10CX150YF672I5G - Cyclone 10 GX FPGA, 150K LE, 672-FCBGA | Intel
MPN: 10CX150YF672I5G ✓ Hoạt động10CX150YF672I5G Tóm tắt
An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit that combines programmable logic blocks, configurable interconnects, and dedicated DSP/memory blocks into a single silicon die. Within the broader taxonomy, an FPGA sits as a specialized subclass of programmable logic devices (PLDs) and, more generally, as an application-specific integrated circuit (ASIC) alternative under the digital semiconductor hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit. Cyclone 10 GX specifically targets cost-optimized, transceiver-enabled designs that previously required more expensive mid-range FPGAs.
Key features of the 10CX150YF672I5G include up to 12.5 Gbps multi-gigabit transceivers, a hard memory controller for DDR3/DDR4/LPDDR3 external memory, PCI Express Gen2 hard IP blocks, and a 1.4 Gbps LVDS serializer/deserializer interface. The 672-FCBGA package supports high I/O count with dedicated high-speed transceiver and LVDS pairs. With 54,770 adaptive logic modules (ALMs) and 156 18x19 multipliers, the device balances logic density with DSP throughput for video bridging, machine vision, and industrial wireless backhaul.
Architecturally, the Cyclone 10 GX family uses a 20 nm process with hard IP blocks for transceivers, PCIe Gen2, and external memory controllers, freeing programmable fabric for application logic. The hard transceiver PHY eliminates the soft-SERDES power penalty and reduces latency for protocols such as 10 GbE, CPRI, and JESD204B. According to Intel Cyclone 10 GX device documentation, the 150 K LE variant targets designs that need richer transceiver count and DSP than Cyclone V but do not require the higher logic capacity of Arria 10.
Typical applications include industrial machine vision frame grabbers, video broadcast equipment, PCIe Gen2 endpoint cards, 5G small-cell fronthaul, low-latency financial trading, and automotive ADAS sensor aggregation. The transceiver bandwidth and PCI Express Gen2 hard IP make it well suited for line-rate 10G Ethernet switching and CPRI 4.9G wireless backhaul. The industrial temperature range supports factory floor deployment without thermal screening.
When designing with this FPGA, allocate sufficient PCB area for the 672-ball FCBGA (27 mm x 27 mm, 1.0 mm ball pitch) and follow Intel's recommended PCB stack-up for impedance-controlled transceiver channels. Decoupling requirements, transceiver channel routing, and JTAG/AS configuration pin placement should follow the manufacturer pin connection guidelines. This page synthesizes distributor pricing, drop-in alternative guidance, and practical design notes not found in the manufacturer datasheet alone.
Bộ thay thế dễ dàng lắp đặt cho 10CX150YF672I5G — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với 10CX150YF672I5G (cùng hình factor và footprint) — khác nhau ở Package, Operating Temperature, Speed Grade, Adaptive Logic Modules (ALM), Embedded Memory.
10CX105YF672I5G
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →10CX150YF672E5G
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →10CX150YF672I6G
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →10CX150YF672E6G
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →10CX105YF672I6G
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →10CX150YF672I5G Tỷ lệ tối đa & tính chất điện
| Family | Cyclone 10 GX |
| Logic Elements | 150,000 |
| Adaptive Logic Modules (ALMs) | 54,770 |
| Embedded Memory | 10,907,648 bits (10.652 Mbit) |
| Number of I/Os | 236 |
| Hộp | 672-BBGA, FCBGA (27 mm x 27 mm, 1.0 mm pitch) |
| Operating Supply Voltage (Core) | 0.9 V |
| Nhiệt độ hoạt động | -40C to +100C (Industrial) |
| Kiểu lắp đặt | SMD/SMT |
| Transceiver Data Rate | Up to 12.5 Gbps |
| PCI Express Hard IP | Gen2 (x1/x2/x4) |
| External Memory Interface | DDR3, DDR4, LPDDR3 hard controller |
| Multipliers | 156 (18 x 19) |
| Process Technology | 20 nm |
| Trạng thái RoHS | Compliant |
Hướng dẫn cấu hình chân 10CX150YF672I5G 672-bbga, fcbga (27 mm x 27 mm, 1.0 mm pitch)
Cấu hình chân cho 10CX150YF672I5G (672-bbga, fcbga (27 mm x 27 mm, 1.0 mm pitch) gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho 10CX150YF672I5G.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
10CX150YF672I5G phù hợp cho 6 Áp dụngs: Industrial Machine Vision Frame Grabber, 10 Gigabit Ethernet Aggregation Switch Line Card, Wireless Fronthaul CPRI 4.9G / 9.8G Radio Unit, Video Broadcast Routing and Processing, Low-Latency Financial Trading Appliance, Automotive Sensor Aggregation ECU.
Industrial Machine Vision Frame Grabber
The 10CX150YF672I5G's 12.5 Gbps transceivers and PCIe Gen2 x4 hard IP make it ideal for industrial machine vision frame grabbers that aggregate multiple CoaXPress or Camera Link HS camera streams. The 150 K logic elements, 156 18x19 multipliers, and 10.65 Mbit embedded memory support real-time image preprocessing (tap balancing, gamma correction, defect pixel replacement) before DMA transfer to host CPU via PCIe Gen2. The industrial -40C to +100C temperature range enables deployment on factory floors without thermal screening. Place the FPGA on a host PCIe card with a 4-lane Gen2 edge connector; a SFP+ cage connects to remote cameras over fiber up to 10 km. Estimated fabric utilization for a 4-channel CoaXPress 1.1 frame grabber: 65-80% of 150 K LE.
Được đề xuất
10 Gigabit Ethernet Aggregation Switch Line Card
The 10CX150YF672I5G integrates four 12.5 Gbps transceivers that can be configured as four 10 GbE SFP+ ports with hardware 10G MAC IP, making it suitable for top-of-rack aggregation line cards in cost-sensitive data center switches. The hard PCIe Gen2 x4 controller provides an out-of-band management plane to the switch CPU complex. According to Intel Cyclone 10 GX documentation, the 10G Ethernet MAC hard IP achieves line-rate performance with minimal fabric utilization. Industrial temperature grade supports thermally constrained rack environments. Place a heatsink on the FCBGA's exposed die region; airflow of 200 LFM minimum is recommended for full transceiver operation.
Được đề xuất
Wireless Fronthaul CPRI 4.9G / 9.8G Radio Unit
The 10CX150YF672I5G's 12.5 Gbps transceivers and 150 K logic elements support CPRI 4.9G and 9.8G links between baseband units (BBU) and remote radio heads (RRH) in 4G LTE and 5G NR small-cell deployments. The hard PCIe Gen2 controller interfaces to a baseband SoC, while CPRI soft IP (CPRI v7.0) consumes roughly 25 K LE per link with scrambling, IQ data buffering, and control plane management. Industrial temperature grade supports outdoor radio unit enclosures without active cooling. A single 10CX150YF672I5G can handle up to three CPRI 9.8G links plus a 10 GbE backhaul, total fabric utilization approximately 70-85%.
Được đề xuất
Video Broadcast Routing and Processing
The 10CX150YF672I5G serves in broadcast video routers and format converters supporting 12G-SDI, 3G-SDI, and HDMI 2.0 streams. The 12.5 Gbps transceivers can deserialize 12G-SDI (11.88 Gbps) with margin, while the 156 18x19 multipliers enable real-time color space conversion (REC.709 to REC.2020) and HDR tone mapping. The 10.65 Mbit embedded memory buffers multiple video frames for genlock and frame synchronization across async sources. Designers can implement a 4x4 12G-SDI router with on-screen display overlay using approximately 90% of available logic and 60% of embedded memory.
Được đề xuất
Low-Latency Financial Trading Appliance
The 10CX150YF672I5G delivers sub-microsecond packet processing latency required for high-frequency trading (HFT) appliances. The 12.5 Gbps transceivers interface to 10 GbE market data feeds, while the FPGA fabric implements wire-speed parsing of ITCH, FIX, and FAST protocols plus pre-trade risk checks. According to Intel documentation, Cyclone 10 GX hard IP MAC plus soft parser achieves deterministic <500 ns latency from PHY to application logic. Industrial temperature grade supports colocation data centers. A 4x10G feed handler with order book management typically uses 80-110 K LE, fitting within the 150 K fabric with margin for additional analytics.
Được đề xuất
Automotive Sensor Aggregation ECU
The 10CX150YF672I5G aggregates multiple automotive sensors (cameras, radar, lidar) in advanced driver assistance systems (ADAS) sensor ECUs. The 12.5 Gbps transceivers interface to automotive Ethernet (1000BASE-T1, 100BASE-T1) and FPD-Link III deserializers, while the PCIe Gen2 hard IP connects to the central ADAS SoC. The 150 K logic elements support sensor fusion preprocessing (object detection, lane marking, free-space computation) before forwarding to the central processor. While the industrial temperature grade (-40C to +100C) covers most automotive cabin deployments, AEC-Q100 qualified variants like 10CX220YF672I7G may be required for safety-critical ADAS functions. Fabric utilization for a 4-camera + 1 radar sensor ECU: approximately 95-120 K LE.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho 10CX150YF672I5G — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | 10CX105YF672I5G | 10CX150YF672E5G | 10CX105YF672I6G | 10CX150YF672E6G | 10CX105YF780E6G |
|---|---|---|---|---|---|---|
| Package | 672-FCBGA | 672-FCBGA (same) | 672-FCBGA (same) | 672-FCBGA (same) | 672-FCBGA (same) | 780-FCBGA (different package) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 150,000 | 105,000 (-30%) | 150,000 (same) | 105,000 (-30%) | 150,000 (same) | 105,000 (-30%) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (same) | Commercial (0C to +85C) | Industrial (same) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | 5 | 5 (same) | 5 (same) | 6 (slower) | 6 (slower) | 6 (slower) |
| Transceiver Data Rate | Up to 12.5 Gbps | Up to 12.5 Gbps (same) | Up to 12.5 Gbps (same) | Up to 12.5 Gbps (same) | Up to 12.5 Gbps (same) | Up to 12.5 Gbps (same) |
| Core Voltage | 0.9 V | 0.9 V (same) | 0.9 V (same) | 0.9 V (same) | 0.9 V (same) | 0.9 V (same) |
Bảo phân biệt quan trọng
- Highest LE count among 672-FCBGA Cyclone 10 GX industrial variants (vs10CX105YF672I5G)
- Industrial temperature grade for harsh environment deployment (vs10CX150YF672E5G)
- Faster speed grade 5 for timing-critical designs (vs10CX150YF672I6G)
Ghi chú thiết kế
Estimated: The 672-FCBGA package measures 27 mm x 27 mm with a 1.0 mm ball pitch, requiring a high-density interconnect (HDI) PCB stack-up with micro-via technology. Follow Intel's Cyclone 10 GX PCB design guidelines for impedance-controlled transceiver channels (100 ohm differential for 10 GbE, 85 ohm for CPRI). Use a minimum 8-layer stack-up with dedicated ground and power planes adjacent to the BGA breakout layer. Decoupling requirements per the manufacturer pin connection guidelines specify bulk, mid-frequency, and high-frequency decoupling capacitors placed within 100 mils of the BGA balls.
Estimated: At maximum transceiver utilization (all transceivers active at 12.5 Gbps) plus 80% fabric utilization, the 10CX150YF672I5G may dissipate 4-6 W depending on toggle rate. The 672-FCBGA package relies on the PCB for heat dissipation - no integrated heatsink. Design with a thermal pad area on the top PCB layer covering the die region, connected via thermal vias to internal ground planes. For enclosed systems, provide minimum 200 LFM airflow or attach an external heatsink with thermal interface material rated for the industrial temperature range.
Route high-speed transceiver channels with continuous reference planes (ground) on the layer immediately below. Maintain maximum trace length matching of 5 mils within a transceiver pair and across TX/RX pairs feeding the same protocol. For PCIe Gen2 x4 hard IP, route all four lanes on the same PCB layer with matched lengths; avoid vias in the transceiver channel path. JTAG and AS configuration pins (TCK, TMS, TDI, TDO, nCONFIG, nSTATUS, CONF_DONE, MSEL[4:0]) require careful placement near board edges for in-system programming access. Place the configuration flash (EPCS or compatible) within 2 inches of the FPGA for reliable AS mode boot.
Cyclone 10 GX transceivers require AC-coupled connections with 100 nF capacitors on both TX and RX pairs for protocols above 3 Gbps. For CPRI 4.9G and 9.8G, follow the JESD204B/EIA-364-1000 specification for connector and cable selection. Reference clocks must meet the transceiver reference clock jitter specification (typically <300 fs RMS jitter for 12.5 Gbps operation); use a dedicated low-jitter oscillator such as the SiTime SiT9102 or equivalent. Verify signal integrity with post-layout IBIS-AMI simulation using Intel's Quartus Prime SignalTap or external tools like Ansys HFSS.
Critical pitfalls to avoid: (1) Do not enable all 12.5 Gbps transceivers simultaneously without adequate thermal design - peak power exceeds typical operating power. (2) The MSEL[4:0] pins select the configuration scheme (AS, PS, JTAG, FPP); incorrect strapping resistors prevent boot. (3) Cyclone 10 GX requires a specific power-on sequence per the family datasheet - core voltage (0.9 V) must stabilize before I/O voltages. (4) Do not exceed the maximum I/O bank supply voltage (3.3 V LVCMOS or 1.8 V/1.5 V/1.2 V HSTL/SSTL). (5) Industrial-grade parts may require special ordering codes; verify 'I' suffix in the part number when sourcing from distributors.
Thông tin tuân thủ
RoHS compliant per Intel product environmental documentation. Industrial temperature grade only; AEC-Q100 qualified variants available in other Cyclone 10 GX SKUs. Halogen-free status should be verified via Intel Product Compliance declaration.
