Intel

EP2AGX260EF29I3G - 244K LE Arria II GX FPGA, 780-FCBGA | Intel

MPN: EP2AGX260EF29I3G ✓ فعال

0.9 V Vdss 780-BBGA, FCBGA Package 500 MHz Speed

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مقدار

EP2AGX260EF29I3G جائزہ

The Intel EP2AGX260EF29I3G is a high-performance, low-power Arria II GX Field Programmable Gate Array (FPGA) with 244,188 logic elements and 12,038,144 bits of embedded memory, fabricated on a 40 nm process node and housed in a 780-ball Flip-Chip BGA (FCBGA) package. It supports a maximum internal operating frequency of up to 500 MHz across its logic fabric and incorporates 372 user I/O pins, making it suitable for high-throughput digital designs.

A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and high-speed transceivers, all interconnected by a programmable routing fabric. FPGAs sit within the broader category of programmable logic devices (PLDs) > digital integrated circuits > semiconductors. The Arria II GX family specifically targets mid-range applications requiring a balance of logic density, transceiver bandwidth, and power efficiency, placing it between Cyclone (low-cost) and Stratix (high-performance) families within Intel's (formerly Altera's) FPGA portfolio.

Key features of the EP2AGX260EF29I3G include 244,188 logic elements, 12 Mbits of embedded memory, integrated transceivers supporting multi-gigabit serial interfaces, on-chip multipliers for DSP operations, and a 0.9 V core supply. The 40 nm process technology provides an optimal balance between static and dynamic power consumption, which is critical for thermally constrained embedded systems.

The architecture combines a lookup-table-based logic fabric with hard DSP blocks, block RAM (M9K/M144K), and high-speed serial transceivers. This heterogeneous structure enables designers to implement complex signal processing pipelines, packet processing engines, and high-speed interface bridging without sacrificing logic utilization.

Typical applications include wireless baseband processing, high-definition video broadcast equipment, military secure communications, industrial machine vision, and high-speed serial protocol bridging (PCI Express, Serial RapidIO, Gigabit Ethernet). The industrial temperature grade (-40C to +100C) makes it appropriate for harsh-environment deployments.

When designing with this device, ensure proper power decoupling and thermal management. The 780-ball FCBGA package requires controlled-impedance PCB stackup and high-quality BGA assembly processes. Designers should reference the manufacturer datasheet for transceiver channel placement, PLL configuration, and I/O standard support.

This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet.

کے لیے ڈراپ اِن متبادل EP2AGX260EF29I3G — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔

اس سیریز میں مختلف ورژن

اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں EP2AGX260EF29I3G (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Operating Temperature, Package, Speed Grade, Process Technology, Mounting Type.

EP2AGX260EF29C4G

Intel

Operating Temperature: 0C to +85C (commercial)

Package: 780-BBGA, FCBGA (29 mm)

Speed Grade: C4 (commercial, performance-optimized)