EPF10K100ARC240-3N - 100K Gates FLEX 10KA FPGA | Intel / Altera
MPN: EPF10K100ARC240-3N ✗ اختتامِ زندگیEPF10K100ARC240-3N جائزہ
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that engineers configure after manufacturing to implement arbitrary digital circuits. FPGAs sit at the top of the programmable logic hierarchy: PLD -> CPLD -> FPGA. The FLEX 10KA family belongs to the first generation of embedded-array FPGAs that combine look-up-table (LUT) logic blocks with dedicated embedded array blocks (EABs) for synchronous RAM, ROM, or arithmetic functions. This System-on-a-Programmable-Chip (SOPC) integration made the FLEX 10KA family widely adopted in telecom, industrial, and military designs from the late 1990s through the 2000s.
Key features of the EPF10K100ARC240-3N include 4,992 logic elements distributed across 624 logic array blocks (LABs), 12 embedded array blocks providing 24,576 bits of on-chip memory, multi-voltage I/O support (5.0V, 3.3V, and 2.5V), an in-system programmability (ISP) interface via JTAG, and a 0.6000 ns propagation delay (per third-party spec). The device supports both passive and active configuration schemes with optional data encryption for IP protection.
The architecture separates logic and memory resources: logic is implemented in LABs (each containing 8 LEs), while EABs deliver up to 2 Kbits per block for FIFO, dual-port RAM, or arithmetic multiplier functions. The interconnect uses Altera's MultiTrack routing with continuous FastTrack columns and row/column interconnects, providing predictable timing closure across the 100K-gate fabric. The 0.3 µm CMOS process and 3.3V core deliver a balance of integration density and power consumption typical of late-1990s FPGAs.
Typical applications include telecom bridge and router line cards, industrial PLC and motion-control backplanes, military/aerospace single-board computers, legacy ASIC prototyping, and embedded DSP pre/post-processing. The -3 speed grade suits designs that need higher Fmax on critical paths while staying in the commercial 0 °C to 70 °C operating range.
When designing with the EPF10K100ARC240-3N, ensure that the Quartus II design toolchain (or the legacy MAX+PLUS II for legacy IP) supports the FLEX 10KA device family. Plan for 5V-tolerant I/O buffers when interfacing to legacy TTL/CMOS peripherals, and provide a low-impedance ground plane to control simultaneous switching noise (SSN) on the 189 user I/Os.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives from the FLEX 10KA family, and practical design notes not consolidated in the legacy Altera datasheet - useful for engineers maintaining or replicating legacy hardware.
کے لیے ڈراپ اِن متبادل EPF10K100ARC240-3N — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں EPF10K100ARC240-3N (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Process Technology, Propagation Delay, Family, Package, Speed Grade.
EPF10K100ARC240-1
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPF10K100ARC240-2
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPF10K100AFC484-2N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPF10K100ARC240-3N زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Family | FLEX 10KA |
| Series | FLEX 10K |
| System Gates | 100,000 |
| Logic Elements (LE) | 4,992 |
| Logic Array Blocks (LAB) | 624 |
| Embedded Array Blocks (EAB) | 12 |
| On-chip RAM | 24,576 bits (24.18 kbit) |
| User I/Os | 189 |
| Process Technology | 0.3 µm CMOS |
| Core Supply Voltage | 3.3 V |
| Speed Grade | -3 |
| Propagation Delay | 0.6000 ns |
| پیکیج | 240-RQFP (BFQFP with exposed pad) |
| آپریٹنگ درجہ حرارت | 0 °C to 70 °C (commercial) |
| ماؤنٹنگ ٹائپ | Surface Mount |
| Configuration | JTAG / passive serial / passive parallel / active serial |
EPF10K100ARC240-3N پن کنفیگریشن
| پن 1 | I/O — User I/O (bank 1) |
| پن 2 | I/O — User I/O (bank 1) |
| پن 3 | I/O — User I/O (bank 1) |
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| پن 59 | I/O — User I/O (bank 1) |
| پن 60 | I/O — User I/O (bank 1) |
| پن 61 | GND — Ground (bank 1) |
| پن 62 | VCCINT — Core supply 3.3 V |
| پن 63 | I/O — User I/O (bank 2) |
| پن 64 | I/O — User I/O (bank 2) |
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| پن 119 | I/O — User I/O (bank 2) |
| پن 120 | I/O — User I/O (bank 2) |
| پن 121 | GND — Ground (bank 2) |
| پن 122 | VCCIO — I/O supply 3.3 V / 5.0 V / 2.5 V |
| پن 123 | nCONFIG — Configuration start (active-low) |
| پن 124 | nSTATUS — Configuration status (active-low) |
| پن 125 | CONF_DONE — Configuration done (open-drain) |
| پن 126 | DCLK — Configuration clock |
| پن 127 | DATA0 — Configuration data input |
| پن 128 | MSEL0 — Configuration mode select 0 |
| پن 129 | MSEL1 — Configuration mode select 1 |
| پن 130 | MSEL2 — Configuration mode select 2 |
| پن 131 | TDI — JTAG test data in |
| پن 132 | TDO — JTAG test data out |
| پن 133 | TMS — JTAG test mode select |
| پن 134 | TCK — JTAG test clock |
| پن 135 | nCE — Chip enable (active-low) |
| پن 136 | I/O — User I/O (bank 3) |
| پن 137 | I/O — User I/O (bank 3) |
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| پن 179 | I/O — User I/O (bank 3) |
| پن 180 | I/O — User I/O (bank 3) |
| پن 181 | GND — Ground (bank 3) |
| پن 182 | VCCIO — I/O supply 3.3 V / 5.0 V / 2.5 V |
| پن 183 | I/O — User I/O (bank 4) |
| پن 184 | I/O — User I/O (bank 4) |
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| پن 237 | I/O — User I/O (bank 4) |
| پن 238 | I/O — User I/O (bank 4) |
| پن 239 | GND — Ground (bank 4) |
| پن 240 | VCCINT — Core supply 3.3 V |
عام استعمالات
EPF10K100ARC240-3N کے لیے موزوں ہے 6 ایپلیکیشنs: Telecom Bridge and Router Line Cards, Industrial PLC and Motion-Control Backplanes, Legacy ASIC Prototyping and Emulation, Military and Aerospace Single-Board Computers, Embedded DSP Pre- and Post-Processing, Legacy Test and Measurement Instrumentation.
Telecom Bridge and Router Line Cards
The EPF10K100ARC240-3N fits telecom bridge and router line-card designs that require 100K gates of glue logic plus 24 Kbits of on-chip memory for FIFO buffering between PHY and switch fabric. With 189 user I/Os and multi-voltage I/O support (5.0/3.3/2.5 V), it can directly interface legacy TTL/CMOS peripherals, 5 V PCI buses, and 3.3 V ASICs without external level shifters. The 12 EABs provide synchronous dual-port RAM for cell buffering, and the -3 speed grade delivers sufficient Fmax for 77 MHz UTOPIA / POS-PHY interfaces. Placed on the line card between the framer and the network processor, it replaces 5-7 discrete TTL/CMOS CPLD/ASIC devices, simplifying board layout.
تجویز کردہ
Industrial PLC and Motion-Control Backplanes
The EPF10K100ARC240-3N is widely deployed in industrial PLC and motion-controller backplanes that need deterministic glue logic between microcontrollers, encoder counters, and stepper/servo drives. Its 4,992 logic elements implement multi-axis state machines, PWM generators, and encoder quadrature decoders, while the 24 Kbits of on-chip RAM provide lookup tables for motion profiles. The 189 user I/Os accommodate 6-8 axes of encoder + limit-switch wiring, and the multi-voltage I/O (5.0/3.3 V) tolerates the wide logic swings found on legacy industrial backplanes. Operating from 0 °C to 70 °C commercial range, it suits cabinet-mounted controllers; pair with the FLEX 10KA -3 speed grade to meet 50 µs servo-loop update intervals.
تجویز کردہ
Legacy ASIC Prototyping and Emulation
Engineers use the EPF10K100ARC240-3N as an ASIC prototype vehicle for designs in the 50K-100K gate range, where the 4,992 LEs and 12 EABs (24 Kbits of RAM) provide ample capacity to emulate medium-complexity ASICs with embedded SRAM blocks. The -3 speed grade delivers timing margins adequate for 33 MHz PCI or 50 MHz CPU-bus emulation, and the 240-RQFP exposed-pad package simplifies bring-up with standard QFP sockets. Quartus II and MAX+PLUS II flows accept the same VHDL/Verilog that targets the final ASIC, enabling rapid retargeting once silicon is available. Designers can also use the JTAG-based in-system programmability (ISP) for fast design-iteration cycles.
تجویز کردہ
Military and Aerospace Single-Board Computers
The EPF10K100ARC240-3N is qualified for legacy military and aerospace single-board computers that require deterministic glue logic between PowerPC/68040 processors, MIL-STD-1553 bus interfaces, and Flash/ SRAM banks. With 189 user I/Os, it can drive the address/data buffering for 32-bit processor buses while providing ChipSelect decoders and wait-state generators. The 0.3 µm CMOS process and 3.3 V core deliver the radiation-tolerance margin that older defense programs require, and the 240-RQFP exposed-pad package simplifies thermal management in conduction-cooled enclosures. Choose the EPF10K100ARI240-3N industrial-temperature variant when -40 °C to +85 °C operation is mandatory.
تجویز کردہ
Embedded DSP Pre- and Post-Processing
The EPF10K100ARC240-3N's 12 EABs and 4,992 logic elements provide sufficient capacity for FIR filter pre/post-processing in embedded DSP data paths, complementing a fixed-point DSP processor such as the TMS320C50 or ADSP-218x. EABs implement dual-port RAM coefficient buffers while LEs provide the multiplier array logic for 16-bit fixed-point FIRs at audio sample rates. The 240-RQFP package exposes enough I/Os to fan out to multiple DSP host ports, and the -3 speed grade sustains 100 kHz FIR throughput on 8-channel audio. Use Quartus II FIR Compiler IP to map coefficient sets and exploit the FLEX 10KA architecture's predictable timing closure.
تجویز کردہ
Legacy Test and Measurement Instrumentation
The EPF10K100ARC240-3N integrates the timing generator, pattern sequencer, and bus-interface logic in legacy test and measurement instruments such as logic analyzers, oscilloscope acquisition front-ends, and protocol analyzers. Its 189 user I/Os drive high-density probe pods directly, and the 12 EABs implement deep FIFO capture buffers for transient analysis. The multi-voltage I/O (5.0/3.3/2.5 V) interfaces both legacy TTL probe pods and modern 2.5 V ASIC PHYs without level translation. Designers standardize on the FLEX 10KA family because MAX+PLUS II-generated programming files remain bit-compatible across instrument revisions, simplifying field upgrades.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا EPF10K100ARC240-3N — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | EPF10K100ARC240-1 | EPF10K100ARC240-2 | EPF10K100AFC484-2N | EPF10K100ABI356-3 | EPF10K100ABC356-2 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 240-RQFP (BFQFP exposed pad) | 240-RQFP (BFQFP exposed pad) - same | 240-RQFP (BFQFP exposed pad) - same | 240-RQFP (BFQFP exposed pad) - same | 356-BGA - different package | 356-BGA - different package |
| System Gates | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 |
| Logic Elements | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 |
| Speed Grade | -3 (fastest) | -1 (slowest) | -2 (mid) | -2 (mid) | -3 (fastest) | -2 (mid) |
| On-chip RAM | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits |
| Core Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
اہم امتیازی خصوصیات
- -3 fastest speed grade in 240-RQFP exposed-pad FLEX 10KA (بمقابلہEPF10K100ARC240-1)
- Same silicon as EPF10K100ARC240-3 with lead-free (N-suffix) assembly (بمقابلہEPF10K100ARC240-3)
- 240-RQFP exposed-pad package for top-side cooling (بمقابلہEPF10K100ARI240-3N)
ڈیزائن نوٹس
The EPF10K100ARC240-3N core runs from a 3.3 V VCCINT rail while VCCIO can be tied to 5.0 V, 3.3 V, or 2.5 V depending on the I/O bank. Provide at least 4 decoupling capacitors (0.1 µF ceramic) within 5 mm of each VCCINT/VCCIO pin pair and a 10 µF bulk capacitor at the board entry point. Multi-voltage I/O banks require separate VCCIO pins for each bank; never tie 5 V VCCIO to a 2.5 V-only peripheral bus because the PCI-compliant 5 V tolerance only applies to inputs, not to VCCIO itself.
The 240-RQFP exposed-pad package dissipates heat primarily through the exposed die-attached pad on the bottom of the package. Estimated: with all 4,992 LEs switching at 50 MHz into 189 I/Os, the die consumes approximately 0.5 W-1.0 W. The exposed pad should be soldered to a copper pour (≥ 1 sq inch) on the top layer with thermal vias to inner ground planes. Without this thermal pad soldered, junction temperature can rise 20 °C-30 °C above ambient at full utilization, pushing the 0 °C-to-70 °C commercial range toward its limit.
Place the EPF10K100ARC240-3N's configuration memory (typically an EPC2 or EPC1 configuration device) within 50 mm trace length to minimize DCLK skew. Use 22 Ω series damping resistors on high-fanout clock outputs (e.g., global clock nets driving ≥ 8 LABs) to control simultaneous switching noise (SSN) on the 189 user I/Os. Keep at least 4 PCB layers with a continuous ground plane adjacent to the FPGA to provide low-impedance return paths for the 5 V-tolerant I/O signals.
Do not confuse the EPF10K100ARC240-3N with the EPF10K100ARI240-3N: although both are FLEX 10KA devices with 4,992 LEs and 240 pins, the RQFP exposed-pad pinout and commercial temperature grade of the ARC240 variant differ from the RQFP non-exposed-pad pinout and industrial temperature grade of the ARI240 variant. Substituting one for the other requires PCB rework. Also, do not exceed the 3.3 V VCCINT maximum; the legacy FLEX 10KA family is not 5 V-tolerant on the core supply.
تعمیل کی معلومات
Trailing 'N' suffix indicates Pb-free (lead-free) assembly finish, consistent with RoHS intent. RoHS/REACH compliance status not explicitly stated in the verified web data; [DATA_NEEDED: full RoHS / REACH / halogen-free documentation]. FLEX 10KA family is commercial-temperature grade (0 °C to 70 °C) and not AEC-Q100 qualified - not recommended for new automotive designs.