EP3SL50F780C4LN - 47.5K LE Stratix III L FPGA, 780-FBGA | Intel
MPN: EP3SL50F780C4LN ✗ اختتامِ زندگیEP3SL50F780C4LN جائزہ
An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device that combines programmable logic fabric, hierarchical routing, dedicated DSP blocks, embedded memory (BRAM/M20K), and high-speed serial transceivers. The Stratix III L sub-family extends the Stratix III line with reduced static power while preserving the architecture: ALM-based logic, TriMatrix embedded memory, and DSP blocks. FPGAs sit at the top of the programmable-logic hierarchy alongside CPLDs and are widely used as ASIC prototyping platforms, hardware accelerators, and glue-logic bridges in heterogeneous SoCs.
Key features of the EP3SL50F780C4LN include 47.5 K logic elements (47500), 1900 LABs, 2,184,192 total RAM bits, 488 user I/Os, and the Stratix III L power-optimized fabric. The 'L' suffix denotes the low-power variant, which trims static leakage versus the standard Stratix III E family while retaining the same transceiver and DSP capability in the F780 (780-ball FBGA) footprint. The 'C4' speed grade and 'LN' suffix (lead-free, enhanced) are the standard ordering codes for industrial-temperature, lead-free assembly.
Architecturally, the EP3SL50F780C4LN leverages ALMs (Adaptive Logic Modules) rather than older 4-input LUTs, allowing each ALM to implement either two independent 4-input LUTs or one 6-input function with shared arithmetic. Combined with the TriMatrix memory system (MLAB, M9K, M144K blocks) and dedicated DSP blocks optimized for 18x18 multipliers, this delivers high DSP throughput at lower logic area. Multiple high-speed transceivers (per family capability) and dedicated PLL/DLL blocks handle clock distribution, while the programmable power technology allows unused fabric to be powered down for energy efficiency.
Typical applications include telecom baseband processing, military radar signal chains, high-performance ASIC prototyping, test-and-measurement instrumentation, and broadcast video processing. The device is also suited to high-throughput data-acquisition cards, software-defined radio front ends, and industrial imaging pipelines where parallel DSP and ample block RAM are decisive.
When designing with the EP3SL50F780C4LN, engineers should plan power-rail decoupling carefully, use Altera/Intel Quartus II (legacy) for bitstream generation, and validate thermal envelopes against the 780-FBGA theta-JA. Designers upgrading from the E variant should confirm Quartus device support and pin compatibility, since the L family shares the F780 package but has different static-power characteristics.
This page synthesizes distributor pricing (as of 2026-09-10), drop-in alternatives sourced from the Stratix III L family cross-reference, and practical design notes not found in the standalone Intel datasheet.
کے لیے ڈراپ اِن متبادل EP3SL50F780C4LN — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں EP3SL50F780C4LN (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Package, Speed Grade, RoHS Status, Operating Temperature, Embedded Memory Bits.
EP3SL50F780C4L
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP3SL50F780C4G
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP3SL50F780C4LG
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP3SE50F780C4N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP3SE50F780C4LN
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP3SL50F780I4LN
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP3SL50F780C4LN زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Series | Stratix III L |
| Family | Stratix III L (Low-Power) |
| Logic Elements (LE) | 47,500 |
| Logic Array Blocks (LAB) | 1,900 |
| Total RAM Bits | 2,184,192 |
| User I/O Pins | 488 |
| پیکیج | 780-BBGA, FCBGA (29x29 mm) |
| ماؤنٹنگ ٹائپ | Surface Mount |
| Process Technology | 65 nm |
| Core Voltage (VCCINT) | 0.86 V to 1.15 V |
| آپریٹنگ درجہ حرارت | 0C to +85C (Commercial) |
| Speed Grade | C4 |
| Lead-Free / RoHS | Yes (LN suffix indicates lead-free, enhanced) |
| Configuration | SRAM-based, configured via Quartus II |
EP3SL50F780C4LN 780-bbga, fcbga (29x29 mm) پن کنفیگریشن گائیڈ
EP3SL50F780C4LN (780-bbga, fcbga (29x29 mm) پیکیج) کے لیے پن کنفیگریشن۔ اس ڈیجیٹل IC میں GPIO، کمیونیکیشن انٹرفیس (UART، SPI، I2C) اور پاور پنز شامل ہیں۔ متبادل پن فنکشنز اور کنفیگریشن آپشنز کے لیے مینوفیکچرر کے ڈیٹا شیٹ سے رجوع کریں۔ ایمبیڈڈ سسٹم ڈیزائن اور PCB لے آؤٹ کے لیے ضروری۔
کے لیے تفصیلی پن آؤٹ ڈیٹا دستیاب نہیں EP3SL50F780C4LN.
رجوع کریں ڈیٹا شیٹ مکمل پن کنفیگریشن کے لیے۔
عام استعمالات
EP3SL50F780C4LN کے لیے موزوں ہے 6 ایپلیکیشنs: Telecom Baseband Processing, ASIC Prototyping Platform, Software-Defined Radio Front End, Test and Measurement Instrumentation, Industrial Imaging and Machine Vision, Military and Aerospace Signal Processing.
Telecom Baseband Processing
The EP3SL50F780C4LN is well-suited to telecom baseband processing, where its 47,500 logic elements and 2,184,192 bits of embedded block RAM handle multi-channel physical-layer algorithms. Stratix III L fabric delivers deterministic timing at 450 MHz core, allowing designers to implement channel coding, equalization, and FFT pipelines. The 488 user I/Os in the 780-FBGA package route parallel RapidIO, SRIO, or LVDS links to DSP coprocessors and network processors. Low static power of the L sub-family matters in densely populated line-card designs where heat density is critical. Designers typically pair the FPGA with external DDR2/QDR memory controllers and SerDes, with Quartus II handling floorplanning and pin assignment.
تجویز کردہ
ASIC Prototyping Platform
With 47,500 logic elements, 1,900 LABs, and 488 user I/Os in a 780-ball FC-BGA, the EP3SL50F780C4LN is frequently used as a multi-FPGA ASIC prototyping platform. The TriMatrix embedded memory (MLAB, M9K, M144K) supports register and FIFO emulation at high speeds, while dedicated DSP blocks accelerate 18x18 multipliers for SoC pre-silicon validation. Quartus II synthesis supports ASIC netlist partitioning, and the device's abundant I/O is mapped through high-density board connectors to daughter-FPGA stacks. The Stratix III L variant reduces static leakage, allowing multi-FPGA prototyping chassis to run continuously under thermal constraints. Engineers leverage JTAG and Active Serial configuration for fast multi-board bring-up.
تجویز کردہ
Software-Defined Radio Front End
The EP3SL50F780C4LN's DSP block density and 488 I/Os make it suitable for software-defined radio (SDR) front-end processing, including DDC/DUC, channelization, and pre-FFT sample buffering. Stratix III L transceivers support multi-Gbps ADC/DAC links, while the 65 nm process yields deterministic DSP throughput at moderate power. The 780-FBGA package exposes enough LVDS pairs to fan out to high-speed converters and RF front-end boards, simplifying board layout in multi-channel SDR systems. Designers typically instantiate NCOs and polyphase filter banks in dedicated DSP blocks, freeing logic for control-plane processing. Reduced static leakage of the L family suits ruggedized manpack and vehicular SDR chassis.
تجویز کردہ
Test and Measurement Instrumentation
The EP3SL50F780C4LN is widely deployed in high-end oscilloscopes, logic analyzers, and protocol testers where waveform synthesis, triggering, and signal-conditioning logic run alongside dedicated DSP blocks. The 47,500 logic elements and 2,184,192 RAM bits handle deep acquisition memory and trigger sequencers, while 488 I/Os in the 780-FBGA connect to high-speed ADCs and front-panel connectors. Stratix III L's low static leakage benefits compact bench instruments where thermals constrain chassis design. Pin compatibility with EP3SE50F780 variants enables engineering teams to alternate between low-power and high-performance builds with shared PCB artwork. Quartus II's TimeQuest timing analyzer simplifies timing closure across wide memory buses.
تجویز کردہ
Industrial Imaging and Machine Vision
Industrial imaging pipelines benefit from the EP3SL50F780C4LN's parallel DSP capability and abundant block RAM, used to debayer, color-correct, and run convolutional preprocessing at line rate. The 488 I/Os in the 780-FBGA accept multiple Camera Link, CoaXPress, or LVDS sensor streams, while 2,184,192 embedded RAM bits act as line buffers and frame stores. Stratix III L low-power design reduces thermals in sealed factory enclosures where convection cooling is limited. The C4 speed grade supports deterministic latency for vision controllers triggering downstream actuators. Designers often pair the FPGA with external DDR2/QDR II+ memory for full HD multi-camera buffering.
تجویز کردہ
Military and Aerospace Signal Processing
The EP3SL50F780C4LN suits defense and aerospace signal-processing applications such as radar beamforming, electronic-warfare receivers, and satellite baseband modems. Its 47,500 logic elements, DSP-rich fabric, and 488 I/Os handle wide-bandwidth IF processing and adaptive beamforming weights, while the ruggedized 780-FBGA supports conduction-cooled enclosures. Stratix III L's low static current matters in space-constrained avionics bays, and lead-free assembly (LN suffix) satisfies modern aerospace material specs. Engineers integrate this FPGA with radiation-tolerant companion memories and DACs, using Quartus II for design capture and timing analysis. The 65 nm process is mature for high-reliability defense programs.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا EP3SL50F780C4LN — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | EP3SL50F780C4L | EP3SL50F780C4LG | EP3SL50F780C4G | EP3SE50F780C4N | EP3SE50F780C4LN | EP3SL50F780I4LN |
|---|---|---|---|---|---|---|---|
| Package | 780-BBGA, FCBGA (F780, 29x29 mm) | 780-BBGA, FCBGA (F780) - same | 780-BBGA, FCBGA (F780) - same | 780-BBGA, FCBGA (F780) - same | 780-BBGA, FCBGA (F780) - same | 780-BBGA, FCBGA (F780) - same | 780-BBGA, FCBGA (F780) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Series | Stratix III L (Low-Power) | Stratix III L | Stratix III L | Stratix III L | Stratix III E (Standard) | Stratix III E (Standard) | Stratix III L |
| Logic Elements | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 |
| Total RAM Bits | 2,184,192 | 2,184,192 | 2,184,192 | 2,184,192 | 2,184,192 | 2,184,192 | 2,184,192 |
| User I/O Pins | 488 | 488 | 488 | 488 | 488 | 488 | 488 |
| Core Voltage | 0.86 V to 1.15 V | 0.86 V to 1.15 V | 0.86 V to 1.15 V | 0.86 V to 1.15 V | 0.86 V to 1.15 V | 0.86 V to 1.15 V | 0.86 V to 1.15 V |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C (Industrial) |
| Power Sub-family | Low-power (L) | Low-power (L) | Low-power (L) | Low-power (L) | Standard (E) | Standard (E) | Low-power (L) |
اہم امتیازی خصوصیات
- Same-density drop-in alternative within Stratix III L family with identical F780 footprint (بمقابلہEP3SE50F780C4N (Stratix III E))
- Commercial-temperature ordering variant (بمقابلہEP3SL50F780I4LN (Industrial-temp))
- Lead-free enhanced ordering code with active Intel longevity (بمقابلہEP3SL50F780C4G (legacy leaded))
ڈیزائن نوٹس
The EP3SL50F780C4LN requires multiple power rails: VCCINT (0.86-1.15 V core), VCCPD (1.5-1.8 V pre-driver), VCCIO (per-bank, 1.2-3.3 V), and dedicated analog supplies for PLL and transceiver blocks. Use a sequencer (e.g., a dedicated power-supply sequencer IC) to enforce the Intel Stratix III L power-up and power-down sequencing requirements. Decoupling must include bulk capacitors plus high-frequency MLCCs near each power pin per the Stratix III L pin connection guidelines.
The 780-FBGA FCBGA package has limited theta-JA, so designers must use a multi-layer PCB with thermal vias under the exposed die pad and adequate airflow or heatsink for sustained high-utilization designs. For full-LE/BRAM/DSP utilization at 450 MHz, plan for multi-watt dissipation. Thermal simulation is recommended for industrial-temperature variants (I-grade).
Quartus Prime (post-13.1) drops Stratix III device support, so EP3SL50F780C4LN users must retain a Quartus II installation (versions 9.0 to 13.1) for compilation and bitstream generation. Mistakenly using Quartus Prime causes 'device not supported' errors. Also note that the EP3SL (low-power) family is NOT pin-equivalent to EP3S or EP3SE in non-F780 packages, so do not assume cross-package drop-in compatibility. Always validate pinout against Quartus II pin planner before PCB fabrication.
Use impedance-controlled PCB stack-up for high-speed LVDS, DDR2/QDR memory interfaces, and SerDes traces. The 780-BGA has 1.0 mm pitch (typical for F780) requiring microvia or via-in-pad PCB technology for breakout routing. Maintain 100-ohm differential impedance for LVDS pairs and 50-ohm single-ended for SERDES. Reference the Intel Stratix III L PCB Design Guidelines for transceiver routing, AC coupling, and length matching tolerances.
تعمیل کی معلومات
RoHS compliant per LN ordering code suffix. AEC-Q100 not applicable (FPGA in NRND status, not automotive-qualified). Lead-free confirmed by 'LN' suffix. Halogen-free and full REACH status not stated in provided web data - set to 'unknown'.