XC7Z100-1FF900I vs XC7Z100-2FF900I So sánh
So sánh chi tiết song song của XC7Z100-1FF900I bằng AMD và XC7Z100-2FF900I bằng AMD. So sánh các thông số quan trọng, thông số điện tử, gói gọn, trạng thái vòng đời, giá cả và khả năng cung cấp để xác định linh kiện tốt nhất cho yêu cầu thiết kế của bạn.
So sánh thông số kỹ thuật
| Tham số | XC7Z100-1FF900I | XC7Z100-2FF900I |
|---|---|---|
| Thương hiệu | AMD | AMD |
| Danh mục | FPGA & CPLD | FPGA & CPLD |
| Trạng thái vòng đời | Hoạt động | Hoạt động |
| Product Type | Zynq-7000 system on chip | — |
| Processor Configuration | Dual Arm Cortex-A9 MPCore | — |
| Processor Operating Frequency | 667 MHz | — |
| FPGA Logic Cells | 444K logic cells | 444K logic cells |
| FPGA Architecture | Kintex-7 | — |
| Debug and Trace | CoreSight | — |
| Package Type | 900-FCBGA | — |
| Package Dimensions | 31 x 31 mm | — |
| Package Ball Count | 900 balls | — |
| Device Family | Zynq-7000 | — |
| Architecture | Dual-core ARM Cortex-A9 with Kintex-7 programmable logic | — |
| Khoảng nhiệt độ hoạt động | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: minimum and maximum operating temperature] |
| Supply Voltage Range | [DATA_NEEDED: supply voltage range] | — |
| Maximum I/O Count | [DATA_NEEDED: maximum I/O count] | — |
| Block RAM Capacity | [DATA_NEEDED: block RAM capacity] | — |
| DSP Slice Count | [DATA_NEEDED: DSP slice count] | — |
| Trạng thái RoHS | RoHS | [DATA_NEEDED: RoHS compliance declaration] |
| Kiểu lắp đặt | Surface mount | Surface mount |
| Manufacturer Qualification | [DATA_NEEDED: industrial or automotive qualification] | — |
| Device Type | — | Zynq-7000 Kintex-7 programmable system-on-chip |
| Processor Subsystem | — | Dual ARM Cortex-A9 MPCore |
| Processor Clock Rating | — | 800 MHz |
| FPGA Family | — | Kintex-7 |
| Hộp | — | 900-FCBGA, 31 mm x 31 mm |
| Package Pin Count | — | 900 pins |
| Device Speed Grade | — | -2 |
| Temperature Grade | — | Industrial |
| Integrated Programmable Logic | — | 444K Kintex-7 logic cells |
| Debug Support | — | ARM CoreSight debug resources |
| Design Toolchain | — | AMD FPGA and SoC development toolchain; exact version [DATA_NEEDED: design toolchain version] |
| Number of High-Speed Transceivers | — | [DATA_NEEDED: transceiver count] |
| Maximum Transceiver Data Rate | — | [DATA_NEEDED: maximum transceiver data rate] |
| Programmable I/O Count | — | [DATA_NEEDED: programmable I/O count] |
| Memory Interface Details | — | [DATA_NEEDED: memory interface types and supported rates] |
| Power Supply Inputs | — | [DATA_NEEDED: supply rail names and voltage ranges] |
| Typical Power Consumption | — | [DATA_NEEDED: typical and maximum power consumption] |
| REACH Status | — | [DATA_NEEDED: REACH compliance declaration] |
| Lead-Free Status | — | [DATA_NEEDED: lead-free packaging declaration] |
| AEC-Q100 Qualification | — | Not applicable; this is an FPGA and SoC rather than an automotive-grade discrete component |
| Package Thermal Resistance | — | [DATA_NEEDED: package thermal resistance] |