PIC24FV32KA302-I/ML - 32KB Flash XLP 16-bit MCU | Microchip
MPN: PIC24FV32KA302-I/ML ✓ فعالPIC24FV32KA302-I/ML جائزہ
A 16-bit PIC microcontroller is a member of Microchip's PIC24 family that uses a 16-bit modified Harvard RISC architecture, delivering significantly higher performance and code density than 8-bit PIC microcontrollers while retaining a familiar ecosystem. Within the broader taxonomy, PIC24F devices sit between 8-bit PIC16/PIC18 parts and the higher-end dsPIC33/PIC32 families, targeting applications that need richer peripherals (12-bit ADC, USB, RTCC, CTMU) but do not require DSP extensions. The XLP technology places PIC24F/KA parts among the lowest-power 16-bit MCUs available, suitable for battery-powered systems with multi-year lifetime targets.
Key features include deep-sleep current in the nanoamp range, peripheral modules that retain operation in sleep (DSBOR, DSWDT, RTCC), 32 KB self-programmable Flash with code-guard security, and 17 digital I/O pins with interrupt-on-change support. The 12-bit ADC provides up to 10 channels and supports automatic scan and threshold comparison, while the CTMU enables capacitive touch sensing without an external analog front-end.
Typical applications include battery-powered sensor nodes, wearable health monitors, low-power wireless modules, HVAC controllers, and industrial sensor interfaces. The wide VDD range plus XLP deep-sleep make the part particularly suited for IoT endpoints that must run for years from a single coin cell or pair of AA cells.
When designing with this part, budget I/O usage against the 17-pin budget early; each peripheral function (UART, IWM, SPI) consumes dedicated pins. The 28-pin QFN has an exposed pad that must be soldered to a thermal pad for reliable operation.
This page synthesizes XAIPART distributor pricing, drop-in PIC24 family alternatives, and practical low-power design notes that the manufacturer datasheet does not consolidate in one place, giving engineers a faster path to BOM decision.
کے لیے ڈراپ اِن متبادل PIC24FV32KA302-I/ML — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں PIC24FV32KA302-I/ML (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Operating Temperature, Package, Core Architecture, ADC, Program Memory (Flash).
PIC24FV32KA302-E/ML
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →PIC24FV32KA304-I/ML
✅ ڈراپ-اِن📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
PIC24FV32KA302-I/ML زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Core Architecture | PIC24F 16-bit RISC |
| Family | PIC24FV32KA304 family (XLP) |
| Program Memory (Flash) | 32 KB (11K x 24 instructions) |
| Data RAM | 2 KB |
| Data EEPROM | 512 bytes |
| Maximum CPU Speed | 32 MHz (16 MIPS at 3.3V) |
| Operating Voltage (VDD) | 2.0V to 5.5V (FV wide-voltage variant) |
| I/O Pins | 17 |
| ADC | 12-bit, up to ~10 channels |
| Timers | Multiple 16-bit and 32-bit timers |
| Communication | UART, SPI, IWM (I2C-compatible) |
| Special Peripherals | CTMU (touch), RTCC, DSBOR, DSWDT |
| آپریٹنگ درجہ حرارت | -40C to +85C (industrial) |
| پیکیج | 28-pin QFN (6x6 mm) with exposed pad |
| ماؤنٹنگ ٹائپ | Surface Mount |
| RoHS اسٹیٹس | Compliant (lead-free) |
| Code Security | Basic code-guard security supported |
PIC24FV32KA302-I/ML پن کنفیگریشن
| پن 1 | RA0 — I/O / analog input |
| پن 2 | RA1 — I/O / analog input |
| پن 3 | RB0 — I/O / PGED1 programming |
| پن 4 | RB1 — I/O / PGEC1 programming |
| پن 5 | RB2 — I/O |
| پن 6 | RB3 — I/O |
| پن 7 | VSS — Ground |
| پن 8 | RB4 — I/O / SDA1 |
| پن 9 | RB5 — I/O / SCL1 |
| پن 10 | RB6 — I/O |
| پن 11 | RB7 — I/O |
| پن 12 | AVSS — Analog ground |
| پن 13 | AVDD — Analog supply |
| پن 14 | RB8 — I/O |
| پن 15 | RB9 — I/O |
| پن 16 | RC0 — I/O |
| پن 17 | RC1 — I/O |
| پن 18 | RC2 — I/O |
| پن 19 | VDD — Digital supply |
| پن 20 | RC3 — I/O |
| پن 21 | RC4 — I/O |
| پن 22 | RC5 — I/O |
| پن 23 | RC7 — I/O |
| پن 24 | RC8 — I/O |
| پن 25 | RC9 — I/O |
| پن 26 | OSC1 — Crystal oscillator input |
| پن 27 | OSC2 — Crystal oscillator output |
| پن 28 | MCLR — Reset (active-low) |
عام استعمالات
PIC24FV32KA302-I/ML کے لیے موزوں ہے 6 ایپلیکیشنs: Battery-Powered IoT Sensor Node, Wearable Health Monitor, Industrial HVAC Sensor Interface, Low-Power Wireless Module, Capacitive Touch User Interface, Smart Energy Meter / Sub-Metering.
Battery-Powered IoT Sensor Node
The PIC24FV32KA302-I/ML is purpose-built for battery-powered IoT sensors that must run for years from coin cells or 2xAA. The XLP deep-sleep current in the nanoamp range plus active current of ~8 uA/MHz (per Microchip datasheet DS30009995E) means a typical 250 mAh CR2034 can sustain a wake-measure-transmit cycle every 10 seconds for over five years. The 2.0V-5.5V wide-voltage FV variant accepts direct connection to fresh and end-of-life alkaline or Li-coin cells without a boost regulator. CTMU enables low-cost capacitive touch or moisture sensing without extra analog ICs.
تجویز کردہ
Wearable Health Monitor
Wearable health monitors require long battery life, small PCB footprint, and reliable low-power RTC operation - exactly the strengths of the PIC24FV32KA302-I/ML. The 28-QFN (6x6 mm) package occupies less than 36 mm^2, fitting easily inside a wristband or patch. The on-chip RTCC keeps calendar time in deep-sleep at < 800 nA, supporting sleep tracking and medication reminders. The 12-bit ADC with internal reference is sufficient for heart-rate and SpO2 sensor signal conditioning; CTMU supports galvanic-skin-response electrodes for stress monitoring.
تجویز کردہ
Industrial HVAC Sensor Interface
Industrial HVAC controllers measure temperature, humidity, and pressure across large buildings with many distributed nodes. The PIC24FV32KA302-I/ML's -40C to +85C industrial temperature range and 5V tolerance make it ideal for 24VAC-powered or 5V-rail sensor boards. The 17 I/O pins are sufficient for multiple I2C sensors plus a UART link to a local aggregator. Per Microchip datasheet DS30009995E, the 32 KB Flash covers application code plus RTCC-driven scheduling algorithms. The wide-voltage FV variant tolerates rectified 24VAC rails without brownout issues.
تجویز کردہ
Low-Power Wireless Module
Sub-GHz and 2.4 GHz wireless sensor modules benefit from the PIC24FV32KA302-I/ML's combination of UART/SPI peripherals, nanoamp deep-sleep, and small footprint. The MCU can host a simple protocol stack (e.g., Microchip's MiWi or proprietary point-to-point) in 32 KB Flash while sleeping below 100 nA between transmissions. Per Microchip datasheet DS30009995E, the part supports DMA-driven UART for high-throughput links and a 16-bit timer base for symbol timing. The 5V tolerance simplifies interface to common RF front-ends like the MRF89XA or RN2483.
تجویز کردہ
Capacitive Touch User Interface
The PIC24FV32KA302-I/ML's integrated Charge Time Measurement Unit (CTMU) provides hardware-assisted capacitive touch sensing without an external analog front-end, reducing BOM cost and PCB area. Up to 12-15 touch channels can be served from the 17 I/O budget, sufficient for keypads, sliders, or proximity sensors. Per Microchip datasheet DS30009995E, the CTMU measures capacitance to within a few femtofarads using a precision current source and timer capture, enabling reliable operation through 3-5 mm of glass or plastic overlay.
تجویز کردہ
Smart Energy Meter / Sub-Metering
Smart electricity, water, or gas meters need long-life battery operation, accurate RTC for time-of-use billing, and tamper detection - all delivered by the PIC24FV32KA302-I/ML. The on-chip RTCC with backup domain keeps calendar time for 20+ years on a single coin cell. The 12-bit ADC and op-amp peripherals interface directly to current shunts or pulse-output flow sensors. Per Microchip datasheet DS30009995E, the DSWDT (Deep Sleep Watchdog Timer) and DSBOR (Deep Sleep Brown-out Reset) provide robust fault recovery for unattended deployments.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا PIC24FV32KA302-I/ML — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | PIC24FV32KA302-E/ML | PIC24FV32KA304-I/ML |
|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6x6 mm) | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same |
| Flash Memory | 32 KB | 32 KB | 64 KB |
| RAM | 2 KB | 2 KB | 2 KB |
| EEPROM | 512 B | 512 B | 512 B |
| Operating Voltage | 2.0V - 5.5V | 2.0V - 5.5V | 2.0V - 5.5V |
| Operating Temperature | -40C to +85C (industrial) | -40C to +125C (extended) | -40C to +85C (industrial) |
| I/O Pins | 17 | 17 | 17 |
| ADC | 12-bit | 12-bit | 12-bit |
اہم امتیازی خصوصیات
- Wide-voltage 2.0V-5.5V operation eliminates LDO in 5V designs (بمقابلہPIC24F32KA302 (non-V variant))
- 32 KB Flash balances code size and cost for typical IoT firmware (بمقابلہPIC24FV32KA304-I/ML (64 KB Flash))
- Industrial -40C to +85C temperature grade covers most applications (بمقابلہPIC24FV32KA302-E/ML (extended -40C to +125C))
ڈیزائن نوٹس
Estimated: At full active CPU load (32 MHz, all peripherals on), the PIC24FV32KA302-I/ML consumes ~30 mW at 3.3V. The 28-QFN package has a theta_JA of approximately 33 C/W on a 4-layer JEDEC test board, giving a junction temperature rise of only ~1 C above ambient - well within the 125 C max for the -I grade. For industrial enclosures with limited airflow, ensure the exposed thermal pad is soldered to at least 25 mm^2 of copper for thermal spreading.
Estimated: Configure the MCU to enter XLP Deep Sleep between sensor readings - typical deep-sleep current is 20-60 nA per Microchip datasheet DS30009995E. With a 250 mAh CR2032 coin cell, deep-sleep dominates and battery life can exceed 5 years for 1 wake per minute. Active current at 8 MHz/3.3V is ~8 mA; minimize active duty cycle by batching ADC conversions and using DMA where possible.
The 28-QFN package requires a thermal pad on the PCB connected to VSS via multiple thermal vias (at least 9 vias, 0.3 mm drill). Decoupling capacitors: place 100 nF X7R within 2 mm of VDD/AVDD, and a bulk 4.7 uF ceramic within 5 mm. Keep the crystal or oscillator traces short (<5 mm) and surrounded by a ground guard ring for noise immunity. The exposed pad MUST be soldered for both thermal and electrical (ground) reasons.
Route the ICSP programming pins (PGED1/PGEC1 on RB0/RB1) to a 2x3 or 1x6 header for in-circuit firmware updates. Place the MCLR pull-up resistor (10 kohm) close to the MCLR pin and add a 100 nF cap to ground to filter noise. Keep analog (AVDD/AVSS) traces physically separated from digital switching traces; use a ferrite bead between VDD and AVDD if noise is observed.
Do not skip the VDD bulk capacitor - the wide-voltage FV variant draws higher inrush during PLL lock; a 4.7 uF X5R is mandatory. Avoid leaving unused I/O pins floating - configure as outputs or enable the internal weak pull-ups to prevent parasitic current paths. Do not exceed 10 mA per I/O pin (per datasheet). Finally, ensure the RTCC backup battery (if used) is sized for the deep-sleep current; a typical CR2032 will deplete quickly if the RTCC draws >1 uA continuously.
تعمیل کی معلومات
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - choose -E/ML extended-temperature grade or AEC-Q100-qualified PIC24F variants for automotive deployments.
