EP20K200CF484C9 - APEX 20KC FPGA, 200K Gates, 484-FBGA | Altera
MPN: EP20K200CF484C9 ✗ اختتامِ زندگیEP20K200CF484C9 جائزہ
An FPGA (Field-Programmable Gate Array) is a programmable logic device that sits in the broader semiconductor hierarchy as: programmable logic -> logic IC -> integrated circuit. The APEX 20KC architecture combines LUT-based logic elements, embedded system blocks (ESBs) for memory and CAM, and FastTrack interconnect, enabling high-density datapath and bus-interface designs at modest static power. Compared with earlier APEX 20K devices, the 'C' (2.5 V) I/O ring and 0.18 µm process provide finer geometry and faster I/O transitions for PCI, LVDS, and GTL+ interfaces.
Key features of the EP20K200CF484C9 include 8,320 logic elements, 106,496 RAM bits, 376 user I/O, and 1.8 V core operation. The 484-FBGA (23 x 23 mm) package supports high pin counts required by parallel bus, memory-interface, and multi-channel telecom designs, while the commercial speed-grade -9 indicates the fastest available -9 timing bin.
Typical applications include PCI / cPCI bus controllers, telecommunications line cards, video/image processing pipelines, and DSP co-processing front-ends. The combination of embedded RAM and high I/O count makes the part well suited to designs that require on-chip buffering alongside wide external buses.
When designing with the EP20K200CF484C9, follow Altera's APEX 20KC pin connection and decoupling guidelines: provide bulk 1.8 V and 2.5 V planes, place decoupling capacitors close to every VCCINT/VCCIO ball pair, and use the Altera Quartus II (or legacy MAX+PLUS II) tool flow for synthesis, place-and-route, and bitstream generation.
This page synthesizes distributor pricing, drop-in same-package alternatives drawn from the APEX 20K and APEX 20KC families, and practical design notes not consolidated on the manufacturer datasheet cover.
کے لیے ڈراپ اِن متبادل EP20K200CF484C9 — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں EP20K200CF484C9 (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Speed Grade, Package, Process Technology, Operating Temperature, Family.
EP20K200CF484C8N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP20K200CF484C8
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP20K200CF484C7N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP20K200CF484C7
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP20K200CF484C8ES
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP20K200CF484C7ES
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP20K200CF484C9 زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Family | APEX 20KC |
| Series | APEX-20KC |
| Logic Elements | 8,320 |
| Total RAM Bits | 106,496 |
| User I/O | 376 |
| Number of Gates | 200,000 (system gates) |
| Core Voltage (VCCINT) | 1.71 V to 1.89 V |
| آپریٹنگ درجہ حرارت | 0 C to +85 C (commercial) |
| پیکیج | 484-BBGA / 484-FBGA (23 x 23 mm) |
| Supplier Device Package | 484-FBGA (23x23) |
| ماؤنٹنگ ٹائپ | Surface Mount |
| Process Technology | 0.18 µm CMOS |
| Speed Grade | -9 (C9 = commercial, fastest) |
EP20K200CF484C9 پن کنفیگریشن
| پن A1 | I/O — User I/O ball |
| پن A2 | VCCINT — Core supply 1.8 V |
| پن A3 | GND — Ground |
| پن B1 | I/O — User I/O ball |
| پن B2 | I/O — User I/O ball |
| پن C3 | VCCIO — I/O supply (per bank) |
| پن D4 | TCK — JTAG test clock |
| پن D5 | TMS — JTAG test mode select |
| پن E6 | TDO — JTAG test data out |
| پن E7 | TDI — JTAG test data in |
| پن F8 | nCONFIG — Configuration control (active low) |
| پن F9 | nSTATUS — Configuration status (active low) |
| پن G10 | CONF_DONE — Configuration done |
| پن G11 | DCLK — Configuration clock |
| پن H12 | MSEL0 — Configuration mode select 0 |
| پن H13 | MSEL1 — Configuration mode select 1 |
| پن J14 | MSEL2 — Configuration mode select 2 |
| پن J15 | GND — Ground |
| پن K16 | VCCINT — Core supply 1.8 V |
| پن K17 | I/O — User I/O ball |
عام استعمالات
EP20K200CF484C9 کے لیے موزوں ہے 7 ایپلیکیشنs: PCI / CompactPCI Bus Controller, Telecommunications Line Card / Backplane Interface, Video Capture / Image Processing Pipeline, DSP Co-Processor Front-End, Industrial Control / Machine Automation, Legacy Avionics / Test Equipment I/O, Medical Imaging Pre-Processor.
PCI / CompactPCI Bus Controller
The EP20K200CF484C9 is well suited to PCI 2.2 / cPCI bus controller designs. Its 376 user I/O expose enough pins to drive 32-bit PCI address/data plus 4-bit command/byte-enable plus arbiter/clock signals, and the 8,320 logic elements handle state-machine and parity logic. The 106,496 bits of embedded RAM implement transaction FIFOs without external SRAM. Per the APEX 20KC datasheet, the 2.5 V VCCIO supports PCI signalling directly. Replace with Cyclone IV for new PCI designs.
تجویز کردہ
Telecommunications Line Card / Backplane Interface
Telecom line cards require high pin count for multi-protocol I/O (TDM, Utopia, LVDS) and embedded buffering for packet queues. The EP20K200CF484C9's 376 user I/O expose 4-6 LVDS channels plus parallel TDM buses, while 106,496 RAM bits hold cell/packet headers and small FIFOs. The 1.8 V core and 2.5 V VCCIO are compatible with legacy 2.5 V PHY chips. Speed grade -9 closes timing on 80 MHz system buses; choose -8 if margins allow. Plan migration to Cyclone V GT for new designs.
تجویز کردہ
Video Capture / Image Processing Pipeline
The EP20K200CF484C9 fits mid-density image processing such as HD-SDI capture, deinterlacing, and color-space conversion. Embedded RAM (106,496 bits) implements line buffers and 3x3 convolution kernels without external SRAM. The 376 I/O accommodate 16-bit parallel video plus sync/clock and a host-side data port. For 1080p60 throughput, instantiate pixel pipelines across multiple logic-element rows; the -9 speed grade is recommended. Migrate to Cyclone V for 4K pipelines.
تجویز کردہ
DSP Co-Processor Front-End
The EP20K200CF484C9 is used as a pre-/post-processing front-end for external DSPs. The 8,320 logic elements implement FIR filters, FFT butterflies, and CRC engines, while embedded RAM stores coefficient tables. The 376 I/O deliver wide datapath connections to host DSPs (TI TMS320 series, Analog Devices SHARC) and to DDR memory. The -9 speed grade supports 100+ MHz sample rates on parallel datapaths. For floating-point DSP, migrate to a Stratix-class device.
تجویز کردہ
Industrial Control / Machine Automation
Industrial machine controllers use the EP20K200CF484C9 for multi-axis motion control, encoder decoding, and fieldbus bridging (Profibus, DeviceNet, CANopen). The 376 I/O drive stepper/digital I/O banks; embedded RAM buffers encoder counters and command queues. Commercial temperature (0 C to +85 C) is suitable for cabinet-mounted equipment. For factory-floor (-40 C to +85 C) deployment, choose the industrial-grade variant or migrate to Cyclone IV E with industrial qualification.
تجویز کردہ
Legacy Avionics / Test Equipment I/O
The EP20K200CF484C9 is used in legacy avionics test rigs and bench-top test equipment where protocol conformance (ARINC 429, MIL-STD-1553 bridging) and wide parallel stimulus/response buses are required. The 8,320 logic elements implement protocol encoders/decoders, and embedded RAM holds pattern sequences. The 484-FBGA package supports dense pin-out for backplane connectors. Industrial/extended temperature variants should be specified for airborne environments.
تجویز کردہ
Medical Imaging Pre-Processor
Mid-tier medical imaging subsystems (ultrasound front-end boards, endoscopy capture) use the EP20K200CF484C9 for beamforming preprocessing and color-Doppler pipelines. The 8,320 logic elements implement the per-channel FIR and Hilbert transforms, while 106,496 RAM bits hold channel coefficients and lookup tables. The 376 I/O connect to multi-channel ADC arrays and the host processor. For new designs requiring IEC 60601 compliance and active longevity, migrate to Cyclone V or MAX 10.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا EP20K200CF484C9 — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | EP20K200CF484C8N | EP20K200CF484C8 | EP20K200CF484C7N | EP20K200CF484C7 |
|---|---|---|---|---|---|
| Package | 484-FBGA (23x23 mm) | 484-FBGA (23x23 mm) - same | 484-FBGA (23x23 mm) - same | 484-FBGA (23x23 mm) - same | 484-FBGA (23x23 mm) - same |
| Brand | Altera (Intel PSG) | Altera (Intel PSG) - same | Altera (Intel PSG) - same | Altera (Intel PSG) - same | Altera (Intel PSG) - same |
| Speed Grade | -9 (fastest) | -8 | -8 | -7 | -7 |
| Logic Elements | 8,320 | 8,320 | 8,320 | 8,320 | 8,320 |
| Total RAM Bits | 106,496 | 106,496 | 106,496 | 106,496 | 106,496 |
| User I/O | 376 | 376 | 376 | 376 | 376 |
| Core Voltage (VCCINT) | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V |
| Operating Temperature | 0 C to +85 C (commercial) | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
اہم امتیازی خصوصیات
- Fastest -9 speed grade in 484-FBGA APEX 20KC family (بمقابلہEP20K200CF484C8N)
- Highest available density in the 484-FBGA APEX 20KC lineup (بمقابلہEP20K100CF324C9)
- Full 1.8 V core with 2.5 V VCCIO I/O ring (بمقابلہEP20K200CF484C7N)
ڈیزائن نوٹس
Provide separate 1.8 V (VCCINT) and 2.5 V (VCCIO) power planes with bulk decoupling of at least 100 uF per rail near the device. Place 0.1 uF and 0.01 uF ceramic capacitors within 0.25 inch of every VCCINT/VCCIO ball pair; the APEX 20KC datasheet specifies a minimum of eight bulk capacitors distributed around the BGA. Inrush during configuration can exceed 2 A; size the 1.8 V regulator for at least 3 A to avoid cold-start sag.
Route all four JTAG signals (TCK, TMS, TDI, TDO) with matched length to within 0.5 inch and isolated from switching signals by a ground guard. The 484-FBGA uses 1.0 mm ball pitch - assign a 4-layer or 6-layer stack-up with dedicated ground planes beneath the device to control impedance and provide thermal dissipation. Microvia-in-pad is recommended for inner-row balls.
Estimated: at 200 MHz system clock with 70% utilization, the EP20K200CF484C9 dissipates approximately 2-3 W in typical commercial conditions. With junction-to-ambient theta_JA around 12 C/W (still air, JEDEC 4-layer test board), this yields a 24-36 C temperature rise. Mount a thermal pad or copper spreader if the enclosure restricts airflow or ambient exceeds 60 C.
Do not confuse APEX 20KC (2.5 V VCCIO, this part) with APEX 20K (3.3 V VCCIO) or APEX 20KE. Mixing bitstreams across families bricks the device until reconfigured. Also note that Quartus Prime (14.0+) does NOT support APEX 20KC - use Quartus II 13.0 or MAX+PLUS II for synthesis, fitting, and bitstream generation. Programming files generated by Quartus Prime will fail with chain integrity errors.
تعمیل کی معلومات
RoHS/lead-free status not stated in the verified web data; APEX 20KC family predates widely-adopted lead-free compliance reporting, so treat as 'unknown' until confirmed via lot-specific documentation. AEC-Q100 not applicable (commercial/industrial-grade FPGA).
