MPC8535AVJANGA - PowerQUICC III 800MHz SoC MPU | NXP
MPN: MPC8535AVJANGA ⚠ آخری بار خریداریMPC8535AVJANGA جائزہ
A PowerQUICC III SoC is a system-on-chip that combines a Power Architecture processor core with dedicated communications engines and rich peripheral IP, bridging general-purpose compute with packet processing and high-speed serial I/O. It sits in the product hierarchy MPU -> microprocessor -> integrated processor -> SoC -> semiconductor, and is widely deployed in networking and telecom equipment where deterministic throughput and integrated memory and I/O controllers reduce bill-of-materials cost.
Key features include hardware support for DDR2/DDR3 memory with ECC, integrated SDHC, PCI and PCI Express interfaces, SATA, Gigabit Ethernet, USB 2.0, and an IEEE 1149.1 JTAG boundary-scan interface. The device is fabricated in a 90 nm copper CMOS process and supports core voltages of 1.5 V, 1.8 V, 2.5 V, and 3.3 V with industrial temperature grade 0 C to 90 C. According to the NXP product brief, the MPC8535E targets routers, switches, wireless base stations, and industrial imaging or printing applications that require gigahertz-class processing.
The architecture pairs the e500 superscalar core with a high-bandwidth system bus and dedicated DMA and security accelerators, allowing wire-speed packet handling on GbE and PCI Express ports. The integrated memory controller supports up to DDR3 with ECC for high-availability systems, and the on-chip peripherals expose multiple RGMII/SGMII Ethernet paths plus USB and SATA ports for storage and peripheral attachment.
Typical applications include enterprise and SMB routers, multi-layer switches, network attached storage, wireless base-station control-plane processing, and industrial automation controllers. The combination of Power Architecture compatibility and integrated SerDes-based I/O makes it a long-life workhorse for embedded networking designs.
When designing with this device, ensure proper PCB stack-up for the 783-ball FC-PBGA, provision adequate bulk decoupling around the DDR memory interface, and follow the reference schematics in the NXP hardware specifications document. JTAG boundary scan via IEEE 1149.1 is strongly recommended for production board test.
This page consolidates NXP datasheet specifications, distributor availability, and drop-in compatible alternatives for engineers sourcing the MPC8535AVJANGA in long-life or last-time-buy programs.
کے لیے ڈراپ اِن متبادل MPC8535AVJANGA — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں MPC8535AVJANGA (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف RoHS Status, Core Architecture, Data Bus Width, Series, Operating Temperature.
MPC8535AVTANGA
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →MPC8535BVJANGA
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →MPC8535CVJANGA
✅ ڈراپ-اِن📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
MPC8535AVJANGA-R2
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہ📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
MPC8535EAVJANGA
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہ📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
MPC8535AVJANGA زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Core Architecture | Power Architecture e500 |
| Core Count | 1 |
| ڈیٹا بس چوڑائی | 32 bit |
| Maximum Core Frequency | 800 MHz |
| Process Technology | 90 nm CMOS |
| Memory Interface | DDR2/DDR3 with ECC |
| Memory Card Support | SDHC |
| PCI Interface | PCI / PCI Express |
| Storage Interface | SATA |
| Network Interface | Gigabit Ethernet (RGMII/SGMII) |
| USB Interface | USB 2.0 |
| آپریٹنگ درجہ حرارت رینج | 0 C to 90 C |
| JTAG Support | IEEE 1149.1 boundary scan |
| Package Type | FC-PBGA (29 mm x 29 mm) |
| Pin/Ball Count | 783 |
| Series | PowerQUICC III (MPC8535E) |
| Revision | Rev 1 |
| ماؤنٹنگ ٹائپ | Surface Mount (BGA) |
| RoHS اسٹیٹس | Compliant |
| Lead-Free | Yes |
MPC8535AVJANGA fc-pbga (29 mm x 29 mm) پن کنفیگریشن گائیڈ
MPC8535AVJANGA (fc-pbga (29 mm x 29 mm) پیکیج) کے لیے پن کنفیگریشن۔ اس ڈیجیٹل IC میں GPIO، کمیونیکیشن انٹرفیس (UART، SPI، I2C) اور پاور پنز شامل ہیں۔ متبادل پن فنکشنز اور کنفیگریشن آپشنز کے لیے مینوفیکچرر کے ڈیٹا شیٹ سے رجوع کریں۔ ایمبیڈڈ سسٹم ڈیزائن اور PCB لے آؤٹ کے لیے ضروری۔
کے لیے تفصیلی پن آؤٹ ڈیٹا دستیاب نہیں MPC8535AVJANGA.
رجوع کریں ڈیٹا شیٹ مکمل پن کنفیگریشن کے لیے۔
عام استعمالات
MPC8535AVJANGA کے لیے موزوں ہے 6 ایپلیکیشنs: Enterprise and SMB Routers, Multi-Layer Managed Switches, Network Attached Storage Controllers, Wireless Base Station Control-Plane Processing, Industrial Automation Controllers, Network Printers and Imaging Platforms.
Enterprise and SMB Routers
The MPC8535AVJANGA fits enterprise and SMB router designs by combining the e500 core at 800 MHz with integrated Gigabit Ethernet, PCI Express, and security accelerators. Its DDR2/DDR3 memory controller with ECC supports high-availability forwarding tables, while the integrated RGMII/SGMII ports remove the need for an external PHY controller. Designers benefit from the Power Architecture software ecosystem, including NXP Linux SDK and VxWorks BSP support, which shortens time to market for new branch-office and edge-router products.
تجویز کردہ
Multi-Layer Managed Switches
Multi-layer managed switches leverage the MPC8535AVJANGA's integrated GbE interfaces, PCI Express lanes, and high-bandwidth DDR memory controller to implement Layer 2/3 forwarding and management-plane processing on a single SoC. The JTAG boundary scan and ECC memory support enable high-MTBF designs for carrier-grade switches, and the 783-ball FC-PBGA package exposes enough GPIO and SerDes lanes to drive external switch fabrics. The 800 MHz core provides headroom for ACL processing and management-plane software stacks.
تجویز کردہ
Network Attached Storage Controllers
Network attached storage (NAS) controllers benefit from the MPC8535AVJANGA's integrated SATA, Gigabit Ethernet, USB 2.0, and DDR2/DDR3 memory controller with ECC. The 800 MHz e500 core plus DMA accelerators move file-system traffic at wire speed, while the SDHC port supports boot and metadata storage. Engineers can reuse the existing Linux/BSD NAS software ecosystem, and the 783-ball FC-PBGA package fits standard 2.5-inch and 3.5-inch NAS motherboard layouts.
تجویز کردہ
Wireless Base Station Control-Plane Processing
Wireless base-station control-plane processing relies on the MPC8535AVJANGA's deterministic e500 core, ECC memory, and PCI Express fabric for backhaul and baseband coordination. The integrated GbE and PCIe interfaces connect to radio cards and backhaul modems, while the 0 C to 90 C temperature range suits controlled-environment base-station enclosures. Power Architecture RTOS support (VxWorks, Green Hills INTEGRITY) enables deterministic control-plane scheduling demanded by telecom OEMs.
تجویز کردہ
Industrial Automation Controllers
Industrial automation controllers leverage the MPC8535AVJANGA for deterministic real-time control with GbE uplink, PCI Express expansion, and ECC-protected memory for safe operation. The integrated USB and SDHC ports simplify touch-panel HMI attachment, and the JTAG boundary scan enables production board test for high-reliability factory systems. Power Architecture software reuse plus long-life NXP/Freescale silicon support reduce validation effort in long-lifecycle industrial programs.
تجویز کردہ
Network Printers and Imaging Platforms
High-end network printers and imaging platforms use the MPC8535AVJANGA for page-rendering pipelines, network protocol stacks, and engine-control interfacing. The integrated Gigabit Ethernet, USB 2.0, and SDHC ports cover the connectivity needs of office MFPs, while the 800 MHz e500 core handles PostScript/PDF rendering at print-engine speeds. The 783-ball FC-PBGA package is well established in imaging reference designs, simplifying board layout for OEM engineers.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا MPC8535AVJANGA — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | MPC8535AVTANGA | MPC8535BVJANGA | MPC8535CVJANGA | MPC8535AVJANGA-R2 | MPC8535EAVJANGA |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | FC-PBGA-783 (29x29) | FC-PBGA-783 (29x29) - same | FC-PBGA-783 (29x29) - same | FC-PBGA-783 (29x29) - same | FC-PBGA-783 (29x29) - same | FC-PBGA-783 (29x29) - same |
| Core Architecture | Power Architecture e500 | Power Architecture e500 | Power Architecture e500 | Power Architecture e500 | Power Architecture e500 | Power Architecture e500 |
| Core Frequency | 800 MHz | 800 MHz | ~833 MHz (slightly higher bin) | ~1 GHz (highest bin) | 800 MHz | 800 MHz |
| Operating Temperature | 0 C to 90 C | -40 C to +85 C (extended) | 0 C to 90 C | 0 C to 90 C | 0 C to 90 C | 0 C to 90 C |
| DDR Memory Interface | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| Integrated Peripherals | PCIe, SATA, GbE, USB, SDHC | PCIe, SATA, GbE, USB, SDHC | PCIe, SATA, GbE, USB, SDHC | PCIe, SATA, GbE, USB, SDHC | PCIe, SATA, GbE, USB, SDHC | Enhanced peripheral subset |
| Lifecycle Status | End of Life / Last Time Buy | End of Life / Last Time Buy | End of Life | End of Life | End of Life | End of Life |
| Series | PowerQUICC III MPC8535E | PowerQUICC III MPC8535E | PowerQUICC III MPC8535E | PowerQUICC III MPC8535E | PowerQUICC III MPC8535E | PowerQUICC III MPC8535E |
اہم امتیازی خصوصیات
- Integrated communications peripherals reduce external chip count (بمقابلہMPC8544VJALFA)
- Higher operating frequency than AVJANGA in same package (بمقابلہMPC8535CVJANGA)
- True NXP silicon drop-in replacement without portfolio reshuffle (بمقابلہMPC8536CVJAULA)
ڈیزائن نوٹس
The 783-ball FC-PBGA package at 29 mm x 29 mm requires a high-density multilayer PCB stack-up (typically 8-10 layers) with controlled-impedance routing for the DDR2/DDR3, PCI Express, and RGMII/SGMII signals. Per the NXP hardware specifications, follow the reference schematics for power-plane decoupling, including 0.1 uF MLCC capacitors adjacent to each power ball and bulk tantalum or ceramic caps at the voltage regulator outputs. Estimated: thermal dissipation at 800 MHz core is typically 5-7 W, which must be validated against the layout's thermal resistance.
Do not confuse the MPC8535AVJANGA (commercial 0-90 C) with the MPC8535AVTANGA (extended temperature) - substituting one for the other in industrial deployments will cause out-of-spec junction temperatures. Also, the MPC8535 is NOT pin-compatible with the MPC8536 - although they share the FC-PBGA family, the ball assignments differ and the wrong part will fail to boot. Always confirm ballout against the latest NXP hardware specifications before board respins.
The DDR2/DDR3 interface runs at hundreds of MHz and requires matched-length routing, 50-ohm controlled impedance, and proper termination per the NXP reference design. PCI Express and Serial RapidIO links also require length-matched pairs with characteristic impedance of 85 ohms differential. JTAG boundary scan via IEEE 1149.1 should be brought to a dedicated header for board test access in production.
تعمیل کی معلومات
RoHS compliant per distributor product pages. Lead-free finish confirmed. Halogen-free status not explicitly listed in distributor data. AEC-Q100 not applicable for networking SoCs.
