivers reach 3.125 Gbps, supporting OC-48, STM-16, and XAUI backplanes without external PHY chips. Designers route the FPGA between a TDM framer and a network processor, exploiting the on-chip EMIF to attach DDR SDRAM or QDR II SRAM for cell buffering.
Recommended
Wireless Base Station PHY Layer
In wireless base stations the EP1S30F780C7 implements WCDMA, WiMAX, and LTE PHY functions by combining its DSP blocks for FFT / Viterbi with on-chip memory for soft-decision buffering. The 597 user I/Os allow connection to multiple analog front ends, while the LVDS-capable banks handle high-resolution ADC/DAC interfaces at hundreds of MSPS. Reference designs from Altera demonstrate complete transmit/receive chains on this device family.
Recommended
High-Speed Serial Interface Bridging
The 12 Rocket I/O channels make the EP1S30F780C7 a flexible bridge for connecting cards that mix Fibre Channel, XAUI, Serial RapidIO, or PCI Express physical layers to legacy parallel backplanes. Designers can multiplex, de-multiplex, or protocol-convert between standards in a single chip, eliminating external bridges. The FPGA fabric provides the framing logic, while the transceivers handle line-coding and clock-data recovery.
Recommended
Video and Imaging Pipelines
Video broadcast, surveillance, and medical imaging systems exploit the EP1S30F780C7's high I/O count to ingest parallel LVDS data from camera sensors, perform color-space conversion, scaling, and overlays in fabric, and drive DVI/HDMI or SDI outputs. With 597 I/Os and abundant RAM blocks, the device buffers full-HD frames in real time. Reference designs from Altera support SD-SDI, HD-SDI, and DVI/HDMI serialization directly from this FPGA family.
Recommended
ASIC Prototyping and Emulation
Design teams use the EP1S30F780C7 as an ASIC prototype for mid-complexity ASICs targeting DSP and networking workloads. The 32K-LE fabric plus 597 I/Os emulate most ASIC cores in a single device, while embedded debug cores (SignalTap) provide real-time visibility. Compared to ASIC respins, prototype iteration cycles drop from weeks to hours, making this FPGA family a long-standing platform for early software bring-up.
Recommended
Industrial Control and Test Instrumentation
The commercial-grade EP1S30F780C7 fits cost-sensitive industrial test instruments and motion controllers, where its parallel I/O, soft processor cores (Nios II), and dedicated multipliers handle DSP, quadrature decoding, and communication bridges. Designers use the 597 I/Os to drive displays, motor controllers, and external ADCs. For harsher environments, the same design can be ported to the industrial-rated EP1S30F780I6, keeping the same 780-FBGA footprint.
Recommended
Recommended Products Summary
Engineering reference data for EP1S30F780C7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S30F780C6N | EP1S30F780C6GA | EP1S30F780C6 | EP1S30B956C6 | EP1S25F780C7 | EP1S25F780I6 |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 780-FBGA (29x29 mm, 1 mm pitch) | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 956-BGA - different | 780-FBGA - same | 780-FBGA - same |
| Logic Elements | 32,470 | 32,470 | 32,470 | 32,470 | 32,470 | 24,060 (-26%) | 24,060 (-26%) |
| User I/O Count | 597 | 597 | 597 | 597 | 683 | 597 | 597 |
| Speed Grade | C7 (commercial, slower) | C6 (faster) | C6 (faster) | C6 (faster) | C6 (faster) | C7 (same) | I6 (industrial, slower) |
| Operating Temperature | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | -40 °C to +100 °C |
| Embedded RAM Bits | 3,317,184 bits | 3,317,184 bits | 3,317,184 bits | 3,317,184 bits | 3,317,184 bits | 2,382,336 bits (-28%) | 2,382,336 bits (-28%) |
| Rocket I/O Channels | 12 | 12 | 12 | 12 | 20 | 12 | 12 |
Key Differentiators
- 32,470 LE is the highest density Stratix I in 780-BGA (vs EP1S25F780C7)
- Same die, faster speed grade (vs EP1S30F780C6)
- Industrial temperature drop-in (vs EP1S30F780I6)
Design Notes
Stratix EP1S30 power is dominated by the 12 Rocket I/O transceivers and the 1.5 V core. Estimated: at 50% toggle rate and 8 active transceivers, total device dissipation can reach 8-10 W. Use the Stratix Power Estimator spreadsheet for your design; decoupling should include bulk 220 µF tantalum plus 0.1 µF / 0.01 µF ceramics near every VCC pin. Sequence 1.5 V core before 2.5 V PLL supply before 3.3 V I/O to avoid latch-up.
The 780-FBGA uses 1.0 mm pitch and requires an 8-12 layer PCB stack-up with microvia or via-in-pad technology for signal escape. Matched-length routing for the Rocket I/O serializer / deserializer pairs must hold within 0.15 mm (≈5 ps) of the target differential pair length, and characteristic impedance must be 100 Ω differential for the MGT lanes. Route all clock trees on inner layers and surround them with continuous ground pour.
Do not leave configuration-mode pins floating: tie MSEL pins to the correct logic level for the chosen configuration mode (AS, PS, JTAG). Use an external configuration PROM such as EPCS16 or EPC16 because the device's SRAM is volatile; a missing config device results in a non-booting board. Estimated: configuration bitstream for 32 K LE is typically ~7 Mbit, so the EPCS16 (16 Mbit) is the minimum safe choice.
Estimated: at 10 W dissipation on a 4-layer FR-4 board with the 780-FBGA, junction-to-ambient thermal resistance (θJA) is approximately 14 °C/W (per JEDEC JESD51), yielding ΔT of 140 °C above ambient. Use a thermal pad with 8 thermal vias underneath the exposed pad and consider an internal heat-spreader copper plane on top side. For sealed enclosures, derate by 25 % or specify the industrial I6 variant.
Compliance Information
Original EP1S30F780C7 release pre-dated universal RoHS adoption; Pb-free variants (N suffix) exist within the family. REACH and halogen status not explicitly stated in the verified web data and should be confirmed via lot / date code. AEC-Q100 not applicable to FPGAs in this family.
