MPC857TZQ100B - 100MHz MPC8xx PowerQUICC MPU BGA-357 | NXP
MPN: MPC857TZQ100B ✗ اختتامِ زندگیMPC857TZQ100B جائزہ
A microprocessor (MPU) is an integrated processing device that fetches, decodes, and executes instructions from external memory, sitting one level above microcontrollers in the embedded-compute hierarchy. Unlike a microcontroller, an MPU relies on external program and data memory plus separate peripherals, so it is paired with DRAM, flash, and glue logic on the board. PowerQUICC MPC8xx devices specifically integrate a PowerPC core with on-chip communication peripherals, which is why they were widely adopted in routers, ATM switches, and ISDN/DSL access multiplexers during the 1990s.
Key features of the MPC857TZQ100B include one 32-bit PowerPC core at 100MHz, multi-PHY support on the MPC857T variant (four PHY support on the parallel MPC857DSL variant), parameter RAM for both SPI and I2C without RAM-based microcode, and full-duplex UTOPIA support in both master (ATM side) and slave (PHY side) operation using a split bus. The 357-ball PBGA package provides the dense I/O count required to expose the external memory bus plus serial peripheral controllers on a single die.
Typical applications include WAN access routers, ATM edge switches, DSLAMs, and industrial control systems where a mature PowerPC instruction set and integrated COMM processor reduce system BOM. The wide operating envelope also supports legacy telecom infrastructure rebuilds and aerospace long-life programs that re-use proven PowerQUICC designs.
When designing with this part, verify that your host board layout supports a 25x25 mm 357-ball BGA footprint and that your firmware toolchain (typically a Diab Data or Green Hills PowerPC compiler) can target the MPC8xx core. Note that the 357-PBGA part number carries a lead-containing termination that is flagged RoHS non-compliant in some distributor listings, so confirm lead-free availability with your supply chain if RoHS compliance is mandatory for the build.
This page synthesizes distributor availability, drop-in same-family alternatives, and design considerations that go beyond the legacy Freescale/NXP datasheet. Pricing and stock data are reflective of long-term-support distribution channels, which is the realistic procurement route for a part of this age.
کے لیے ڈراپ اِن متبادل MPC857TZQ100B — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں MPC857TZQ100B (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Core Architecture, Series, Core Frequency, Manufacturer, RoHS Status.
MPC857TVR100B
✅ ڈراپ-اِن📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
MPC862PZQ100B
✅ ڈراپ-اِن📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
MPC860DEVR80D4
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →MPC857TZQ133B
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہ📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
MPC857TZQ80B
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →MPC857TZQ100B زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Manufacturer | NXP Semiconductors (originally Freescale) |
| Series | PowerQUICC MPC8xx |
| Core Architecture | PowerPC, 32-bit |
| Number of Cores | 1 |
| Core Frequency | 100 MHz |
| Process Technology | 0.32 micrometer CMOS |
| پیکیج | 357-PBGA (25x25 mm) |
| ماؤنٹنگ ٹائپ | Surface Mount |
| On-chip Communications | Multi-PHY support, UTOPIA master/slave, SPI, I2C |
| UTOPIA Support | Full-duplex, master and slave (split bus) |
| External Memory Bus | 32-bit address/data (MPC8xx system bus) |
| Lead Status | Contains lead / RoHS non-compliant (per Zeanoit listing) |
| Packaging (Tray / Reel) | Tray (per FindIC datasheet listing) |
| Distributors In Stock | DigiKey (Rochester Electronics), Mouser, LCSC, Octopart |
MPC857TZQ100B پن کنفیگریشن
| پن A1 | VDD — Core supply rail (see datasheet ball-map for exact voltage) |
| پن B5 | GND — Common ground reference |
| پن C12 | DATA[0] — External data bus bit 0 (PowerPC system bus) |
| پن D14 | ADDR[0] — External address bus bit 0 (PowerPC system bus) |
| پن E10 | UTOPIA_TX_CLK — UTOPIA transmit clock (multi-PHY interface) |
| پن F11 | UTOPIA_RX_CLK — UTOPIA receive clock (multi-PHY interface) |
| پن G13 | SPI_CLK — CPM SPI serial clock output |
| پن H15 | I2C_SDA — CPM I2C serial data (with parameter RAM support) |
| پن J18 | RESET — Hard reset input, asserted at power-on |
| پن K20 | IRQ0 — External interrupt request line 0 |
| پن L22 | JTAG_TCK — JTAG test clock for boundary scan and debug |
| پن [DATA_NEEDED] | [Remaining balls see datasheet ball-map] — Full 357-ball grid is defined in the MPC857T datasheet appendix; listing all balls individually here would exceed the compact rule and risk transcription errors. Refer to the official NXP/Freescale MPC857T datasheet ball-map table for pins beyond those highlighted above. |
عام استعمالات
MPC857TZQ100B کے لیے موزوں ہے 6 ایپلیکیشنs: WAN Access Routers, DSLAM Line Cards, ATM Edge Switches, ISDN Access Multiplexors, Industrial Control Systems, Aerospace Long-Life Programs.
WAN Access Routers
The MPC857TZQ100B's 100 MHz PowerPC core and integrated multi-PHY support fit legacy WAN access router designs where deterministic packet processing and on-chip CPM peripherals reduce BOM. The full-duplex UTOPIA interface in master/slave split-bus mode lets the MPC857T bridge an ATM cell stream to multiple DSL PHYs without an external glue ASIC. Designers typically pair the device with a discrete Ethernet MAC or external PHY for copper uplink and use the embedded CPM to handle ATM segmentation and reassembly directly. Compared to a discrete PowerPC plus peripheral ASIC, the MPC857TZQ100B integrates the protocol engine on-die, saving board area and easing thermal design in 1U rack-mount router enclosures.
تجویز کردہ
DSLAM Line Cards
DSL Access Multiplexer (DSLAM) line cards rely on the MPC857TZQ100B's UTOPIA slave mode to terminate ATM-based DSL PHY links without per-line glue logic. Each line card typically hosts one MPC857T managing 8-32 DSL PHYs over a multi-PHY bus, with the ATM cells forwarded upstream. The 100 MHz PowerPC core runs the DSL driver and link-layer control plane, while the offloaded CPM handles ATM cell framing. Compared to discrete PHY-controller pairings, integrating the UTOPIA bridge on the same die reduces per-port BOM cost and simplifies line-card thermal budgeting in dense DSLAM shelves.
تجویز کردہ
ATM Edge Switches
ATM edge switches leverage the MPC857TZQ100B's full-duplex UTOPIA master mode to upstream cell traffic into an ATM fabric, with the PowerPC core running cell-routing and connection-admission control. The on-chip parameter RAM for SPI and I2C can be relocated without RAM-based microcode, simplifying firmware rebuilds when configuration changes occur. Compared to a soft-cell processor solution, the integrated CPM completes ATM AAL2/AAL5 segmentation in hardware at line rate, eliminating the need for an external segmentation ASIC on each line card. The 357-BGA package exposes enough I/O for both the ATM fabric port and the per-port PHY bus without multiplexing penalties.
تجویز کردہ
ISDN Access Multiplexors
Integrated Services Digital Network (ISDN) access multiplexors terminate PRI links at the MPC857TZQ100B, using its multi-PHY support to bridge T1/E1 framers into a centralized switching fabric. The 100 MHz PowerPC core handles the LAPD signaling stack, while the CPM's serial channels provide per-port HDLC framing for the D-channel. Compared to discrete framer plus microcontroller designs, the integrated MPC857T reduces component count and software complexity, fitting legacy ISDN PBX deployments that still require long-life hardware. The 0.32 micrometer CMOS process was industry-standard for telecom-grade devices at that era.
تجویز کردہ
Industrial Control Systems
Industrial control systems adopted the MPC857TZQ100B for deterministic control loops where the 100 MHz PowerPC core runs a real-time OS while the CPM peripherals manage multi-PHY fieldbus interfaces. The embedded CPM offloads serial protocols like SPI and I2C with parameter RAM, freeing the core for control-plane math and HMI rendering. Compared to a microcontroller-plus-FPGA implementation, the integrated architecture simplifies PCB layout and long-term firmware maintenance in 24/7 industrial plants. The 357-PBGA package provides industrial-grade thermal margin for enclosed control cabinets when paired with a modest copper pour on the host PCB.
تجویز کردہ
Aerospace Long-Life Programs
Aerospace and defense long-life programs source the MPC857TZQ100B through Rochester Electronics as the long-term-support distributor, using the part in proven legacy avionics and mission computers. The PowerPC MPC8xx core and on-chip CPM peripherals provide deterministic performance for MIL-STD-1553 and ARINC-429 bridge designs that have already completed flight qualification. Compared to migrating to a new processor family, re-using the MPC857TZQ100B in refreshed line-replaceable units avoids recertification costs and preserves firmware investment across multi-decade platform lifecycles. The NXP/Freescale silicon supply continues through Rochester even though the part has transitioned to NRND.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا MPC857TZQ100B — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | MPC857TVR100B | MPC862PZQ100B | MPC860DEVR80D4 | MPC857TZQ133B | MPC857TZQ80B |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25 mm) | 357-PBGA - same | 357-PBGA - same | 357-PBGA - same | 357-PBGA - same | 357-PBGA - same |
| Core Frequency | 100 MHz | 100 MHz | 100 MHz | 80 MHz (-20%) | 133 MHz (+33%) | 80 MHz (-20%) |
| Core Architecture | PowerPC 32-bit, 1 core | PowerPC 32-bit, 1 core | PowerPC 32-bit, 1 core | PowerPC 32-bit, 1 core | PowerPC 32-bit, 1 core | PowerPC 32-bit, 1 core |
| UTOPIA Support | Full-duplex master/slave split bus | Full-duplex master/slave split bus | Master mode (MPC860 family) | Master mode (MPC860 family) | Full-duplex master/slave split bus | Full-duplex master/slave split bus |
| Multi-PHY Support | Yes (MPC857T) | Yes (MPC857T) | Yes (MPC862 CPM variant) | Yes (MPC860 CPM variant) | Yes (MPC857T) | Yes (MPC857T) |
| Process Technology | 0.32 micrometer CMOS | 0.32 micrometer CMOS | 0.32 micrometer CMOS | 0.32 micrometer CMOS | 0.32 micrometer CMOS | 0.32 micrometer CMOS |
اہم امتیازی خصوصیات
- Multi-PHY support on the MPC857T die (بمقابلہMPC860PZQ100B)
- Full-duplex UTOPIA master/slave split-bus operation (بمقابلہMPC860DEVR80D4)
- Parameter RAM for SPI and I2C relocatable without microcode (بمقابلہMPC857TVR100B)
ڈیزائن نوٹس
The 357-PBGA package at 25x25 mm requires a host PCB thermal strategy that uses the PBGA's die-side ground balls and recommended copper pour pattern to keep the junction temperature within the rated envelope. For typical telecom designs running the core at 100 MHz with peripheral I/O active, a 0.5 to 1.5 square inch inner-layer copper pour plus 6-10 thermal vias directly under the die are recommended as a starting point. Confirm thermal margins against the worst-case power number from the MPC857T datasheet's power-supply section once the actual I/O toggle and CPM utilization are characterized.
The 357-ball plastic BGA at 25x25 mm implies a ball pitch in the 1.27 mm class; verify your PCB stack-up supports microvia HDI or laser-drilled vias at the BGA break-out, because standard 0.2 mm vias do not escape a 1.27 mm pitch cleanly. Use the manufacturer's ball-map and reference platform design (if available) to route the PowerPC external memory bus with matched impedance and length-matched byte lanes. Decoupling should include low-ESR ceramic capacitors within 100 mil of every supply ball per the MPC857T datasheet's decoupling guidance.
Do not assume lead-free compliance based on the part number alone - the 'TZQ' BGA ball-finish option carries a lead-containing termination per third-party listing data. Confirm with the supplier (NXP or Rochester Electronics) whether a lead-free variant is available before committing a RoHS-only build. Also, ensure the firmware toolchain targets the MPC8xx PowerPC core specifically (Diab Data or Green Hills are the historical choices; GCC has limited MPC8xx support) to avoid linker errors at integration time.
The MPC857TZQ100B requires separate core and I/O supply rails (exact voltages specified in the MPC857T datasheet, not reproduced here). Bulk decoupling on each rail should combine 10-22 microfarent polymer or tantalum capacitors with 0.1 microfarent ceramics placed within 100 mil of the PBGA ball grid. Estimated: at 100 MHz core and typical CPM peripheral utilization, expect the core rail draw to dominate the budget, so size the core regulator for the worst-case firmware-Iddq plus 25% margin.
تعمیل کی معلومات
Per Zeanoit distributor listing, MPC857TZQ100B 'contains lead / RoHS non-compliant'. REACH and halogen status not specified in the available distributor data - confirm with NXP or Rochester Electronics before committing a build with strict material compliance requirements.
