EP3SL50F780C4LN - 47.5K LE Stratix III L FPGA, 780-FBGA | Intel
부품 번호: EP3SL50F780C4LN ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $763.02 | $763.02 |
| 10 | $720.5 | $7,205.00 |
| 100 | $685 | $68,500.00 |
| 250 | $650 | $162,500.00 |
| 500 | $615 | $307,500.00 |
EP3SL50F780C4LN 개요
An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device that combines programmable logic fabric, hierarchical routing, dedicated DSP blocks, embedded memory (BRAM/M20K), and high-speed serial transceivers. The Stratix III L sub-family extends the Stratix III line with reduced static power while preserving the architecture: ALM-based logic, TriMatrix embedded memory, and DSP blocks. FPGAs sit at the top of the programmable-logic hierarchy alongside CPLDs and are widely used as ASIC prototyping platforms, hardware accelerators, and glue-logic bridges in heterogeneous SoCs.
Key features of the EP3SL50F780C4LN include 47.5 K logic elements (47500), 1900 LABs, 2,184,192 total RAM bits, 488 user I/Os, and the Stratix III L power-optimized fabric. The 'L' suffix denotes the low-power variant, which trims static leakage versus the standard Stratix III E family while retaining the same transceiver and DSP capability in the F780 (780-ball FBGA) footprint. The 'C4' speed grade and 'LN' suffix (lead-free, enhanced) are the standard ordering codes for industrial-temperature, lead-free assembly.
Architecturally, the EP3SL50F780C4LN leverages ALMs (Adaptive Logic Modules) rather than older 4-input LUTs, allowing each ALM to implement either two independent 4-input LUTs or one 6-input function with shared arithmetic. Combined with the TriMatrix memory system (MLAB, M9K, M144K blocks) and dedicated DSP blocks optimized for 18x18 multipliers, this delivers high DSP throughput at lower logic area. Multiple high-speed transceivers (per family capability) and dedicated PLL/DLL blocks handle clock distribution, while the programmable power technology allows unused fabric to be powered down for energy efficiency.
Typical applications include telecom baseband processing, military radar signal chains, high-performance ASIC prototyping, test-and-measurement instrumentation, and broadcast video processing. The device is also suited to high-throughput data-acquisition cards, software-defined radio front ends, and industrial imaging pipelines where parallel DSP and ample block RAM are decisive.
When designing with the EP3SL50F780C4LN, engineers should plan power-rail decoupling carefully, use Altera/Intel Quartus II (legacy) for bitstream generation, and validate thermal envelopes against the 780-FBGA theta-JA. Designers upgrading from the E variant should confirm Quartus device support and pin compatibility, since the L family shares the F780 package but has different static-power characteristics.
This page synthesizes distributor pricing (as of 2026-09-10), drop-in alternatives sourced from the Stratix III L family cross-reference, and practical design notes not found in the standalone Intel datasheet.
드롭인 대체품: EP3SL50F780C4LN — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SL50F780C4LN (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, RoHS Status, Operating Temperature, Embedded Memory Bits.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SL50F780C4L
✅ 드롭인✓ 재고 있음
$571.45 / 개
데이터시트 보기 →EP3SL50F780C4G
✅ 드롭인✓ 재고 있음
$499.4 / 개
데이터시트 보기 →EP3SL50F780C4LG
✅ 드롭인✓ 재고 있음
$750.18 / 개
데이터시트 보기 →EP3SE50F780C4N
✅ 드롭인✓ 재고 있음
$1430 / 개
데이터시트 보기 →EP3SE50F780C4LN
✅ 드롭인✓ 재고 있음
$650 / 개
데이터시트 보기 →EP3SL50F780I4LN
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$780 / 개
데이터시트 보기 →EP3SL50F780C4LN 최대 정격 & 전기적 특성
| Series | Stratix III L |
| Family | Stratix III L (Low-Power) |
| Logic Elements (LE) | 47,500 |
| Logic Array Blocks (LAB) | 1,900 |
| Total RAM Bits | 2,184,192 |
| User I/O Pins | 488 |
| 패키지 | 780-BBGA, FCBGA (29x29 mm) |
| 실장 유형 | Surface Mount |
| Process Technology | 65 nm |
| Core Voltage (VCCINT) | 0.86 V to 1.15 V |
| 동작 온도 | 0C to +85C (Commercial) |
| Speed Grade | C4 |
| Lead-Free / RoHS | Yes (LN suffix indicates lead-free, enhanced) |
| Configuration | SRAM-based, configured via Quartus II |
EP3SL50F780C4LN 780-bbga, fcbga (29x29 mm) 핀 구성 가이드
EP3SL50F780C4LN(780-bbga, fcbga (29x29 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SL50F780C4LN.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SL50F780C4LN 적합 용도: 6 애플리케이션s: Telecom Baseband Processing, ASIC Prototyping Platform, Software-Defined Radio Front End, Test and Measurement Instrumentation, Industrial Imaging and Machine Vision, Military and Aerospace Signal Processing.
Telecom Baseband Processing
The EP3SL50F780C4LN is well-suited to telecom baseband processing, where its 47,500 logic elements and 2,184,192 bits of embedded block RAM handle multi-channel physical-layer algorithms. Stratix III L fabric delivers deterministic timing at 450 MHz core, allowing designers to implement channel coding, equalization, and FFT pipelines. The 488 user I/Os in the 780-FBGA package route parallel RapidIO, SRIO, or LVDS links to DSP coprocessors and network processors. Low static power of the L sub-family matters in densely populated line-card designs where heat density is critical. Designers typically pair the FPGA with external DDR2/QDR memory controllers and SerDes, with Quartus II handling floorplanning and pin assignment.
추천
ASIC Prototyping Platform
With 47,500 logic elements, 1,900 LABs, and 488 user I/Os in a 780-ball FC-BGA, the EP3SL50F780C4LN is frequently used as a multi-FPGA ASIC prototyping platform. The TriMatrix embedded memory (MLAB, M9K, M144K) supports register and FIFO emulation at high speeds, while dedicated DSP blocks accelerate 18x18 multipliers for SoC pre-silicon validation. Quartus II synthesis supports ASIC netlist partitioning, and the device's abundant I/O is mapped through high-density board connectors to daughter-FPGA stacks. The Stratix III L variant reduces static leakage, allowing multi-FPGA prototyping chassis to run continuously under thermal constraints. Engineers leverage JTAG and Active Serial configuration for fast multi-board bring-up.
추천
Software-Defined Radio Front End
The EP3SL50F780C4LN's DSP block density and 488 I/Os make it suitable for software-defined radio (SDR) front-end processing, including DDC/DUC, channelization, and pre-FFT sample buffering. Stratix III L transceivers support multi-Gbps ADC/DAC links, while the 65 nm process yields deterministic DSP throughput at moderate power. The 780-FBGA package exposes enough LVDS pairs to fan out to high-speed converters and RF front-end boards, simplifying board layout in multi-channel SDR systems. Designers typically instantiate NCOs and polyphase filter banks in dedicated DSP blocks, freeing logic for control-plane processing. Reduced static leakage of the L family suits ruggedized manpack and vehicular SDR chassis.
추천
Test and Measurement Instrumentation
The EP3SL50F780C4LN is widely deployed in high-end oscilloscopes, logic analyzers, and protocol testers where waveform synthesis, triggering, and signal-conditioning logic run alongside dedicated DSP blocks. The 47,500 logic elements and 2,184,192 RAM bits handle deep acquisition memory and trigger sequencers, while 488 I/Os in the 780-FBGA connect to high-speed ADCs and front-panel connectors. Stratix III L's low static leakage benefits compact bench instruments where thermals constrain chassis design. Pin compatibility with EP3SE50F780 variants enables engineering teams to alternate between low-power and high-performance builds with shared PCB artwork. Quartus II's TimeQuest timing analyzer simplifies timing closure across wide memory buses.
추천
Industrial Imaging and Machine Vision
Industrial imaging pipelines benefit from the EP3SL50F780C4LN's parallel DSP capability and abundant block RAM, used to debayer, color-correct, and run convolutional preprocessing at line rate. The 488 I/Os in the 780-FBGA accept multiple Camera Link, CoaXPress, or LVDS sensor streams, while 2,184,192 embedded RAM bits act as line buffers and frame stores. Stratix III L low-power design reduces thermals in sealed factory enclosures where convection cooling is limited. The C4 speed grade supports deterministic latency for vision controllers triggering downstream actuators. Designers often pair the FPGA with external DDR2/QDR II+ memory for full HD multi-camera buffering.
추천
Military and Aerospace Signal Processing
The EP3SL50F780C4LN suits defense and aerospace signal-processing applications such as radar beamforming, electronic-warfare receivers, and satellite baseband modems. Its 47,500 logic elements, DSP-rich fabric, and 488 I/Os handle wide-bandwidth IF processing and adaptive beamforming weights, while the ruggedized 780-FBGA supports conduction-cooled enclosures. Stratix III L's low static current matters in space-constrained avionics bays, and lead-free assembly (LN suffix) satisfies modern aerospace material specs. Engineers integrate this FPGA with radiation-tolerant companion memories and DACs, using Quartus II for design capture and timing analysis. The 65 nm process is mature for high-reliability defense programs.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SL50F780C4LN — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SL50F780C4L | EP3SL50F780C4LG | EP3SL50F780C4G | EP3SE50F780C4N | EP3SE50F780C4LN | EP3SL50F780I4LN |
|---|---|---|---|---|---|---|---|
| Package | 780-BBGA, FCBGA (F780, 29x29 mm) | 780-BBGA, FCBGA (F780) - same | 780-BBGA, FCBGA (F780) - same | 780-BBGA, FCBGA (F780) - same | 780-BBGA, FCBGA (F780) - same | 780-BBGA, FCBGA (F780) - same | 780-BBGA, FCBGA (F780) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Series | Stratix III L (Low-Power) | Stratix III L | Stratix III L | Stratix III L | Stratix III E (Standard) | Stratix III E (Standard) | Stratix III L |
| Logic Elements | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 |
| Total RAM Bits | 2,184,192 | 2,184,192 | 2,184,192 | 2,184,192 | 2,184,192 | 2,184,192 | 2,184,192 |
| User I/O Pins | 488 | 488 | 488 | 488 | 488 | 488 | 488 |
| Core Voltage | 0.86 V to 1.15 V | 0.86 V to 1.15 V | 0.86 V to 1.15 V | 0.86 V to 1.15 V | 0.86 V to 1.15 V | 0.86 V to 1.15 V | 0.86 V to 1.15 V |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C (Industrial) |
| Power Sub-family | Low-power (L) | Low-power (L) | Low-power (L) | Low-power (L) | Standard (E) | Standard (E) | Low-power (L) |
주요 차별점
- Same-density drop-in alternative within Stratix III L family with identical F780 footprint (vs EP3SE50F780C4N (Stratix III E))
- Commercial-temperature ordering variant (vs EP3SL50F780I4LN (Industrial-temp))
- Lead-free enhanced ordering code with active Intel longevity (vs EP3SL50F780C4G (legacy leaded))
설계 노트
The EP3SL50F780C4LN requires multiple power rails: VCCINT (0.86-1.15 V core), VCCPD (1.5-1.8 V pre-driver), VCCIO (per-bank, 1.2-3.3 V), and dedicated analog supplies for PLL and transceiver blocks. Use a sequencer (e.g., a dedicated power-supply sequencer IC) to enforce the Intel Stratix III L power-up and power-down sequencing requirements. Decoupling must include bulk capacitors plus high-frequency MLCCs near each power pin per the Stratix III L pin connection guidelines.
The 780-FBGA FCBGA package has limited theta-JA, so designers must use a multi-layer PCB with thermal vias under the exposed die pad and adequate airflow or heatsink for sustained high-utilization designs. For full-LE/BRAM/DSP utilization at 450 MHz, plan for multi-watt dissipation. Thermal simulation is recommended for industrial-temperature variants (I-grade).
Quartus Prime (post-13.1) drops Stratix III device support, so EP3SL50F780C4LN users must retain a Quartus II installation (versions 9.0 to 13.1) for compilation and bitstream generation. Mistakenly using Quartus Prime causes 'device not supported' errors. Also note that the EP3SL (low-power) family is NOT pin-equivalent to EP3S or EP3SE in non-F780 packages, so do not assume cross-package drop-in compatibility. Always validate pinout against Quartus II pin planner before PCB fabrication.
Use impedance-controlled PCB stack-up for high-speed LVDS, DDR2/QDR memory interfaces, and SerDes traces. The 780-BGA has 1.0 mm pitch (typical for F780) requiring microvia or via-in-pad PCB technology for breakout routing. Maintain 100-ohm differential impedance for LVDS pairs and 50-ohm single-ended for SERDES. Reference the Intel Stratix III L PCB Design Guidelines for transceiver routing, AC coupling, and length matching tolerances.
규정 준수 정보
RoHS compliant per LN ordering code suffix. AEC-Q100 not applicable (FPGA in NRND status, not automotive-qualified). Lead-free confirmed by 'LN' suffix. Halogen-free and full REACH status not stated in provided web data - set to 'unknown'.