Intel

EPF10K30EFC256-2N - FLEX 10KE FPGA 30K Gates 256-BGA | Intel / Altera

MPN: EPF10K30EFC256-2N ✗ اختتامِ زندگی

256-ball FineLine BGA (PBGA256), 17 x 17 mm, 1.0 mm pitch Package -2N (mid-grade, 0.6 ns) Speed

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مقدار

EPF10K30EFC256-2N جائزہ

The Intel (formerly Altera) EPF10K30EFC256-2N is a member of the FLEX 10KE embedded programmable logic family, delivering approximately 30,000 typical gates with 1,728 logic elements (LEs) and 24,576 RAM bits in a 256-ball FineLine BGA package (17 x 17 mm, 1.0 mm pitch). It is implemented in a 0.22 µm CMOS SRAM process and supports in-system configuration via a built-in serial configuration interface. The '2N' speed grade corresponds to a propagation delay of approximately 0.6 ns at the register-to-register path, with a commercial operating temperature range of 0 °C to +70 °C.

A FLEX 10KE device is an SRAM-based FPGA that combines a logic array fabric with an Embedded Array Block (EAB), enabling true System-on-a-Programmable-Chip (SOPC) integration. Within the broader taxonomy, an FPGA is a programmable logic device (PLD) that sits alongside CPLDs in the digital IC hierarchy, and is itself a sub-family of the wider semiconductor category. FLEX 10KE parts were Altera's first family to embed true dual-port RAM blocks alongside distributed logic, an architecture later inherited by the APEX and Cyclone families.

Key features include 246 user I/O pins, six dedicated clock input pins, support for multiple I/O standards (LVTTL, LVCMOS, PCI), 4-input look-up-table logic elements, and Cascade chains for high-fan-in functions. The device supports MultiVolt I/O for interfacing to 5.0 V, 3.3 V, and 2.5 V buses. In-system programmability is provided through the passive serial, active serial, or JTAG configuration schemes.

Architecture is built on a SRAM-based array of logic elements arranged in Logic Array Blocks (LABs), each LAB containing eight LEs. The Embedded Array Blocks deliver up to 4 Kbits of true dual-port RAM with parity, allowing designers to instantiate memory blocks without consuming LE-based distributed RAM. FastTrack interconnect provides predictable routing delays across die corners.

Typical applications include industrial glue logic, telecommunications backplane bridging, legacy PCI interface bridges, prototype ASIC emulation, and retro-computing or industrial-control retrofits where replacement of an obsolete ASIC is impractical. The BGA-256 footprint is shared with many newer Altera/Intel FPGAs, easing PCB migration.

When designing with this part, note that it is a discontinued (Obsolete) component as of 2026-09-11 and should be sourced only from authorized aftermarket inventory. Designers should also plan for migration to an active FLEX 10KE variant or a Cyclone-equivalent device, since long-term availability is limited.

This page synthesizes distributor stock indicators, drop-in equivalents, and practical migration guidance not found in the original Altera FLEX 10KE datasheet.

کے لیے ڈراپ اِن متبادل EPF10K30EFC256-2N — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔

اس سیریز میں مختلف ورژن

اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں EPF10K30EFC256-2N (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Package, Operating Temperature, Process Technology, Speed Grade, Logic Elements / Cells.

EPF10K100EFC256-2

Intel

Package: 256-FBGA (FineLine BGA, 17 x 17 mm)

Process Technology: 0.22 µm CMOS SRAM

Logic Elements / Cells: 4,992 (49,152 user logic elements)