PIC24FV32KA302-I/ML - 32KB Flash XLP 16-bit MCU | Microchip
MPN: PIC24FV32KA302-I/ML ✓ Hoạt độngPIC24FV32KA302-I/ML Tóm tắt
A 16-bit PIC microcontroller is a member of Microchip's PIC24 family that uses a 16-bit modified Harvard RISC architecture, delivering significantly higher performance and code density than 8-bit PIC microcontrollers while retaining a familiar ecosystem. Within the broader taxonomy, PIC24F devices sit between 8-bit PIC16/PIC18 parts and the higher-end dsPIC33/PIC32 families, targeting applications that need richer peripherals (12-bit ADC, USB, RTCC, CTMU) but do not require DSP extensions. The XLP technology places PIC24F/KA parts among the lowest-power 16-bit MCUs available, suitable for battery-powered systems with multi-year lifetime targets.
Key features include deep-sleep current in the nanoamp range, peripheral modules that retain operation in sleep (DSBOR, DSWDT, RTCC), 32 KB self-programmable Flash with code-guard security, and 17 digital I/O pins with interrupt-on-change support. The 12-bit ADC provides up to 10 channels and supports automatic scan and threshold comparison, while the CTMU enables capacitive touch sensing without an external analog front-end.
Typical applications include battery-powered sensor nodes, wearable health monitors, low-power wireless modules, HVAC controllers, and industrial sensor interfaces. The wide VDD range plus XLP deep-sleep make the part particularly suited for IoT endpoints that must run for years from a single coin cell or pair of AA cells.
When designing with this part, budget I/O usage against the 17-pin budget early; each peripheral function (UART, IWM, SPI) consumes dedicated pins. The 28-pin QFN has an exposed pad that must be soldered to a thermal pad for reliable operation.
This page synthesizes XAIPART distributor pricing, drop-in PIC24 family alternatives, and practical low-power design notes that the manufacturer datasheet does not consolidate in one place, giving engineers a faster path to BOM decision.
Bộ thay thế dễ dàng lắp đặt cho PIC24FV32KA302-I/ML — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với PIC24FV32KA302-I/ML (cùng hình factor và footprint) — khác nhau ở Operating Temperature, Package, Core Architecture, ADC, Program Memory (Flash).
PIC24FV32KA302-E/ML
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →PIC24FV32KA304-I/ML
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
PIC24FV32KA302-I/ML Tỷ lệ tối đa & tính chất điện
| Core Architecture | PIC24F 16-bit RISC |
| Family | PIC24FV32KA304 family (XLP) |
| Program Memory (Flash) | 32 KB (11K x 24 instructions) |
| Data RAM | 2 KB |
| Data EEPROM | 512 bytes |
| Maximum CPU Speed | 32 MHz (16 MIPS at 3.3V) |
| Operating Voltage (VDD) | 2.0V to 5.5V (FV wide-voltage variant) |
| I/O Pins | 17 |
| ADC | 12-bit, up to ~10 channels |
| Timers | Multiple 16-bit and 32-bit timers |
| Communication | UART, SPI, IWM (I2C-compatible) |
| Special Peripherals | CTMU (touch), RTCC, DSBOR, DSWDT |
| Nhiệt độ hoạt động | -40C to +85C (industrial) |
| Hộp | 28-pin QFN (6x6 mm) with exposed pad |
| Kiểu lắp đặt | Surface Mount |
| Trạng thái RoHS | Compliant (lead-free) |
| Code Security | Basic code-guard security supported |
Cấu hình chân PIC24FV32KA302-I/ML
| Chân 1 | RA0 — I/O / analog input |
| Chân 2 | RA1 — I/O / analog input |
| Chân 3 | RB0 — I/O / PGED1 programming |
| Chân 4 | RB1 — I/O / PGEC1 programming |
| Chân 5 | RB2 — I/O |
| Chân 6 | RB3 — I/O |
| Chân 7 | VSS — Ground |
| Chân 8 | RB4 — I/O / SDA1 |
| Chân 9 | RB5 — I/O / SCL1 |
| Chân 10 | RB6 — I/O |
| Chân 11 | RB7 — I/O |
| Chân 12 | AVSS — Analog ground |
| Chân 13 | AVDD — Analog supply |
| Chân 14 | RB8 — I/O |
| Chân 15 | RB9 — I/O |
| Chân 16 | RC0 — I/O |
| Chân 17 | RC1 — I/O |
| Chân 18 | RC2 — I/O |
| Chân 19 | VDD — Digital supply |
| Chân 20 | RC3 — I/O |
| Chân 21 | RC4 — I/O |
| Chân 22 | RC5 — I/O |
| Chân 23 | RC7 — I/O |
| Chân 24 | RC8 — I/O |
| Chân 25 | RC9 — I/O |
| Chân 26 | OSC1 — Crystal oscillator input |
| Chân 27 | OSC2 — Crystal oscillator output |
| Chân 28 | MCLR — Reset (active-low) |
Ứng dụng tiêu biểu
PIC24FV32KA302-I/ML phù hợp cho 6 Áp dụngs: Battery-Powered IoT Sensor Node, Wearable Health Monitor, Industrial HVAC Sensor Interface, Low-Power Wireless Module, Capacitive Touch User Interface, Smart Energy Meter / Sub-Metering.
Battery-Powered IoT Sensor Node
The PIC24FV32KA302-I/ML is purpose-built for battery-powered IoT sensors that must run for years from coin cells or 2xAA. The XLP deep-sleep current in the nanoamp range plus active current of ~8 uA/MHz (per Microchip datasheet DS30009995E) means a typical 250 mAh CR2034 can sustain a wake-measure-transmit cycle every 10 seconds for over five years. The 2.0V-5.5V wide-voltage FV variant accepts direct connection to fresh and end-of-life alkaline or Li-coin cells without a boost regulator. CTMU enables low-cost capacitive touch or moisture sensing without extra analog ICs.
Được đề xuất
Wearable Health Monitor
Wearable health monitors require long battery life, small PCB footprint, and reliable low-power RTC operation - exactly the strengths of the PIC24FV32KA302-I/ML. The 28-QFN (6x6 mm) package occupies less than 36 mm^2, fitting easily inside a wristband or patch. The on-chip RTCC keeps calendar time in deep-sleep at < 800 nA, supporting sleep tracking and medication reminders. The 12-bit ADC with internal reference is sufficient for heart-rate and SpO2 sensor signal conditioning; CTMU supports galvanic-skin-response electrodes for stress monitoring.
Được đề xuất
Industrial HVAC Sensor Interface
Industrial HVAC controllers measure temperature, humidity, and pressure across large buildings with many distributed nodes. The PIC24FV32KA302-I/ML's -40C to +85C industrial temperature range and 5V tolerance make it ideal for 24VAC-powered or 5V-rail sensor boards. The 17 I/O pins are sufficient for multiple I2C sensors plus a UART link to a local aggregator. Per Microchip datasheet DS30009995E, the 32 KB Flash covers application code plus RTCC-driven scheduling algorithms. The wide-voltage FV variant tolerates rectified 24VAC rails without brownout issues.
Được đề xuất
Low-Power Wireless Module
Sub-GHz and 2.4 GHz wireless sensor modules benefit from the PIC24FV32KA302-I/ML's combination of UART/SPI peripherals, nanoamp deep-sleep, and small footprint. The MCU can host a simple protocol stack (e.g., Microchip's MiWi or proprietary point-to-point) in 32 KB Flash while sleeping below 100 nA between transmissions. Per Microchip datasheet DS30009995E, the part supports DMA-driven UART for high-throughput links and a 16-bit timer base for symbol timing. The 5V tolerance simplifies interface to common RF front-ends like the MRF89XA or RN2483.
Được đề xuất
Capacitive Touch User Interface
The PIC24FV32KA302-I/ML's integrated Charge Time Measurement Unit (CTMU) provides hardware-assisted capacitive touch sensing without an external analog front-end, reducing BOM cost and PCB area. Up to 12-15 touch channels can be served from the 17 I/O budget, sufficient for keypads, sliders, or proximity sensors. Per Microchip datasheet DS30009995E, the CTMU measures capacitance to within a few femtofarads using a precision current source and timer capture, enabling reliable operation through 3-5 mm of glass or plastic overlay.
Được đề xuất
Smart Energy Meter / Sub-Metering
Smart electricity, water, or gas meters need long-life battery operation, accurate RTC for time-of-use billing, and tamper detection - all delivered by the PIC24FV32KA302-I/ML. The on-chip RTCC with backup domain keeps calendar time for 20+ years on a single coin cell. The 12-bit ADC and op-amp peripherals interface directly to current shunts or pulse-output flow sensors. Per Microchip datasheet DS30009995E, the DSWDT (Deep Sleep Watchdog Timer) and DSBOR (Deep Sleep Brown-out Reset) provide robust fault recovery for unattended deployments.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho PIC24FV32KA302-I/ML — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | PIC24FV32KA302-E/ML | PIC24FV32KA304-I/ML |
|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6x6 mm) | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same |
| Flash Memory | 32 KB | 32 KB | 64 KB |
| RAM | 2 KB | 2 KB | 2 KB |
| EEPROM | 512 B | 512 B | 512 B |
| Operating Voltage | 2.0V - 5.5V | 2.0V - 5.5V | 2.0V - 5.5V |
| Operating Temperature | -40C to +85C (industrial) | -40C to +125C (extended) | -40C to +85C (industrial) |
| I/O Pins | 17 | 17 | 17 |
| ADC | 12-bit | 12-bit | 12-bit |
Bảo phân biệt quan trọng
- Wide-voltage 2.0V-5.5V operation eliminates LDO in 5V designs (vsPIC24F32KA302 (non-V variant))
- 32 KB Flash balances code size and cost for typical IoT firmware (vsPIC24FV32KA304-I/ML (64 KB Flash))
- Industrial -40C to +85C temperature grade covers most applications (vsPIC24FV32KA302-E/ML (extended -40C to +125C))
Ghi chú thiết kế
Estimated: At full active CPU load (32 MHz, all peripherals on), the PIC24FV32KA302-I/ML consumes ~30 mW at 3.3V. The 28-QFN package has a theta_JA of approximately 33 C/W on a 4-layer JEDEC test board, giving a junction temperature rise of only ~1 C above ambient - well within the 125 C max for the -I grade. For industrial enclosures with limited airflow, ensure the exposed thermal pad is soldered to at least 25 mm^2 of copper for thermal spreading.
Estimated: Configure the MCU to enter XLP Deep Sleep between sensor readings - typical deep-sleep current is 20-60 nA per Microchip datasheet DS30009995E. With a 250 mAh CR2032 coin cell, deep-sleep dominates and battery life can exceed 5 years for 1 wake per minute. Active current at 8 MHz/3.3V is ~8 mA; minimize active duty cycle by batching ADC conversions and using DMA where possible.
The 28-QFN package requires a thermal pad on the PCB connected to VSS via multiple thermal vias (at least 9 vias, 0.3 mm drill). Decoupling capacitors: place 100 nF X7R within 2 mm of VDD/AVDD, and a bulk 4.7 uF ceramic within 5 mm. Keep the crystal or oscillator traces short (<5 mm) and surrounded by a ground guard ring for noise immunity. The exposed pad MUST be soldered for both thermal and electrical (ground) reasons.
Route the ICSP programming pins (PGED1/PGEC1 on RB0/RB1) to a 2x3 or 1x6 header for in-circuit firmware updates. Place the MCLR pull-up resistor (10 kohm) close to the MCLR pin and add a 100 nF cap to ground to filter noise. Keep analog (AVDD/AVSS) traces physically separated from digital switching traces; use a ferrite bead between VDD and AVDD if noise is observed.
Do not skip the VDD bulk capacitor - the wide-voltage FV variant draws higher inrush during PLL lock; a 4.7 uF X5R is mandatory. Avoid leaving unused I/O pins floating - configure as outputs or enable the internal weak pull-ups to prevent parasitic current paths. Do not exceed 10 mA per I/O pin (per datasheet). Finally, ensure the RTCC backup battery (if used) is sized for the deep-sleep current; a typical CR2032 will deplete quickly if the RTCC draws >1 uA continuously.
Thông tin tuân thủ
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - choose -E/ML extended-temperature grade or AEC-Q100-qualified PIC24F variants for automotive deployments.
