EPF10K100ARC240-3N - 100K Gates FLEX 10KA FPGA | Intel / Altera
MPN: EPF10K100ARC240-3N ✗ پایان تولیدEPF10K100ARC240-3N نمای کلی
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that engineers configure after manufacturing to implement arbitrary digital circuits. FPGAs sit at the top of the programmable logic hierarchy: PLD -> CPLD -> FPGA. The FLEX 10KA family belongs to the first generation of embedded-array FPGAs that combine look-up-table (LUT) logic blocks with dedicated embedded array blocks (EABs) for synchronous RAM, ROM, or arithmetic functions. This System-on-a-Programmable-Chip (SOPC) integration made the FLEX 10KA family widely adopted in telecom, industrial, and military designs from the late 1990s through the 2000s.
Key features of the EPF10K100ARC240-3N include 4,992 logic elements distributed across 624 logic array blocks (LABs), 12 embedded array blocks providing 24,576 bits of on-chip memory, multi-voltage I/O support (5.0V, 3.3V, and 2.5V), an in-system programmability (ISP) interface via JTAG, and a 0.6000 ns propagation delay (per third-party spec). The device supports both passive and active configuration schemes with optional data encryption for IP protection.
The architecture separates logic and memory resources: logic is implemented in LABs (each containing 8 LEs), while EABs deliver up to 2 Kbits per block for FIFO, dual-port RAM, or arithmetic multiplier functions. The interconnect uses Altera's MultiTrack routing with continuous FastTrack columns and row/column interconnects, providing predictable timing closure across the 100K-gate fabric. The 0.3 µm CMOS process and 3.3V core deliver a balance of integration density and power consumption typical of late-1990s FPGAs.
Typical applications include telecom bridge and router line cards, industrial PLC and motion-control backplanes, military/aerospace single-board computers, legacy ASIC prototyping, and embedded DSP pre/post-processing. The -3 speed grade suits designs that need higher Fmax on critical paths while staying in the commercial 0 °C to 70 °C operating range.
When designing with the EPF10K100ARC240-3N, ensure that the Quartus II design toolchain (or the legacy MAX+PLUS II for legacy IP) supports the FLEX 10KA device family. Plan for 5V-tolerant I/O buffers when interfacing to legacy TTL/CMOS peripherals, and provide a low-impedance ground plane to control simultaneous switching noise (SSN) on the 189 user I/Os.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives from the FLEX 10KA family, and practical design notes not consolidated in the legacy Altera datasheet - useful for engineers maintaining or replicating legacy hardware.
جایگزین‌های drop-in برای EPF10K100ARC240-3N — همان پکیج، سازگار پین‌به‌پین. قطعات با پکیج متفاوت که نیاز به تغییر PCB دارند مستثنی هستند.
گونه‌ها در این سری
مدل‌های هم‌سری که جایگزین مستقیم هستند برای EPF10K100ARC240-3N (همان فرم‌فاکتور و فوت‌پرینت) — متفاوت در Process Technology, Propagation Delay, Family, Package, Speed Grade.
EPF10K100ARC240-1
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←EPF10K100ARC240-2
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←EPF10K100AFC484-2N
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←EPF10K100ARC240-3N حداکثر مقادیر مجاز و مشخصات الکتریکی
| Family | FLEX 10KA |
| Series | FLEX 10K |
| System Gates | 100,000 |
| Logic Elements (LE) | 4,992 |
| Logic Array Blocks (LAB) | 624 |
| Embedded Array Blocks (EAB) | 12 |
| On-chip RAM | 24,576 bits (24.18 kbit) |
| User I/Os | 189 |
| Process Technology | 0.3 µm CMOS |
| Core Supply Voltage | 3.3 V |
| Speed Grade | -3 |
| Propagation Delay | 0.6000 ns |
| بسته‌بندی | 240-RQFP (BFQFP with exposed pad) |
| دمای کاری | 0 °C to 70 °C (commercial) |
| نوع نصب | Surface Mount |
| Configuration | JTAG / passive serial / passive parallel / active serial |
پیکربندی پین EPF10K100ARC240-3N
| پین 1 | I/O — User I/O (bank 1) |
| پین 2 | I/O — User I/O (bank 1) |
| پین 3 | I/O — User I/O (bank 1) |
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| پین 59 | I/O — User I/O (bank 1) |
| پین 60 | I/O — User I/O (bank 1) |
| پین 61 | GND — Ground (bank 1) |
| پین 62 | VCCINT — Core supply 3.3 V |
| پین 63 | I/O — User I/O (bank 2) |
| پین 64 | I/O — User I/O (bank 2) |
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| پین 118 | I/O — User I/O (bank 2) |
| پین 119 | I/O — User I/O (bank 2) |
| پین 120 | I/O — User I/O (bank 2) |
| پین 121 | GND — Ground (bank 2) |
| پین 122 | VCCIO — I/O supply 3.3 V / 5.0 V / 2.5 V |
| پین 123 | nCONFIG — Configuration start (active-low) |
| پین 124 | nSTATUS — Configuration status (active-low) |
| پین 125 | CONF_DONE — Configuration done (open-drain) |
| پین 126 | DCLK — Configuration clock |
| پین 127 | DATA0 — Configuration data input |
| پین 128 | MSEL0 — Configuration mode select 0 |
| پین 129 | MSEL1 — Configuration mode select 1 |
| پین 130 | MSEL2 — Configuration mode select 2 |
| پین 131 | TDI — JTAG test data in |
| پین 132 | TDO — JTAG test data out |
| پین 133 | TMS — JTAG test mode select |
| پین 134 | TCK — JTAG test clock |
| پین 135 | nCE — Chip enable (active-low) |
| پین 136 | I/O — User I/O (bank 3) |
| پین 137 | I/O — User I/O (bank 3) |
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| پین 179 | I/O — User I/O (bank 3) |
| پین 180 | I/O — User I/O (bank 3) |
| پین 181 | GND — Ground (bank 3) |
| پین 182 | VCCIO — I/O supply 3.3 V / 5.0 V / 2.5 V |
| پین 183 | I/O — User I/O (bank 4) |
| پین 184 | I/O — User I/O (bank 4) |
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| پین 237 | I/O — User I/O (bank 4) |
| پین 238 | I/O — User I/O (bank 4) |
| پین 239 | GND — Ground (bank 4) |
| پین 240 | VCCINT — Core supply 3.3 V |
کاربردهای معمول
EPF10K100ARC240-3N مناسب است برای 6 کاربردs: Telecom Bridge and Router Line Cards, Industrial PLC and Motion-Control Backplanes, Legacy ASIC Prototyping and Emulation, Military and Aerospace Single-Board Computers, Embedded DSP Pre- and Post-Processing, Legacy Test and Measurement Instrumentation.
Telecom Bridge and Router Line Cards
The EPF10K100ARC240-3N fits telecom bridge and router line-card designs that require 100K gates of glue logic plus 24 Kbits of on-chip memory for FIFO buffering between PHY and switch fabric. With 189 user I/Os and multi-voltage I/O support (5.0/3.3/2.5 V), it can directly interface legacy TTL/CMOS peripherals, 5 V PCI buses, and 3.3 V ASICs without external level shifters. The 12 EABs provide synchronous dual-port RAM for cell buffering, and the -3 speed grade delivers sufficient Fmax for 77 MHz UTOPIA / POS-PHY interfaces. Placed on the line card between the framer and the network processor, it replaces 5-7 discrete TTL/CMOS CPLD/ASIC devices, simplifying board layout.
پیشنهادی
Industrial PLC and Motion-Control Backplanes
The EPF10K100ARC240-3N is widely deployed in industrial PLC and motion-controller backplanes that need deterministic glue logic between microcontrollers, encoder counters, and stepper/servo drives. Its 4,992 logic elements implement multi-axis state machines, PWM generators, and encoder quadrature decoders, while the 24 Kbits of on-chip RAM provide lookup tables for motion profiles. The 189 user I/Os accommodate 6-8 axes of encoder + limit-switch wiring, and the multi-voltage I/O (5.0/3.3 V) tolerates the wide logic swings found on legacy industrial backplanes. Operating from 0 °C to 70 °C commercial range, it suits cabinet-mounted controllers; pair with the FLEX 10KA -3 speed grade to meet 50 µs servo-loop update intervals.
پیشنهادی
Legacy ASIC Prototyping and Emulation
Engineers use the EPF10K100ARC240-3N as an ASIC prototype vehicle for designs in the 50K-100K gate range, where the 4,992 LEs and 12 EABs (24 Kbits of RAM) provide ample capacity to emulate medium-complexity ASICs with embedded SRAM blocks. The -3 speed grade delivers timing margins adequate for 33 MHz PCI or 50 MHz CPU-bus emulation, and the 240-RQFP exposed-pad package simplifies bring-up with standard QFP sockets. Quartus II and MAX+PLUS II flows accept the same VHDL/Verilog that targets the final ASIC, enabling rapid retargeting once silicon is available. Designers can also use the JTAG-based in-system programmability (ISP) for fast design-iteration cycles.
پیشنهادی
Military and Aerospace Single-Board Computers
The EPF10K100ARC240-3N is qualified for legacy military and aerospace single-board computers that require deterministic glue logic between PowerPC/68040 processors, MIL-STD-1553 bus interfaces, and Flash/ SRAM banks. With 189 user I/Os, it can drive the address/data buffering for 32-bit processor buses while providing ChipSelect decoders and wait-state generators. The 0.3 µm CMOS process and 3.3 V core deliver the radiation-tolerance margin that older defense programs require, and the 240-RQFP exposed-pad package simplifies thermal management in conduction-cooled enclosures. Choose the EPF10K100ARI240-3N industrial-temperature variant when -40 °C to +85 °C operation is mandatory.
پیشنهادی
Embedded DSP Pre- and Post-Processing
The EPF10K100ARC240-3N's 12 EABs and 4,992 logic elements provide sufficient capacity for FIR filter pre/post-processing in embedded DSP data paths, complementing a fixed-point DSP processor such as the TMS320C50 or ADSP-218x. EABs implement dual-port RAM coefficient buffers while LEs provide the multiplier array logic for 16-bit fixed-point FIRs at audio sample rates. The 240-RQFP package exposes enough I/Os to fan out to multiple DSP host ports, and the -3 speed grade sustains 100 kHz FIR throughput on 8-channel audio. Use Quartus II FIR Compiler IP to map coefficient sets and exploit the FLEX 10KA architecture's predictable timing closure.
پیشنهادی
Legacy Test and Measurement Instrumentation
The EPF10K100ARC240-3N integrates the timing generator, pattern sequencer, and bus-interface logic in legacy test and measurement instruments such as logic analyzers, oscilloscope acquisition front-ends, and protocol analyzers. Its 189 user I/Os drive high-density probe pods directly, and the 12 EABs implement deep FIFO capture buffers for transient analysis. The multi-voltage I/O (5.0/3.3/2.5 V) interfaces both legacy TTL probe pods and modern 2.5 V ASIC PHYs without level translation. Designers standardize on the FLEX 10KA family because MAX+PLUS II-generated programming files remain bit-compatible across instrument revisions, simplifying field upgrades.
پیشنهادی
خلاصه محصولات پیشنهادی
داده‌های مرجع مهندسی برای EPF10K100ARC240-3N — مقایسه، راهنمای طراحی و اطلاعات انطباق.
راهنمای انتخاب
مقایسه با جایگزین‌ها
| پارامتر | این محصول | EPF10K100ARC240-1 | EPF10K100ARC240-2 | EPF10K100AFC484-2N | EPF10K100ABI356-3 | EPF10K100ABC356-2 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 240-RQFP (BFQFP exposed pad) | 240-RQFP (BFQFP exposed pad) - same | 240-RQFP (BFQFP exposed pad) - same | 240-RQFP (BFQFP exposed pad) - same | 356-BGA - different package | 356-BGA - different package |
| System Gates | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 |
| Logic Elements | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 |
| Speed Grade | -3 (fastest) | -1 (slowest) | -2 (mid) | -2 (mid) | -3 (fastest) | -2 (mid) |
| On-chip RAM | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits |
| Core Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
تفاوت‌های کلیدی
- -3 fastest speed grade in 240-RQFP exposed-pad FLEX 10KA (در مقابلEPF10K100ARC240-1)
- Same silicon as EPF10K100ARC240-3 with lead-free (N-suffix) assembly (در مقابلEPF10K100ARC240-3)
- 240-RQFP exposed-pad package for top-side cooling (در مقابلEPF10K100ARI240-3N)
یادداشت‌های طراحی
The EPF10K100ARC240-3N core runs from a 3.3 V VCCINT rail while VCCIO can be tied to 5.0 V, 3.3 V, or 2.5 V depending on the I/O bank. Provide at least 4 decoupling capacitors (0.1 µF ceramic) within 5 mm of each VCCINT/VCCIO pin pair and a 10 µF bulk capacitor at the board entry point. Multi-voltage I/O banks require separate VCCIO pins for each bank; never tie 5 V VCCIO to a 2.5 V-only peripheral bus because the PCI-compliant 5 V tolerance only applies to inputs, not to VCCIO itself.
The 240-RQFP exposed-pad package dissipates heat primarily through the exposed die-attached pad on the bottom of the package. Estimated: with all 4,992 LEs switching at 50 MHz into 189 I/Os, the die consumes approximately 0.5 W-1.0 W. The exposed pad should be soldered to a copper pour (≥ 1 sq inch) on the top layer with thermal vias to inner ground planes. Without this thermal pad soldered, junction temperature can rise 20 °C-30 °C above ambient at full utilization, pushing the 0 °C-to-70 °C commercial range toward its limit.
Place the EPF10K100ARC240-3N's configuration memory (typically an EPC2 or EPC1 configuration device) within 50 mm trace length to minimize DCLK skew. Use 22 Ω series damping resistors on high-fanout clock outputs (e.g., global clock nets driving ≥ 8 LABs) to control simultaneous switching noise (SSN) on the 189 user I/Os. Keep at least 4 PCB layers with a continuous ground plane adjacent to the FPGA to provide low-impedance return paths for the 5 V-tolerant I/O signals.
Do not confuse the EPF10K100ARC240-3N with the EPF10K100ARI240-3N: although both are FLEX 10KA devices with 4,992 LEs and 240 pins, the RQFP exposed-pad pinout and commercial temperature grade of the ARC240 variant differ from the RQFP non-exposed-pad pinout and industrial temperature grade of the ARI240 variant. Substituting one for the other requires PCB rework. Also, do not exceed the 3.3 V VCCINT maximum; the legacy FLEX 10KA family is not 5 V-tolerant on the core supply.
اطلاعات انطباق
Trailing 'N' suffix indicates Pb-free (lead-free) assembly finish, consistent with RoHS intent. RoHS/REACH compliance status not explicitly stated in the verified web data; [DATA_NEEDED: full RoHS / REACH / halogen-free documentation]. FLEX 10KA family is commercial-temperature grade (0 °C to 70 °C) and not AEC-Q100 qualified - not recommended for new automotive designs.
