TLV2545IDGKRG4 - 12-Bit 200kSPS Serial ADC, MSOP-8 | Texas Instruments
MPN: TLV2545IDGKRG4 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.12 | $6.12 |
| 10 | $5.45 | $54.50 |
| 100 | $4.79 | $479.00 |
| 500 | $4.18 | $2,090.00 |
| 1,000 | $3.62 | $3,620.00 |
| 2,500 | $3.1 | $7,750.00 |
TLV2545IDGKRG4 Overview
An ADC (analog-to-digital converter) of this type is a precision data converter that quantifies an analog input voltage into a binary code. The TLV2545 belongs to the successive-approximation register (SAR) ADC family — a sub-class of general-purpose, low-latency converters — within the broader data-converter hierarchy of ADC/DAC ICs. SAR ADCs are favored when deterministic latency, simple serial interfacing, and low power dissipation are required, making them a common choice over delta-sigma ADCs for multiplexed or control-loop applications.
Key features include ±1 LSB maximum INL and DNL, 72 dB SINAD, 85 dB SFDR at a 20 kHz input, 3.5 µs conversion time, Auto-Power-Down that activates at end-of-conversion, and TMS320-compatible serial output. The DGK MSOP-8 with PowerPAD provides a low thermal-resistance path, enabling reliable operation across the industrial -40 °C to +85 °C temperature range.
The TLV2545 uses charge-redistribution SAR architecture with an internal sample-and-hold and a precision DAC. The integrated Auto-Power-Down dynamically reduces consumption to sub-microamp levels between conversions, allowing the part to serve battery-powered, event-driven, or polled systems without the overhead of an external analog switch.
Typical applications include portable instrumentation and battery-powered sensors, industrial process control loops, multi-channel data-acquisition front-ends, digital signal processor (DSP) and microcontroller analog front ends, optical-networking monitoring, and touch-screen or panel-metering subsystems.
When designing with this ADC, place the 1.5 nF CS capacitor and 10 µF bypass capacitor close to the supply pins, route the analog and digital grounds in a star or split-plane topology, and ensure the reference decoupling (REF decoupling capacitor) is short and noise-free. The internal oscillator and Auto-Power-Down mean no external clock is required for stand-alone operation.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical PCB-layout design notes that go beyond the manufacturer datasheet.
Drop-in alternatives for TLV2545IDGKRG4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with TLV2545IDGKRG4 (same form factor and footprint) — differing in Architecture, Resolution, Number of Channels, Operating Temperature, Package.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
TLV2545IDGKR
✅ Drop-In✓ In Stock
$2.33 / Unit
View Datasheet →TLV2545CDGKG4
✅ Drop-In📋 Reference alternative (not in catalog)
TLV2545IDGKG4
✅ Drop-In📋 Reference alternative (not in catalog)
TLV2544IDGKG4
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
ADS7816E/250
✅ Drop-In📋 Reference alternative (not in catalog)
MAX1167BEEG+
✅ Drop-In📋 Reference alternative (not in catalog)
TLV2545IDGKRG4 Maximum Ratings & Electrical Characteristics
| Resolution | 12 bits |
| Architecture | Successive Approximation (SAR) |
| Number of Channels | 1 (pseudo-differential) |
| Maximum Sample Rate | 200 kSPS |
| Minimum Sample Rate | 140 kSPS (low-power mode) |
| Conversion Time | 3.5 µs |
| Analog Supply Voltage | 2.7 V to 5.5 V |
| Digital Logic Supply | 2.7 V to 5.5 V (same as analog) |
| Analog Input Voltage Range | 0 V to 5.5 V |
| INL (Max) | ±1 LSB |
| DNL (Max) | ±1 LSB |
| SINAD | 72 dB |
| SFDR | 85 dB at fIN = 20 kHz |
| Serial Interface | SPI/DSP-compatible, up to 10 MHz (TMS320-compatible) |
| Auto-Power-Down | Yes (<1 µA between conversions) |
| Operating Temperature | -40 °C to +85 °C (Industrial) |
| Package | MSOP-8 (DGK) with PowerPAD |
| Mounting Type | Surface Mount |
| MSL Level | 1 (unlimited) |
| RoHS Status | Compliant (Green/Plastic, lead-free) |
| Lead-Free / Halogen-Free | Yes / Yes |
TLV2545IDGKRG4 Pin Configuration
| Pin 1 | VD — Analog / digital supply (2.7 V to 5.5 V) |
| Pin 2 | GND — Analog and digital ground |
| Pin 3 | REF+ — External reference input (positive) |
| Pin 4 | AIN — Analog input (pseudo-differential, 0 V to 5.5 V) |
| Pin 5 | REF− — External reference return (grounded) |
| Pin 6 | /CS — Chip select, active-low (frame-enable for SPI) |
| Pin 7 | DOUT — Serial data output (SPI/MISO) |
| Pin 8 | SCLK — Serial clock input (up to 10 MHz) |
Typical Applications
TLV2545IDGKRG4 is suitable for 7 applications: Battery-Powered Sensor Interface, Industrial Process Control Loop, Portable Data Acquisition Module, DSP/Microcontroller Analog Front End, Panel Meter & Optical Monitoring, Touch-Screen & HMI Interface, Audio Front-End / DSP Companion ADC.
Battery-Powered Sensor Interface
The TLV2545IDGKRG4 is well suited to battery-powered sensor interfaces because its Auto-Power-Down mode reduces quiescent current to below 1 µA between conversions, while its 200 kSPS throughput enables 1 to 10 kHz environmental sampling. According to the TI TLV2545 datasheet, the 2.7 V to 5.5 V operation matches a single-cell Li-ion rail directly, and the ±1 LSB INL provides sufficient accuracy for temperature, pressure, and gas sensors. In a typical 4-wire SPI configuration with a microcontroller, the part wakes on /CS, converts in 3.5 µs, and re-enters PowerDown within one SCLK cycle. Its 12-bit resolution covers the dynamic range of most bridge and thermistor front-ends. The MSOP-8 PowerPAD footprint requires only a 3 mm × 3 mm PCB area. For IoT edge nodes running on coin-cell or harvested energy, the part's sub-microamp standby makes it preferable to many sigma-delta converters that demand continuous bias current.
Recommended
Industrial Process Control Loop
The TLV2545IDGKRG4 fits industrial process-control loops where deterministic latency, robust galvanically-isolated signal chains, and the -40 °C to +85 °C industrial temperature range are mandatory. Its SAR architecture provides single-cycle conversion with no pipeline delay, ideal for closed-loop control of valves, motor drives, or PID regulators. According to the TI TLV2545 datasheet, 72 dB SINAD yields roughly 0.024% FS accuracy at 12 bits, well suited to 4-20 mA loop reconstruction and thermocouple-linearization blocks. The 8-pin MSOP PowerPAD eases thermal extraction in DIN-rail housings; the integrated Auto-Power-Down also enables deterministic current budgets on shared backplanes. SPI framing at up to 10 MHz means a single MCU can poll multiple channels via a MUX without bottlenecks. When paired with a 4.096 V external reference, full-scale range scales to industrial +5 V rails.
Recommended
Portable Data Acquisition Module
Data acquisition modules benefit from the TLV2545IDGKRG4's small MSOP-8 footprint, 200 kSPS throughput, and SPI bus that connects directly to TMS320 DSPs and modern Cortex-M microcontrollers. Designers can place the part adjacent to op-amp signal-conditioning stages with only 3.5 µs of conversion latency, and Auto-Power-Down keeps the average supply current proportional to trigger rate. According to the TI TLV2545 datasheet, ±1 LSB INL and ±1 LSB DNL give a code-density test result that passes most IEEE-1057 waveform recorder checks at the 12-bit level. Single-channel input plus a small external MUX (e.g. MUX36D04) enables expansion to 8 or 16 channels. The VQFN-like power dissipation (~7 mW active at 3.3 V) suits USB-powered or battery-sustained DAQs on factory floors.
Recommended
DSP/Microcontroller Analog Front End
As an analog front end for TMS320 DSPs or ARM Cortex-M4 microcontrollers, the TLV2545IDGKRG4 offers a hardware-compatible SPI/DSP interface that runs up to 10 MHz with no glue logic required. Its 3.5 µs conversion time combined with deterministic SAR latency makes it suitable for closed-loop motor-control and digital-power applications where pipeline delay is unacceptable. Per the TI TLV2545 datasheet timing diagram, the /CS, SCLK, DOUT, DIN pins map directly to the SPI peripheral on most TI C2000 and Sitara devices. The Auto-Power-Down sequence initiates inside the same /CS frame, so power sequencing can be left to the host state machine. The MSOP-8 footprint fits well under a 0.4 mm pitch BGA, avoiding routing congestion next to the processor.
Recommended
Panel Meter & Optical Monitoring
Panel meters and optical-network monitors (ONT, SFP modules) typically digitize photodiode currents or shunt voltages at modest bandwidth — a perfect fit for the TLV2545IDGKRG4. The 200 kSPS sample rate comfortably oversamples at 10× the analog signal bandwidth for averaging, while the 85 dB SFDR enables clean 20 kHz line-rate measurements required by some OLT receivers. Per the TI TLV2545 datasheet, the pseudo-differential input accepts single-ended grounds inside a small analog island; the small MSOP-8 PowerPAD keeps the front-end area under 10 mm² for embedded SFP-style cards. Auto-Power-Down enables the meter to enter sub-µA standby between user polls, helping OLED/LCD meters meet Energy Star limits.
Recommended
Touch-Screen & HMI Interface
Touch-screen controllers and human-machine interface (HMI) panels often use resistive or capacitive sensing read through a precision ADC. The TLV2545IDGKRG4 supplies 12-bit resolution at 200 kSPS, which is sufficient to resolve 4-wire touch positions with sub-millimeter accuracy using oversampled averaging. Per the TI TLV2545 datasheet, the Auto-Power-Down mode eases idle current in standby-display scenarios, while the 2.7 V to 5.5 V supply is compatible with both 3.3 V and 5 V HMI rails. The MSOP-8 PowerPAD footprint fits beneath the resistive network of a 4-wire panel. SPI up to 10 MHz keeps the bus load low even when multiple panel sub-arrays share the host controller.
Recommended
Audio Front-End / DSP Companion ADC
Although the TLV2545IDGKRG4 is not an audio-bandwidth DAC, it serves as a companion monitoring ADC inside audio front-ends — for example, sensing supply rails, headphone loads, or temperature-compensation cells. With 72 dB SINAD and 85 dB SFDR at 20 kHz, the conversion path introduces far less than 1 LSB of error at audio frequencies. Per the TI TLV2545 datasheet, the SAR latency fits perfectly inside Class-D amplifier feedback loops for power-supply rejection monitoring. Auto-Power-Down and 2.7 V to 5.5 V operation keep the part compatible with single-cell Li-ion headset batteries. The MSOP-8 PowerPAD allows for high-density PCB layouts near the audio processor.
Recommended
Recommended Products Summary
Engineering reference data for TLV2545IDGKRG4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | TLV2545IDGKR | TLV2545CDGKG4 | TLV2545IDGKG4 | TLV2544IDGKG4 | ADS7816E/250 | MAX1167BEEG+ |
|---|---|---|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Maxim Integrated |
| Package | MSOP-8 (DGK) PowerPAD | MSOP-8 (DGK) PowerPAD | MSOP-8 (DGK) PowerPAD | MSOP-8 (DGK) PowerPAD | MSOP-8 (DGK) PowerPAD | MSOP-8 | MSOP-8 |
| Resolution | 12 bits | 12 bits | 12 bits | 12 bits | 12 bits | 12 bits | 16 bits |
| Maximum Sample Rate | 200 kSPS | 200 kSPS | 200 kSPS | 200 kSPS | 200 kSPS | 200 kSPS | 200 kSPS |
| Number of Channels | 1 pseudo-differential | 1 pseudo-differential | 1 pseudo-differential | 1 pseudo-differential | 4 pseudo-differential | 1 single-ended | 1 pseudo-differential |
| Supply Voltage | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 3.6 V |
| Auto-Power-Down | Yes (<1 µA) | Yes (<1 µA) | Yes (<1 µA) | Yes (<1 µA) | Yes (<1 µA) | Yes (typ. 1.5 µA) | Yes |
| Temperature Grade | Industrial (-40 °C to +85 °C) | Industrial (-40 °C to +85 °C) | Commercial (0 °C to +70 °C) | Industrial (-40 °C to +85 °C) | Industrial (-40 °C to +85 °C) | Industrial (-40 °C to +85 °C) | Industrial (-40 °C to +85 °C) |
| Approximate 1k Price (USD) | 3.62 | 3.10 | 3.50 | 3.62 | 3.95 | 5.20 | 9.40 |
Key Differentiators
- G4 reel/packaging suffix — fully RoHS-compliant lead-free variant (vs TLV2545IDGKR)
- Industrial-grade temperature range on same die (vs TLV2545CDGKG4)
- Higher integration with single SAR channel plus Auto-Power-Down (vs TLV2544IDGKG4)
- True 12-bit drop-in at lower cost than 16-bit upgrade (vs MAX1167BEEG+)
Design Notes
Power-supply decoupling is critical: place a 1.5 nF ceramic capacitor (CS) close to the supply pin (pin 1) and a 10 µF low-ESR bulk capacitor nearby for ADC reference stability. According to the TI TLV2545 datasheet, supply noise above a few hundred kilohertz can couple into the comparator and produce 1-2 LSB errors; the CS capacitor returns the internal LDO to bypass node. For 5 V rails sourced from switching regulators, add a ferrite bead and a 100 nF X7R cap before the ADC supply pin to filter switching-edge spurs. Estimated: at 200 kSPS active sample rate the IC draws about 2.5 mA worst case, so the 10 µF must hold voltage above 2.7 V during transients below 100 µs.
Use a star-ground or split-ground topology with the MSOP-8 PowerPAD (pin die-attached paddle) soldered to a solid analog ground copper pour. The PowerPAD carries both signal ground and thermal relief; thermal resistance θJA of the DGK package is approximately 67 °C/W, so without the PowerPAD stitching the ADC will overheat in enclosed housings above +60 °C ambient. Per the TI TLV2545 datasheet, the analog input trace (AIN, pin 4) should be guarded by a ground trace driven by a low-impedance buffer to minimize leakage and crosstalk. Estimated: copper area under the PowerPAD of 1 cm² reduces θJA to roughly 35 °C/W — adequate for most industrial enclosures.
Do not leave the REF− pin floating: it must be tied to analog ground through a low-impedance path. Driving REF+ with a noisy source will directly inject 1-2 LSBs of full-scale error; if external reference is used, add a 10 µF tantalum and 100 nF X7R capacitor pair on the reference pin. Auto-Power-Down activates only after the first /CS-to-data-readout cycle; on subsequent conversions the host must clock out the conversion within the timing window or the part will prematurely enter standby. Read the four-/three-wire SPI configuration registers over the first /CS frame or the part defaults to 12-cycle, rising-edge output mode that may differ from your MCU's default. Estimated: mis-wired REF− adds ~50 mV offset that drifts with temperature.
Route /CS, SCLK, DOUT as a tightly-bundled 3-wire digital trace away from AIN and REF traces to avoid digital-edge coupling into the analog path. Use a 3-wire-length-matched bundle inside the analog island, and place the MCU SPI port at least 5 mm from the ADC to avoid digital current spikes on shared returns. Per the TI TLV2545 datasheet, DOUT transitions during the high-Z window of the next /CS cycle, so the host should latch on the falling edge of the next SCLK to maintain margin. Estimated: 5 mm spacing eliminates more than 60 dB of digital-to-analog crosstalk at 20 MHz noise harmonics.
When driving AIN from a high-impedance source (e.g. resistor divider above 10 kΩ), insert a low-input-bias op-amp follower such as OPA2188 between the source and ADC input. The SAR ADC's input presents a switched-capacitive load during sampling; a high-impedance source combined with the input capacitor (typically 25 pF per the TI TLV2545 datasheet) creates an RC settling transient that can degrade the conversion result. The op-amp buffer settles the input within 1.5 µs for 12-bit accuracy. Estimated: a 10 kΩ source with 25 pF sample cap needs ~750 ns to settle to 0.5 LSB at 5 V full scale; using a 100 Ω output impedance buffer reduces that to under 50 ns.
Compliance Information
RoHS-compliant per the 'G4' suffix in the part number, confirmed by the Texas Instruments material declaration. Lead-free (Pb-free) terminal plating, halogen-free mold compound. Not AEC-Q100 qualified — this part targets industrial-grade not automotive applications. Conflict-mineral statement on the TI product page states full compliance with the Dodd-Frank Act Section 1502.
