MPC8535AVJANGA - PowerQUICC III 800MHz SoC MPU | NXP
MPN: MPC8535AVJANGA ⚠ Lần mua cuốiMPC8535AVJANGA Tóm tắt
A PowerQUICC III SoC is a system-on-chip that combines a Power Architecture processor core with dedicated communications engines and rich peripheral IP, bridging general-purpose compute with packet processing and high-speed serial I/O. It sits in the product hierarchy MPU -> microprocessor -> integrated processor -> SoC -> semiconductor, and is widely deployed in networking and telecom equipment where deterministic throughput and integrated memory and I/O controllers reduce bill-of-materials cost.
Key features include hardware support for DDR2/DDR3 memory with ECC, integrated SDHC, PCI and PCI Express interfaces, SATA, Gigabit Ethernet, USB 2.0, and an IEEE 1149.1 JTAG boundary-scan interface. The device is fabricated in a 90 nm copper CMOS process and supports core voltages of 1.5 V, 1.8 V, 2.5 V, and 3.3 V with industrial temperature grade 0 C to 90 C. According to the NXP product brief, the MPC8535E targets routers, switches, wireless base stations, and industrial imaging or printing applications that require gigahertz-class processing.
The architecture pairs the e500 superscalar core with a high-bandwidth system bus and dedicated DMA and security accelerators, allowing wire-speed packet handling on GbE and PCI Express ports. The integrated memory controller supports up to DDR3 with ECC for high-availability systems, and the on-chip peripherals expose multiple RGMII/SGMII Ethernet paths plus USB and SATA ports for storage and peripheral attachment.
Typical applications include enterprise and SMB routers, multi-layer switches, network attached storage, wireless base-station control-plane processing, and industrial automation controllers. The combination of Power Architecture compatibility and integrated SerDes-based I/O makes it a long-life workhorse for embedded networking designs.
When designing with this device, ensure proper PCB stack-up for the 783-ball FC-PBGA, provision adequate bulk decoupling around the DDR memory interface, and follow the reference schematics in the NXP hardware specifications document. JTAG boundary scan via IEEE 1149.1 is strongly recommended for production board test.
This page consolidates NXP datasheet specifications, distributor availability, and drop-in compatible alternatives for engineers sourcing the MPC8535AVJANGA in long-life or last-time-buy programs.
Bộ thay thế dễ dàng lắp đặt cho MPC8535AVJANGA — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với MPC8535AVJANGA (cùng hình factor và footprint) — khác nhau ở RoHS Status, Core Architecture, Data Bus Width, Series, Operating Temperature.
MPC8535AVTANGA
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →MPC8535BVJANGA
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →MPC8535CVJANGA
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
MPC8535AVJANGA-R2
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
MPC8535EAVJANGA
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
MPC8535AVJANGA Tỷ lệ tối đa & tính chất điện
| Core Architecture | Power Architecture e500 |
| Core Count | 1 |
| Bề rộng đường dữ liệu | 32 bit |
| Maximum Core Frequency | 800 MHz |
| Process Technology | 90 nm CMOS |
| Memory Interface | DDR2/DDR3 with ECC |
| Memory Card Support | SDHC |
| PCI Interface | PCI / PCI Express |
| Storage Interface | SATA |
| Network Interface | Gigabit Ethernet (RGMII/SGMII) |
| USB Interface | USB 2.0 |
| Khoảng nhiệt độ hoạt động | 0 C to 90 C |
| JTAG Support | IEEE 1149.1 boundary scan |
| Package Type | FC-PBGA (29 mm x 29 mm) |
| Pin/Ball Count | 783 |
| Series | PowerQUICC III (MPC8535E) |
| Revision | Rev 1 |
| Kiểu lắp đặt | Surface Mount (BGA) |
| Trạng thái RoHS | Compliant |
| Lead-Free | Yes |
Hướng dẫn cấu hình chân MPC8535AVJANGA fc-pbga (29 mm x 29 mm)
Cấu hình chân cho MPC8535AVJANGA (fc-pbga (29 mm x 29 mm) gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho MPC8535AVJANGA.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
MPC8535AVJANGA phù hợp cho 6 Áp dụngs: Enterprise and SMB Routers, Multi-Layer Managed Switches, Network Attached Storage Controllers, Wireless Base Station Control-Plane Processing, Industrial Automation Controllers, Network Printers and Imaging Platforms.
Enterprise and SMB Routers
The MPC8535AVJANGA fits enterprise and SMB router designs by combining the e500 core at 800 MHz with integrated Gigabit Ethernet, PCI Express, and security accelerators. Its DDR2/DDR3 memory controller with ECC supports high-availability forwarding tables, while the integrated RGMII/SGMII ports remove the need for an external PHY controller. Designers benefit from the Power Architecture software ecosystem, including NXP Linux SDK and VxWorks BSP support, which shortens time to market for new branch-office and edge-router products.
Được đề xuất
Multi-Layer Managed Switches
Multi-layer managed switches leverage the MPC8535AVJANGA's integrated GbE interfaces, PCI Express lanes, and high-bandwidth DDR memory controller to implement Layer 2/3 forwarding and management-plane processing on a single SoC. The JTAG boundary scan and ECC memory support enable high-MTBF designs for carrier-grade switches, and the 783-ball FC-PBGA package exposes enough GPIO and SerDes lanes to drive external switch fabrics. The 800 MHz core provides headroom for ACL processing and management-plane software stacks.
Được đề xuất
Network Attached Storage Controllers
Network attached storage (NAS) controllers benefit from the MPC8535AVJANGA's integrated SATA, Gigabit Ethernet, USB 2.0, and DDR2/DDR3 memory controller with ECC. The 800 MHz e500 core plus DMA accelerators move file-system traffic at wire speed, while the SDHC port supports boot and metadata storage. Engineers can reuse the existing Linux/BSD NAS software ecosystem, and the 783-ball FC-PBGA package fits standard 2.5-inch and 3.5-inch NAS motherboard layouts.
Được đề xuất
Wireless Base Station Control-Plane Processing
Wireless base-station control-plane processing relies on the MPC8535AVJANGA's deterministic e500 core, ECC memory, and PCI Express fabric for backhaul and baseband coordination. The integrated GbE and PCIe interfaces connect to radio cards and backhaul modems, while the 0 C to 90 C temperature range suits controlled-environment base-station enclosures. Power Architecture RTOS support (VxWorks, Green Hills INTEGRITY) enables deterministic control-plane scheduling demanded by telecom OEMs.
Được đề xuất
Industrial Automation Controllers
Industrial automation controllers leverage the MPC8535AVJANGA for deterministic real-time control with GbE uplink, PCI Express expansion, and ECC-protected memory for safe operation. The integrated USB and SDHC ports simplify touch-panel HMI attachment, and the JTAG boundary scan enables production board test for high-reliability factory systems. Power Architecture software reuse plus long-life NXP/Freescale silicon support reduce validation effort in long-lifecycle industrial programs.
Được đề xuất
Network Printers and Imaging Platforms
High-end network printers and imaging platforms use the MPC8535AVJANGA for page-rendering pipelines, network protocol stacks, and engine-control interfacing. The integrated Gigabit Ethernet, USB 2.0, and SDHC ports cover the connectivity needs of office MFPs, while the 800 MHz e500 core handles PostScript/PDF rendering at print-engine speeds. The 783-ball FC-PBGA package is well established in imaging reference designs, simplifying board layout for OEM engineers.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho MPC8535AVJANGA — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | MPC8535AVTANGA | MPC8535BVJANGA | MPC8535CVJANGA | MPC8535AVJANGA-R2 | MPC8535EAVJANGA |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | FC-PBGA-783 (29x29) | FC-PBGA-783 (29x29) - same | FC-PBGA-783 (29x29) - same | FC-PBGA-783 (29x29) - same | FC-PBGA-783 (29x29) - same | FC-PBGA-783 (29x29) - same |
| Core Architecture | Power Architecture e500 | Power Architecture e500 | Power Architecture e500 | Power Architecture e500 | Power Architecture e500 | Power Architecture e500 |
| Core Frequency | 800 MHz | 800 MHz | ~833 MHz (slightly higher bin) | ~1 GHz (highest bin) | 800 MHz | 800 MHz |
| Operating Temperature | 0 C to 90 C | -40 C to +85 C (extended) | 0 C to 90 C | 0 C to 90 C | 0 C to 90 C | 0 C to 90 C |
| DDR Memory Interface | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| Integrated Peripherals | PCIe, SATA, GbE, USB, SDHC | PCIe, SATA, GbE, USB, SDHC | PCIe, SATA, GbE, USB, SDHC | PCIe, SATA, GbE, USB, SDHC | PCIe, SATA, GbE, USB, SDHC | Enhanced peripheral subset |
| Lifecycle Status | End of Life / Last Time Buy | End of Life / Last Time Buy | End of Life | End of Life | End of Life | End of Life |
| Series | PowerQUICC III MPC8535E | PowerQUICC III MPC8535E | PowerQUICC III MPC8535E | PowerQUICC III MPC8535E | PowerQUICC III MPC8535E | PowerQUICC III MPC8535E |
Bảo phân biệt quan trọng
- Integrated communications peripherals reduce external chip count (vsMPC8544VJALFA)
- Higher operating frequency than AVJANGA in same package (vsMPC8535CVJANGA)
- True NXP silicon drop-in replacement without portfolio reshuffle (vsMPC8536CVJAULA)
Ghi chú thiết kế
The 783-ball FC-PBGA package at 29 mm x 29 mm requires a high-density multilayer PCB stack-up (typically 8-10 layers) with controlled-impedance routing for the DDR2/DDR3, PCI Express, and RGMII/SGMII signals. Per the NXP hardware specifications, follow the reference schematics for power-plane decoupling, including 0.1 uF MLCC capacitors adjacent to each power ball and bulk tantalum or ceramic caps at the voltage regulator outputs. Estimated: thermal dissipation at 800 MHz core is typically 5-7 W, which must be validated against the layout's thermal resistance.
Do not confuse the MPC8535AVJANGA (commercial 0-90 C) with the MPC8535AVTANGA (extended temperature) - substituting one for the other in industrial deployments will cause out-of-spec junction temperatures. Also, the MPC8535 is NOT pin-compatible with the MPC8536 - although they share the FC-PBGA family, the ball assignments differ and the wrong part will fail to boot. Always confirm ballout against the latest NXP hardware specifications before board respins.
The DDR2/DDR3 interface runs at hundreds of MHz and requires matched-length routing, 50-ohm controlled impedance, and proper termination per the NXP reference design. PCI Express and Serial RapidIO links also require length-matched pairs with characteristic impedance of 85 ohms differential. JTAG boundary scan via IEEE 1149.1 should be brought to a dedicated header for board test access in production.
Thông tin tuân thủ
RoHS compliant per distributor product pages. Lead-free finish confirmed. Halogen-free status not explicitly listed in distributor data. AEC-Q100 not applicable for networking SoCs.
