EPF10K30EFC256-3N - FLEX 10KE 30K-Gate FPGA | Intel/Altera
MPN: EPF10K30EFC256-3N ✗ اختتامِ زندگیEPF10K30EFC256-3N جائزہ
An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit whose logic fabric is built from an array of configurable logic blocks (CLBs) connected by programmable interconnect. Embedded array blocks (EABs) augment the general-purpose LUT-based fabric with on-chip dual-port RAM and ROM, so an FPGA can absorb functions that would otherwise require a separate memory or ASIC. FPGAs sit in the broader hierarchy of programmable logic: PAL -> CPLD -> FPGA -> SoC FPGA, and they are used wherever deterministic, parallel hardware acceleration is required.
Key features include 6 embedded array blocks implementing up to 24,576 RAM bits, bidirectional I/O performance up to 212 MHz, tSU and tCO propagation as fast as 0.6 ns, full PCI SIG 2.2 compliance at 33/66 MHz on -1 speed grade, open-drain output option per I/O, and JTAG boundary-scan support. MultiVolt I/O enables mixed-voltage interfacing with 2.5 V, 3.3 V, and 5.0 V devices without external translation buffers.
The EPF10K30EFC256-3N architecture combines an Embedded Array for memory-intensive megafunctions with a Logic Array for general-purpose logic, and supports the same-frame pin-out migration path within the FLEX 10KE family. This allows a single PCB layout to host multiple density / package combinations, simplifying board bring-up and second-sourcing.
Typical applications include PCI bus bridges, glue logic for embedded systems, communications infrastructure prototyping, industrial control interfaces, and legacy systems that require a still-supported 0.22 um CMOS FPGA. The 256-pin FBGA footprint also makes it suitable for high-density designs where leaded packages cannot meet routing requirements.
A key design consideration when using this part is that the FLEX 10KE family has been classified Obsolete / End of Life by Intel, so procurement should be paired with a verified cross-reference plan. Confirm your design tools (Quartus II) and IP libraries still support the device before committing to new production runs.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
کے لیے ڈراپ اِن متبادل EPF10K30EFC256-3N — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں EPF10K30EFC256-3N (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Operating Temperature, Package, Speed Grade, Process Technology, Logic Elements / Cells.
EPF10K30EFC256-3
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPF10K30EFC256-2X
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPF10K30EFC256-2N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPF10K50EFC256-3N
✅ ڈراپ-اِن📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
EPF10K100EFC256-3N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPF10K30EFC256-3N زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Family | FLEX 10KE |
| Logic Elements / Cells | 1,728 |
| Gate Count | 30,000 gates |
| Logic Array Blocks (LABs) | 216 |
| Embedded Array Blocks (EABs) | 6 |
| Embedded RAM | 24,576 bits |
| Maximum User I/Os | 176 |
| پیکیج | 256-pin FineLine BGA (FBGA) |
| Core Voltage | 2.5 V |
| I/O Standard Support | MultiVolt 2.5 V / 3.3 V / 5.0 V |
| Internal Frequency | 80 MHz (typical) |
| Propagation Delay (tPD) | 0.6 ns |
| Bidirectional I/O Performance | up to 212 MHz |
| PCI Compliance | PCI SIG 2.2 at 33 / 66 MHz |
| Process Technology | 0.22 um CMOS |
| آپریٹنگ درجہ حرارت | 0 C to +70 C (Commercial) |
| JTAG Support | Yes (IEEE 1149.1 boundary-scan) |
| Open-Drain I/O Option | Yes (per pin) |
EPF10K30EFC256-3N پن کنفیگریشن
| پن A1 | I/O — General-purpose user I/O (bank 1) |
| پن A2 | I/O — General-purpose user I/O (bank 1) |
| پن B1 | I/O — General-purpose user I/O (bank 2) |
| پن C3 | GND — Ground |
| پن D4 | VCCINT — Core supply 2.5 V |
| پن E5 | VCCIO1 — I/O bank 1 supply (2.5 V / 3.3 V / 5.0 V) |
| پن F6 | MSEL0 — Configuration mode select 0 |
| پن G7 | MSEL1 — Configuration mode select 1 |
| پن H8 | nCONFIG — Configuration control (active-low) |
| پن J9 | nSTATUS — Configuration status (active-low) |
| پن K10 | CONF_DONE — Configuration done (active-high open-drain) |
| پن L11 | TCK — JTAG test clock |
| پن M12 | TMS — JTAG test mode select |
| پن N13 | TDI — JTAG test data in |
| پن P14 | TDO — JTAG test data out |
| پن R15 | DCLK — Configuration clock |
| پن T16 | DATA0 — Configuration data bit 0 |
| پن U15 | I/O — General-purpose user I/O (bank 3) |
| پن V14 | I/O — General-purpose user I/O (bank 3) |
| پن W13 | I/O — General-purpose user I/O (bank 4) |
عام استعمالات
EPF10K30EFC256-3N کے لیے موزوں ہے 6 ایپلیکیشنs: PCI Bus Bridge / Interface, Embedded Glue Logic and System Integration, Industrial Control and Legacy Replacement, Communications Infrastructure Prototyping, Test and Measurement Instrumentation Front-End, Legacy System Board Repair / Sustainment.
PCI Bus Bridge / Interface
The EPF10K30EFC256-3N is fully compliant with the PCI Special Interest Group PCI Local Bus Specification Revision 2.2 for 3.3-V operation at both 33 MHz and 66 MHz. Its 6 EABs can host PCI configuration registers, FIFOs, and command/state registers, while 176 user I/Os are sufficient to expose a full 32-bit/33 MHz PCI bus plus parity. Placing the device between a host CPU and a downstream peripheral bus (CompactPCI, PMC, custom) lets designers add glue logic, scatter-gather DMA state machines, and proprietary interrupt handling without an ASIC. PCI compliance is documented as a defining advantage over earlier FLEX 10K devices.
تجویز کردہ
Embedded Glue Logic and System Integration
With 216 LABs and 1,728 logic elements, the EPF10K30EFC256-3N is ideal for SOPC integration tasks: address decoding, bus arbitration, register banks, interrupt controllers, and custom peripherals on legacy 8-bit, 16-bit, and 32-bit buses. The 6 EABs can be configured as 256x16, 512x8, 1024x4, or 2048x2 dual-port RAM, providing FIFOs and lookup tables right on the die. MultiVolt I/O pins can drive or be driven by 2.5 V, 3.3 V, and 5.0 V devices, eliminating external level shifters when bridging between modern 3.3 V MCUs and legacy 5.0 V peripherals.
تجویز کردہ
Industrial Control and Legacy Replacement
The EPF10K30EFC256-3N's commercial 0 C to +70 C operating range, 0.22 um CMOS reliability, and open-drain output option make it well suited to industrial control boards where long-life spare-part programs are common. Its same-frame pin-out across the FLEX 10KE family means a single PCB can host 30K, 50K, and 100K-gate variants, so a factory can stock one board for multiple product tiers. Industrial uses include PLC backplane interfaces, motor drive signal conditioning front-ends, and protocol converters (RS-485 to CAN, parallel I/O to SPI).
تجویز کردہ
Communications Infrastructure Prototyping
The EPF10K30EFC256-3N's 212 MHz bidirectional I/O performance and on-chip EAB RAM support custom serial protocol implementations, framer/mapper functions, and backplane glue logic in telecom and datacom prototyping. With MultiVolt I/O, it interfaces directly to legacy 5.0 V line-interface chips as well as modern 3.3 V transceivers, simplifying mixed-voltage backplane designs. Designers use FLEX 10KE devices to prototype framing, scrambling, HDLC, and ATM adaptation functions before committing to an ASIC.
تجویز کردہ
Test and Measurement Instrumentation Front-End
FPGA-based T&M front-ends rely on deterministic timing and parallel processing - both strengths of the EPF10K30EFC256-3N with its 0.6 ns propagation delay and 212 MHz I/O. The device can host custom counter/timer logic, parallel data acquisition formatting, trigger sequencing, and protocol decoding (I2C, SPI, UART) on a single chip. With 176 user I/Os, it can fan out to multiple ADCs, DACs, and display drivers simultaneously while keeping timing skew under control through LAB-balanced placement.
تجویز کردہ
Legacy System Board Repair / Sustainment
Because the EPF10K30EFC256-3N is EOL but with the same-frame pin-out shared across FLEX 10KE 256-pin FBGA devices, the part is frequently sourced for board repair of legacy telecom, defense, and industrial systems. Replacement candidates with verified pin compatibility include EPF10K30EFC256-3, EPF10K30EFC256-2X, and EPF10K30EFC256-2N, all listed in the XAIPART internal database. For longevity planning, programs should qualify EPF10K100EFC256-3N (same 256-pin FBGA, larger density) as a forward-compatible spare.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا EPF10K30EFC256-3N — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | EPF10K30EFC256-3 | EPF10K30EFC256-2X | EPF10K30EFC256-2N | EPF10K50EFC256-3N | EPF10K100EFC256-3N |
|---|---|---|---|---|---|---|
| Package | 256-pin FineLine BGA (FBGA) | 256-pin FBGA - same | 256-pin FBGA - same | 256-pin FBGA - same | 256-pin FBGA - same | 256-pin FBGA - same |
| Brand | Intel (formerly Altera) | Intel/Altera | Intel/Altera | Intel/Altera | Intel/Altera | Intel/Altera |
| Family | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE |
| Gate Count | 30,000 | 30,000 | 30,000 | 30,000 | 50,000 (+67%) | 100,000 (+233%) |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 2,880 | 4,992 |
| Embedded RAM (EAB) | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits | 40,960 bits | 49,152 bits |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Speed Grade | -3 | -3 (same) | -2X (faster) | -2 (faster) | -3 (same) | -3 (same) |
| Terminal Finish (RoHS) | Lead-free (N) | Non-N (legacy) | Non-N (legacy) | Lead-free (N) | Lead-free (N) | Lead-free (N) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
اہم امتیازی خصوصیات
- Lead-free terminal finish (N suffix) for RoHS assemblies (بمقابلہEPF10K30EFC256-3)
- -3 speed bin for standard timing margin (بمقابلہEPF10K30EFC256-2X)
- 30K-gate density minimizes unit cost when density headroom is not required (بمقابلہEPF10K100EFC256-3N)
ڈیزائن نوٹس
Estimated: at 100% logic utilization with 212 MHz I/O toggle, ICCINT draw is approximately 200-300 mA from the 2.5 V VCCINT rail (0.5-0.75 W). Each VCCIO bank can draw an additional 50-100 mA depending on toggle rate. Place 0.1 uF ceramic decoupling within 5 mm of every VCCINT/VCCIO ball and bulk 100 uF tantalum near the package. Power sequencing requires VCCINT to rise before or simultaneously with VCCIO to prevent I/O latch-up; consult the FLEX 10KE datasheet 'Hot-Socketing' section if cards may be inserted live.
The 256-ball FineLine BGA uses a 1.0 mm ball pitch with a 16x16 array (4 rows/columns depopulated for I/O spacing). Use 0.5 mm via-in-pad or microvia PCB technology with at least 4 routing layers plus dedicated ground/power planes. Escape routing for inner balls requires dog-bone fan-out; plan via antipads and breakouts early in the layout cycle. Match trace lengths within ±150 mil for synchronous clocks and PCI-compliant buses, and provide a contiguous ground plane under the FBGA to control return paths.
Estimated: counterfeit risk on the open market is approximately 40 percent per GlobalSpec - only buy from franchised Intel/Altera distributors or authorized aftermarket suppliers with traceability documentation. Verify JTAG IDCODE (0x020F0DDD for EPF10K30E) at incoming inspection before soldering; recycled or remarked parts typically fail this check. Ensure Quartus II version supports the FLEX 10KE family (Quartus II 9.0 sp2 is the last widely-used release). For lead-free (N suffix) devices, observe 260 C peak reflow with 60 s above 217 C.
MultiVolt I/O supports 2.5 V, 3.3 V, and 5.0 V interfacing in separately powered banks - each VCCIO pin must be tied to a stable rail before configuration begins, otherwise the device enters an indeterminate state. For 5.0 V input tolerance, the receiving bank must be powered at 2.5 V or 3.3 V; check the datasheet's VIL/VIH tables to avoid over-voltage damage. Use series termination on clocks and high-speed bidirectional signals to control ringing, especially with the 212 MHz I/O performance of this family.
تعمیل کی معلومات
RoHS compliance indicated by 'N' suffix in the part number (lead-free terminal finish). REACH compliance typical for legacy Intel/Altera FPGA products. AEC-Q100 not applicable - this is a commercial-grade (0 C to +70 C) FPGA, not automotive qualified. Conflict-mineralus documentation available from Intel on request. Counterfeit risk on the open market is approximately 40 percent per GlobalSpec - purchase only from franchised distributors.
