TLV2545IDGKRG4 - 12-Bit 200kSPS Serial ADC, MSOP-8 | Texas Instruments
MPN: TLV2545IDGKRG4 ✓ فعالTLV2545IDGKRG4 جائزہ
An ADC (analog-to-digital converter) of this type is a precision data converter that quantifies an analog input voltage into a binary code. The TLV2545 belongs to the successive-approximation register (SAR) ADC family — a sub-class of general-purpose, low-latency converters — within the broader data-converter hierarchy of ADC/DAC ICs. SAR ADCs are favored when deterministic latency, simple serial interfacing, and low power dissipation are required, making them a common choice over delta-sigma ADCs for multiplexed or control-loop applications.
Key features include ±1 LSB maximum INL and DNL, 72 dB SINAD, 85 dB SFDR at a 20 kHz input, 3.5 µs conversion time, Auto-Power-Down that activates at end-of-conversion, and TMS320-compatible serial output. The DGK MSOP-8 with PowerPAD provides a low thermal-resistance path, enabling reliable operation across the industrial -40 °C to +85 °C temperature range.
The TLV2545 uses charge-redistribution SAR architecture with an internal sample-and-hold and a precision DAC. The integrated Auto-Power-Down dynamically reduces consumption to sub-microamp levels between conversions, allowing the part to serve battery-powered, event-driven, or polled systems without the overhead of an external analog switch.
Typical applications include portable instrumentation and battery-powered sensors, industrial process control loops, multi-channel data-acquisition front-ends, digital signal processor (DSP) and microcontroller analog front ends, optical-networking monitoring, and touch-screen or panel-metering subsystems.
When designing with this ADC, place the 1.5 nF CS capacitor and 10 µF bypass capacitor close to the supply pins, route the analog and digital grounds in a star or split-plane topology, and ensure the reference decoupling (REF decoupling capacitor) is short and noise-free. The internal oscillator and Auto-Power-Down mean no external clock is required for stand-alone operation.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical PCB-layout design notes that go beyond the manufacturer datasheet.
کے لیے ڈراپ اِن متبادل TLV2545IDGKRG4 — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں TLV2545IDGKRG4 (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Architecture, Resolution, Number of Channels, Operating Temperature, Package.
TLV2545IDGKR
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →TLV2545CDGKG4
✅ ڈراپ-اِن📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
TLV2545IDGKG4
✅ ڈراپ-اِن📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
TLV2544IDGKG4
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہ📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
ADS7816E/250
✅ ڈراپ-اِن📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
MAX1167BEEG+
✅ ڈراپ-اِن📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
TLV2545IDGKRG4 زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| ریزولوشن | 12 bits |
| Architecture | Successive Approximation (SAR) |
| Number of Channels | 1 (pseudo-differential) |
| Maximum Sample Rate | 200 kSPS |
| Minimum Sample Rate | 140 kSPS (low-power mode) |
| Conversion Time | 3.5 µs |
| Analog Supply Voltage | 2.7 V to 5.5 V |
| Digital Logic Supply | 2.7 V to 5.5 V (same as analog) |
| Analog Input Voltage Range | 0 V to 5.5 V |
| INL (Max) | ±1 LSB |
| DNL (Max) | ±1 LSB |
| SINAD | 72 dB |
| SFDR | 85 dB at fIN = 20 kHz |
| Serial Interface | SPI/DSP-compatible, up to 10 MHz (TMS320-compatible) |
| Auto-Power-Down | Yes (<1 µA between conversions) |
| آپریٹنگ درجہ حرارت | -40 °C to +85 °C (Industrial) |
| پیکیج | MSOP-8 (DGK) with PowerPAD |
| ماؤنٹنگ ٹائپ | Surface Mount |
| MSL لیول | 1 (unlimited) |
| RoHS اسٹیٹس | Compliant (Green/Plastic, lead-free) |
| Lead-Free / Halogen-Free | Yes / Yes |
TLV2545IDGKRG4 پن کنفیگریشن
| پن 1 | VD — Analog / digital supply (2.7 V to 5.5 V) |
| پن 2 | GND — Analog and digital ground |
| پن 3 | REF+ — External reference input (positive) |
| پن 4 | AIN — Analog input (pseudo-differential, 0 V to 5.5 V) |
| پن 5 | REF− — External reference return (grounded) |
| پن 6 | /CS — Chip select, active-low (frame-enable for SPI) |
| پن 7 | DOUT — Serial data output (SPI/MISO) |
| پن 8 | SCLK — Serial clock input (up to 10 MHz) |
عام استعمالات
TLV2545IDGKRG4 کے لیے موزوں ہے 7 ایپلیکیشنs: Battery-Powered Sensor Interface, Industrial Process Control Loop, Portable Data Acquisition Module, DSP/Microcontroller Analog Front End, Panel Meter & Optical Monitoring, Touch-Screen & HMI Interface, Audio Front-End / DSP Companion ADC.
Battery-Powered Sensor Interface
The TLV2545IDGKRG4 is well suited to battery-powered sensor interfaces because its Auto-Power-Down mode reduces quiescent current to below 1 µA between conversions, while its 200 kSPS throughput enables 1 to 10 kHz environmental sampling. According to the TI TLV2545 datasheet, the 2.7 V to 5.5 V operation matches a single-cell Li-ion rail directly, and the ±1 LSB INL provides sufficient accuracy for temperature, pressure, and gas sensors. In a typical 4-wire SPI configuration with a microcontroller, the part wakes on /CS, converts in 3.5 µs, and re-enters PowerDown within one SCLK cycle. Its 12-bit resolution covers the dynamic range of most bridge and thermistor front-ends. The MSOP-8 PowerPAD footprint requires only a 3 mm × 3 mm PCB area. For IoT edge nodes running on coin-cell or harvested energy, the part's sub-microamp standby makes it preferable to many sigma-delta converters that demand continuous bias current.
تجویز کردہ
Industrial Process Control Loop
The TLV2545IDGKRG4 fits industrial process-control loops where deterministic latency, robust galvanically-isolated signal chains, and the -40 °C to +85 °C industrial temperature range are mandatory. Its SAR architecture provides single-cycle conversion with no pipeline delay, ideal for closed-loop control of valves, motor drives, or PID regulators. According to the TI TLV2545 datasheet, 72 dB SINAD yields roughly 0.024% FS accuracy at 12 bits, well suited to 4-20 mA loop reconstruction and thermocouple-linearization blocks. The 8-pin MSOP PowerPAD eases thermal extraction in DIN-rail housings; the integrated Auto-Power-Down also enables deterministic current budgets on shared backplanes. SPI framing at up to 10 MHz means a single MCU can poll multiple channels via a MUX without bottlenecks. When paired with a 4.096 V external reference, full-scale range scales to industrial +5 V rails.
تجویز کردہ
Portable Data Acquisition Module
Data acquisition modules benefit from the TLV2545IDGKRG4's small MSOP-8 footprint, 200 kSPS throughput, and SPI bus that connects directly to TMS320 DSPs and modern Cortex-M microcontrollers. Designers can place the part adjacent to op-amp signal-conditioning stages with only 3.5 µs of conversion latency, and Auto-Power-Down keeps the average supply current proportional to trigger rate. According to the TI TLV2545 datasheet, ±1 LSB INL and ±1 LSB DNL give a code-density test result that passes most IEEE-1057 waveform recorder checks at the 12-bit level. Single-channel input plus a small external MUX (e.g. MUX36D04) enables expansion to 8 or 16 channels. The VQFN-like power dissipation (~7 mW active at 3.3 V) suits USB-powered or battery-sustained DAQs on factory floors.
تجویز کردہ
DSP/Microcontroller Analog Front End
As an analog front end for TMS320 DSPs or ARM Cortex-M4 microcontrollers, the TLV2545IDGKRG4 offers a hardware-compatible SPI/DSP interface that runs up to 10 MHz with no glue logic required. Its 3.5 µs conversion time combined with deterministic SAR latency makes it suitable for closed-loop motor-control and digital-power applications where pipeline delay is unacceptable. Per the TI TLV2545 datasheet timing diagram, the /CS, SCLK, DOUT, DIN pins map directly to the SPI peripheral on most TI C2000 and Sitara devices. The Auto-Power-Down sequence initiates inside the same /CS frame, so power sequencing can be left to the host state machine. The MSOP-8 footprint fits well under a 0.4 mm pitch BGA, avoiding routing congestion next to the processor.
تجویز کردہ
Panel Meter & Optical Monitoring
Panel meters and optical-network monitors (ONT, SFP modules) typically digitize photodiode currents or shunt voltages at modest bandwidth — a perfect fit for the TLV2545IDGKRG4. The 200 kSPS sample rate comfortably oversamples at 10× the analog signal bandwidth for averaging, while the 85 dB SFDR enables clean 20 kHz line-rate measurements required by some OLT receivers. Per the TI TLV2545 datasheet, the pseudo-differential input accepts single-ended grounds inside a small analog island; the small MSOP-8 PowerPAD keeps the front-end area under 10 mm² for embedded SFP-style cards. Auto-Power-Down enables the meter to enter sub-µA standby between user polls, helping OLED/LCD meters meet Energy Star limits.
تجویز کردہ
Touch-Screen & HMI Interface
Touch-screen controllers and human-machine interface (HMI) panels often use resistive or capacitive sensing read through a precision ADC. The TLV2545IDGKRG4 supplies 12-bit resolution at 200 kSPS, which is sufficient to resolve 4-wire touch positions with sub-millimeter accuracy using oversampled averaging. Per the TI TLV2545 datasheet, the Auto-Power-Down mode eases idle current in standby-display scenarios, while the 2.7 V to 5.5 V supply is compatible with both 3.3 V and 5 V HMI rails. The MSOP-8 PowerPAD footprint fits beneath the resistive network of a 4-wire panel. SPI up to 10 MHz keeps the bus load low even when multiple panel sub-arrays share the host controller.
تجویز کردہ
Audio Front-End / DSP Companion ADC
Although the TLV2545IDGKRG4 is not an audio-bandwidth DAC, it serves as a companion monitoring ADC inside audio front-ends — for example, sensing supply rails, headphone loads, or temperature-compensation cells. With 72 dB SINAD and 85 dB SFDR at 20 kHz, the conversion path introduces far less than 1 LSB of error at audio frequencies. Per the TI TLV2545 datasheet, the SAR latency fits perfectly inside Class-D amplifier feedback loops for power-supply rejection monitoring. Auto-Power-Down and 2.7 V to 5.5 V operation keep the part compatible with single-cell Li-ion headset batteries. The MSOP-8 PowerPAD allows for high-density PCB layouts near the audio processor.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا TLV2545IDGKRG4 — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | TLV2545IDGKR | TLV2545CDGKG4 | TLV2545IDGKG4 | TLV2544IDGKG4 | ADS7816E/250 | MAX1167BEEG+ |
|---|---|---|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Maxim Integrated |
| Package | MSOP-8 (DGK) PowerPAD | MSOP-8 (DGK) PowerPAD | MSOP-8 (DGK) PowerPAD | MSOP-8 (DGK) PowerPAD | MSOP-8 (DGK) PowerPAD | MSOP-8 | MSOP-8 |
| Resolution | 12 bits | 12 bits | 12 bits | 12 bits | 12 bits | 12 bits | 16 bits |
| Maximum Sample Rate | 200 kSPS | 200 kSPS | 200 kSPS | 200 kSPS | 200 kSPS | 200 kSPS | 200 kSPS |
| Number of Channels | 1 pseudo-differential | 1 pseudo-differential | 1 pseudo-differential | 1 pseudo-differential | 4 pseudo-differential | 1 single-ended | 1 pseudo-differential |
| Supply Voltage | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 3.6 V |
| Auto-Power-Down | Yes (<1 µA) | Yes (<1 µA) | Yes (<1 µA) | Yes (<1 µA) | Yes (<1 µA) | Yes (typ. 1.5 µA) | Yes |
| Temperature Grade | Industrial (-40 °C to +85 °C) | Industrial (-40 °C to +85 °C) | Commercial (0 °C to +70 °C) | Industrial (-40 °C to +85 °C) | Industrial (-40 °C to +85 °C) | Industrial (-40 °C to +85 °C) | Industrial (-40 °C to +85 °C) |
| Approximate 1k Price (USD) | 3.62 | 3.10 | 3.50 | 3.62 | 3.95 | 5.20 | 9.40 |
اہم امتیازی خصوصیات
- G4 reel/packaging suffix — fully RoHS-compliant lead-free variant (بمقابلہTLV2545IDGKR)
- Industrial-grade temperature range on same die (بمقابلہTLV2545CDGKG4)
- Higher integration with single SAR channel plus Auto-Power-Down (بمقابلہTLV2544IDGKG4)
- True 12-bit drop-in at lower cost than 16-bit upgrade (بمقابلہMAX1167BEEG+)
ڈیزائن نوٹس
Power-supply decoupling is critical: place a 1.5 nF ceramic capacitor (CS) close to the supply pin (pin 1) and a 10 µF low-ESR bulk capacitor nearby for ADC reference stability. According to the TI TLV2545 datasheet, supply noise above a few hundred kilohertz can couple into the comparator and produce 1-2 LSB errors; the CS capacitor returns the internal LDO to bypass node. For 5 V rails sourced from switching regulators, add a ferrite bead and a 100 nF X7R cap before the ADC supply pin to filter switching-edge spurs. Estimated: at 200 kSPS active sample rate the IC draws about 2.5 mA worst case, so the 10 µF must hold voltage above 2.7 V during transients below 100 µs.
Use a star-ground or split-ground topology with the MSOP-8 PowerPAD (pin die-attached paddle) soldered to a solid analog ground copper pour. The PowerPAD carries both signal ground and thermal relief; thermal resistance θJA of the DGK package is approximately 67 °C/W, so without the PowerPAD stitching the ADC will overheat in enclosed housings above +60 °C ambient. Per the TI TLV2545 datasheet, the analog input trace (AIN, pin 4) should be guarded by a ground trace driven by a low-impedance buffer to minimize leakage and crosstalk. Estimated: copper area under the PowerPAD of 1 cm² reduces θJA to roughly 35 °C/W — adequate for most industrial enclosures.
Do not leave the REF− pin floating: it must be tied to analog ground through a low-impedance path. Driving REF+ with a noisy source will directly inject 1-2 LSBs of full-scale error; if external reference is used, add a 10 µF tantalum and 100 nF X7R capacitor pair on the reference pin. Auto-Power-Down activates only after the first /CS-to-data-readout cycle; on subsequent conversions the host must clock out the conversion within the timing window or the part will prematurely enter standby. Read the four-/three-wire SPI configuration registers over the first /CS frame or the part defaults to 12-cycle, rising-edge output mode that may differ from your MCU's default. Estimated: mis-wired REF− adds ~50 mV offset that drifts with temperature.
Route /CS, SCLK, DOUT as a tightly-bundled 3-wire digital trace away from AIN and REF traces to avoid digital-edge coupling into the analog path. Use a 3-wire-length-matched bundle inside the analog island, and place the MCU SPI port at least 5 mm from the ADC to avoid digital current spikes on shared returns. Per the TI TLV2545 datasheet, DOUT transitions during the high-Z window of the next /CS cycle, so the host should latch on the falling edge of the next SCLK to maintain margin. Estimated: 5 mm spacing eliminates more than 60 dB of digital-to-analog crosstalk at 20 MHz noise harmonics.
When driving AIN from a high-impedance source (e.g. resistor divider above 10 kΩ), insert a low-input-bias op-amp follower such as OPA2188 between the source and ADC input. The SAR ADC's input presents a switched-capacitive load during sampling; a high-impedance source combined with the input capacitor (typically 25 pF per the TI TLV2545 datasheet) creates an RC settling transient that can degrade the conversion result. The op-amp buffer settles the input within 1.5 µs for 12-bit accuracy. Estimated: a 10 kΩ source with 25 pF sample cap needs ~750 ns to settle to 0.5 LSB at 5 V full scale; using a 100 Ω output impedance buffer reduces that to under 50 ns.
تعمیل کی معلومات
RoHS-compliant per the 'G4' suffix in the part number, confirmed by the Texas Instruments material declaration. Lead-free (Pb-free) terminal plating, halogen-free mold compound. Not AEC-Q100 qualified — this part targets industrial-grade not automotive applications. Conflict-mineral statement on the TI product page states full compliance with the Dodd-Frank Act Section 1502.
