EPF10K30EFC256-2 - FLEX 10KE FPGA, 30K Gates, 256-FBGA | Altera
MPN: EPF10K30EFC256-2 ✗ اختتامِ زندگیEPF10K30EFC256-2 جائزہ
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and embedded memory that designers can re-configure in-system via SRAM lookup tables. Within the broader hierarchy, FPGAs sit alongside CPLDs (Complex Programmable Logic Devices) as the high-density branch of programmable logic; the FLEX 10KE family is a 0.22 um CMOS SRAM-based architecture that pioneered embedded array block (EAB) integration, foreshadowing modern System-on-a-Programmable-Chip (SoPC) designs. The EPF10K30E distinguishes itself with embedded dual-port RAM blocks, a 2.5 V core, and PCI compliance for bus-interface applications.
Key features include 1728 logic elements, 24,576 RAM bits distributed across embedded array blocks (EABs), 216 logic array blocks (LABs), 176 usable I/O pins, and a peak operating frequency around 200 MHz according to family specifications. The FLEX 10KE architecture supports in-system programmability via the IEEE 1149.1 JTAG interface and passive serial configuration, enabling rapid prototyping. With SRAM-based configuration, the device must be reconfigured at each power-up using an external configuration PROM such as the EPC2 or EPC8 series.
The EPF10K30E combines look-up-table (LUT)-based logic cells with embedded dual-port RAM, making it suitable for glue logic, bus interfaces, custom state machines, and moderate-density signal processing front-ends. Its embedded array blocks can implement FIFOs, ROM tables, and small DSP functions without consuming general-purpose logic. The 0.22 um CMOS process at 2.5 V core gives it better power efficiency than earlier 5 V FLEX 10K devices while preserving a familiar Quartus/MAX+PLUS II design flow.
Typical applications include PCI bus interfaces, telecommunications line cards, industrial control logic, glue logic for ASIC/ASSP replacement, and prototype systems that need a moderate gate count and a high I/O count. The 176 I/O pins accommodate wide data buses and parallel peripheral interfaces, while the embedded RAM blocks enable protocol buffering and lookup-table acceleration.
When designing with this FPGA, ensure the configuration PROM is sized appropriately for the bitstream and that JTAG chain integrity is validated before relying on in-system updates. Because the FLEX 10KE family is a mature, mature-generation part, lead-time risk is significant; verify distributor stock and lifecycle status before committing to a long-lifecycle design.
کے لیے ڈراپ اِن متبادل EPF10K30EFC256-2 — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں EPF10K30EFC256-2 (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Operating Temperature, Speed Grade, Package, Process Technology, Core Supply Voltage.
EPF10K30EFC256-2N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPF10K30EFC256-1
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPF10K30EFC256-1X
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPF10K30EFC256-2X
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPF10K30EFC256-3N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPF10K30EFC256-2 زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Family | FLEX 10KE |
| Logic Elements / Cells | 1728 |
| System Gates | 30,000 |
| Embedded RAM Bits | 24,576 |
| Logic Array Blocks (LABs) | 216 |
| User I/Os | 176 |
| پیکیج | 256-FBGA (17x17 mm) |
| Core Supply Voltage | 2.375 V to 2.625 V (typ 2.5 V) |
| Internal Operating Frequency | 80 MHz |
| Propagation Delay | 0.6 ns |
| Technology Node | 0.22 um CMOS |
| آپریٹنگ درجہ حرارت | 0 C to 70 C (commercial) |
| Configuration Method | SRAM, JTAG (IEEE 1149.1), Passive Serial |
| Speed Grade | -2 (commercial, mid-speed) |
EPF10K30EFC256-2 پن کنفیگریشن
| پن A1 | I/O — User I/O pin (bank 1) |
| پن B2 | I/O — User I/O pin (bank 1) |
| پن C3 | I/O — User I/O pin (bank 2) |
| پن D4 | VCCIO — I/O supply voltage |
| پن E5 | I/O — User I/O pin (bank 3) |
| پن F6 | I/O — User I/O pin (bank 4) |
| پن G7 | GND — Ground |
| پن H8 | VCCINT — Core supply voltage 2.5 V |
| پن J9 | I/O — User I/O pin (bank 5) |
| پن K10 | I/O — User I/O pin (bank 5) |
| پن L11 | I/O — User I/O pin (bank 6) |
| پن M12 | I/O — User I/O pin (bank 6) |
| پن N13 | VCCIO — I/O supply voltage |
| پن P14 | I/O — User I/O pin (bank 7) |
| پن R15 | I/O — User I/O pin (bank 7) |
| پن T16 | I/O — User I/O pin (bank 8) |
عام استعمالات
EPF10K30EFC256-2 کے لیے موزوں ہے 6 ایپلیکیشنs: PCI Bus Interface Bridge, Telecommunications Line Card Logic, Industrial Control Glue Logic, ASIC/ASSP Prototype Replacement, DSP and Signal Processing Front-End, Legacy System Modernization.
PCI Bus Interface Bridge
The EPF10K30EFC256-2 is well-suited for PCI bus interface bridges thanks to its 176 user I/Os and FLEX 10KE PCI-compliant I/O structure. The 1728 logic elements handle address decoding, transaction forwarding, and bus arbitration while the 24,576 RAM bits provide FIFO buffering for write/read data paths. Operating at 2.5 V core with 3.3/5.0 V PCI I/O tolerance, it directly interfaces to PCI slots without external level shifters. Designers can implement a 32-bit/33 MHz PCI target or master in a single device, replacing discrete TTL glue logic. Its 0.6 ns propagation delay ensures register-to-pin timing margins within the 33 MHz PCI specification, while the JTAG configuration interface simplifies in-system firmware updates during bridge bring-up.
تجویز کردہ
Telecommunications Line Card Logic
Telecommunications line cards benefit from the EPF10K30EFC256-2's embedded dual-port RAM blocks and 30K system gate density. The EABs implement small protocol FIFOs, HDLC framer lookup tables, and channel-associated signalling buffers without consuming LUT resources. With 176 user I/Os, the device routes directly to T1/E1 framers, LIUs, and backplane connectors. The 2.5 V core plus commercial 0-70 C temperature range fits central-office equipment thermal envelopes. Its 80 MHz internal frequency supports aggregate data rates up to 160 Mbps on parallel TDM buses. JTAG-based in-system programming accelerates line-card bring-up and field upgrades across deployed telecom infrastructure.
تجویز کردہ
Industrial Control Glue Logic
The EPF10K30EFC256-2 replaces multiple 17xx-series TTL/CMOS glue-logic chips in industrial control systems, integrating address decoding, custom state machines, and bus arbitrators into one SRAM-programmable device. Its 1728 logic elements typically absorb what would otherwise be 8-12 discrete 74-series packages, saving board area and improving noise immunity. The 176 I/Os handle multi-axis motor encoder inputs, parallel DAC/ADC interfaces, and CAN/RS-485 transceiver handshaking. The 2.5 V core plus 5.0 V-tolerant I/Os simplify mixed-voltage retrofits into existing 5 V industrial designs. JTAG configuration lets field engineers update control firmware without removing the board from service.
تجویز کردہ
ASIC/ASSP Prototype Replacement
Designers use the EPF10K30EFC256-2 as a fast-turn prototype before committing to an ASIC/ASSP mask set, validating control logic, data paths, and timing on real hardware within weeks. With 30K system gates and embedded RAM, the device closely emulates mid-complexity custom silicon, while the 256-FBGA package fits standard 17x17 mm land patterns used by many production ASICs. Iterative design changes are downloaded via JTAG in seconds versus ASIC re-spins costing months. Once volume justifies NRE, the verified HDL migrates directly to a foundry target, accelerating time-to-market. The mature Quartus/MAX+PLUS II toolchain lowers the entry barrier for legacy design teams.
تجویز کردہ
DSP and Signal Processing Front-End
The EPF10K30EFC256-2's 24,576 RAM bits and 1728 logic elements support small DSP front-end functions such as digital filters, FFT twiddle-factor ROMs, and sample-rate converters. Each EAB implements 256x8 or 512x4 dual-port memories, enabling coefficient storage for FIR filters or data buffering between cascaded processing stages. At 80 MHz, the device sustains 80 MSPS on 16-bit datapaths, suitable for instrumentation and baseband processing. Designers implement multipliers via LUT-based shift-and-add trees or pair the FPGA with an external multiplier IC. Its SRAM configurability allows algorithm tuning in-system without board rework.
تجویز کردہ
Legacy System Modernization
The EPF10K30EFC256-2 is commonly deployed to extend the life of legacy systems whose original FPGAs have reached end-of-life or supply exhaustion. Maintenance teams use it to replicate obsolete 17-series logic arrays in industrial controllers, medical instrumentation, and military electronics. Its 256-FBGA footprint and standard FLEX 10KE pinout fit many legacy board layouts, enabling drop-in retrofits. Rochester Electronics and authorized brokers maintain traceable inventory for programs requiring long-term support. By standardizing on this mature family, designers secure parts through 2030+ for sustaining engineering programs that cannot tolerate re-design cycles.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا EPF10K30EFC256-2 — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | EPF10K30EFC256-2N | EPF10K30EFC256-1 | EPF10K30EFC256-1X | EPF10K30EFC256-2X | EPF10K30EFC256-3N |
|---|---|---|---|---|---|---|
| Package | 256-FBGA (17x17 mm) | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Family | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE |
| Logic Elements | 1728 | 1728 | 1728 | 1728 | 1728 | 1728 |
| Speed Grade | -2 (commercial, mid-speed) | -2 (lead-free) | -1 (slower) | -1 industrial option | -2X (faster) | -3 (slowest) |
| Core Voltage | 2.5 V (2.375-2.625 V) | 2.5 V (2.375-2.625 V) | 2.5 V (2.375-2.625 V) | 2.5 V (2.375-2.625 V) | 2.5 V (2.375-2.625 V) | 2.5 V (2.375-2.625 V) |
| User I/Os | 176 | 176 | 176 | 176 | 176 | 176 |
| Lead-Free | No | Yes (Pb-free) | No | No | No | Yes (Pb-free) |
| Lifecycle Status | Obsolete / Mature | Obsolete / Mature | Obsolete / Mature | Obsolete / Mature | Obsolete / Mature | Obsolete / Mature |
اہم امتیازی خصوصیات
- Balanced -2 speed grade for commercial timing (بمقابلہEPF10K30EFC256-1)
- Standard SnPb terminal finish (vs Pb-free -2N) (بمقابلہEPF10K30EFC256-2N)
- Mature FLEX 10KE family with broad third-party support (بمقابلہEPF10K30ATC144-3)
ڈیزائن نوٹس
Estimated: The EPF10K30EFC256-2 draws approximately 150-300 mA from the 2.5 V core supply at full activity (1728 LEs active, 80 MHz toggling). Add a 10 uF bulk plus 0.1 uF ceramic decoupling capacitor pair per VCCINT ball and a similar network on each VCCIO bank. Sequence VCCINT before VCCIO during power-up per Altera's FLEX 10KE handbook to prevent I/O latch-up. The 256-FBGA package has excellent thermal performance but still requires thermal vias under the center balls for designs sustaining >85% utilization.
Use a 256-ball BGA land pattern on the PCB with 1.0 mm pitch (17x17 mm body). Route signals on inner layers using microstrip/stripline topology with 50 ohm controlled impedance. Provide a solid ground plane on layer 2 directly beneath the device to minimize return-path inductance. JTAG signals (TDI, TDO, TMS, TCK, TRST) must be guarded with series 33 ohm resistors near the FPGA pins and should not exceed 4 inches total trace length to ensure reliable IEEE 1149.1 boundary-scan operation.
Critical: The FLEX 10KE is SRAM-based - the configuration is lost on power-down. Always pair this FPGA with a configuration PROM (EPC2 or EPC8 series) or external microcontroller to load the bitstream at every power-up. Do not assume JTAG programming is sufficient for production; field returns from unprogrammed devices are common. Also verify the configuration mode (Passive Serial vs JTAG) MSEL pin strapping matches your design intent before committing to layout - mismatches cause silent configuration failures.
تعمیل کی معلومات
RoHS and REACH compliance data not provided in verified sources. The -2 suffix indicates standard SnPb finish (not lead-free); the -2N variant is the lead-free equivalent. AEC-Q100 not applicable for commercial-grade FPGA. Designers needing Pb-free compliance should select EPF10K30EFC256-2N.
