10CX220YF672I5G - 220K LE Cyclone 10 GX FPGA, 672-FCBGA
MPN: 10CX220YF672I5G ✓ Hoạt động10CX220YF672I5G Tóm tắt
An FPGA (Field-Programmable Gate Array) is a programmable logic device whose architecture consists of configurable logic blocks (CLBs / ALMs), programmable interconnect, block RAM (BRAM), DSP slices, and hardened I/O serdes, all fabricated on a CMOS process. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) and semiconductor ICs, distinguished from ASICs by their post-fabrication reconfigurability and from CPLDs by their finer-grained architecture and much higher logic capacity.
Key features include 80330 adaptive logic modules (ALMs), 13.43 Mbit embedded memory, support for up to 12.5 Gbps transceivers on selected pins, hardware DSP blocks for fixed- and floating-point arithmetic, and a hard memory controller subsystem for DDR3/DDR4/LPDDR3 external memory interfaces. The F672 package provides 236 general-purpose I/Os and uses Intel's standard Cyclone 10 GX pin-out so existing board designs can drop the part in without remapping.
The 20nm process node yields an attractive performance-per-watt ratio, with the -5 speed grade indicating a mid-tier Fmax placement. The Cyclone 10 GX architecture merges low-power logic fabric with embedded transceivers and PCIe Gen2 hard IP, allowing single-chip implementation of protocol bridging, motor control, video processing, and software-defined radio front-ends.
Typical applications include industrial machine vision, factory automation backplanes, video surveillance and broadcast equipment, low-cost 10G Ethernet aggregation, PCIe-over-cable bridges, and embedded computing platforms for IoT gateways. Designers also use the device in test and measurement front-ends and as a programmable logic companion to ASSPs in automotive driver-assistance subsystems (industrial temperature grade required).
A key design consideration for FPGAs of this density is power budgeting. Use the Intel FPGA Power and Thermal Calculator (PTC) early in the design cycle to estimate junction temperature and supply-rail currents; the 672-FCBGA's exposed-die thermal pad must be soldered to a multi-layer PCB land pattern with at least a 6x6 via array to the internal ground plane.
This page synthesizes current distributor pricing, drop-in Cyclone 10 GX density and speed-grade alternatives, and practical PCB/thermal design guidance not found in the manufacturer datasheet alone.
Bộ thay thế dễ dàng lắp đặt cho 10CX220YF672I5G — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với 10CX220YF672I5G (cùng hình factor và footprint) — khác nhau ở Package, Embedded Memory, Logic Elements, Mounting Type, Operating Temperature.
10CX220YF672E5G
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →10CX220YF672E6G
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →10CX150YF672I5G
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →10CX150YF672E5G
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →10CX105YF672I5G
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →10CX105YF672E5G
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →10CX220YF672I5G Tỷ lệ tối đa & tính chất điện
| Family | Cyclone 10 GX |
| Logic Elements | 220000 |
| Adaptive Logic Modules (ALMs) | 80330 |
| Embedded Memory | 13.43 Mbit (13,752,320 bits) |
| User I/Os | 236 |
| Hộp | 672-BBGA, FCBGA |
| Kiểu lắp đặt | Surface Mount (SMD/SMT) |
| Process Technology | 20 nm |
| Core Supply Voltage | 0.9 V |
| Nhiệt độ hoạt động | -40C to +100C (Industrial) |
| Speed Grade | -5 (mid-tier) |
| Hard Memory Controller | DDR3 / DDR4 / LPDDR3 |
| Transceivers | Up to 12.5 Gbps (per family datasheet) |
| DSP Blocks | Yes (hardware DSP slices) |
| Trạng thái RoHS | Compliant |
Hướng dẫn cấu hình chân 10CX220YF672I5G 672-bbga, fcbga
Cấu hình chân cho 10CX220YF672I5G (672-bbga, fcbga gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho 10CX220YF672I5G.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
10CX220YF672I5G phù hợp cho 6 Áp dụngs: Industrial Machine Vision, 10G Ethernet Aggregation / Protocol Bridging, Video Surveillance and Broadcast Equipment, PCIe-over-Cable Bridges, Test & Measurement Front-Ends, Software-Defined Radio Front-End.
Industrial Machine Vision
The 10CX220YF672I5G fits industrial machine vision because its 220,000 logic elements and hardware DSP blocks can sustain multi-channel image-processing pipelines (CoaXPress or GigE Vision) at line rates of 10-25 Gbps aggregate. The device's 13.43 Mbit embedded block RAM holds full-HD frame buffers without external SRAM, while the industrial -40C to +100C temperature grade meets factory-floor thermal envelopes. Compared with smaller Cyclone 10 GX parts, the 220K-LE fabric leaves headroom for proprietary pre-processing IP. Recommended companion: external DDR3 memory for double-buffering.
Được đề xuất
10G Ethernet Aggregation / Protocol Bridging
The 10CX220YF672I5G's hardened transceivers (up to 12.5 Gbps per the family datasheet) directly accept SFP+ optical modules, enabling single-chip 4x10G aggregation or 10G-to-1G fan-out bridges. The 220K-LE fabric accommodates L2/L3 forwarding logic and traffic management, while 13.43 Mbit of block RAM supports deep packet buffers. The 672-FCBGA pin-out exposes enough LVDS and general-purpose I/O for multi-port management interfaces. Power budget: 5-7W typical, requiring a 6x6 thermal-via array under the package.
Được đề xuất
Video Surveillance and Broadcast Equipment
The 10CX220YF672I5G is ideal for video surveillance recorders and broadcast processing because its hardware DSP slices accelerate H.264/H.265 encoding offload and color-space conversion at multi-stream rates. The 13.43 Mbit block RAM holds several compressed-frame slices, while DDR3/LPDDR3 hard controllers externalize main frame storage. Industrial temperature operation (-40C to +100C) suits outdoor NVR enclosures, and the 0.9V core supply keeps total power within fanless thermal envelopes. The 236 user I/Os drive multiple MIPI or HDMI bridge PHYs simultaneously.
Được đề xuất
PCIe-over-Cable Bridges
The 10CX220YF672I5G's hard PCIe Gen2 IP block, combined with its 12.5 Gbps transceivers, lets designers build single-chip PCIe Gen2 x4 to SFP+ or 10GBase-KR bridges for industrial backplanes. The 220K-LE fabric supports DMA engines, address translation, and protocol multiplexing, while 13.43 Mbit of embedded memory holds descriptor rings and packet buffers. Industrial -40C to +100C operation tolerates uncontrolled switch-room environments. Compared with ASSP bridge ICs, this FPGA approach allows field-upgradable protocol firmware via JTAG.
Được đề xuất
Test & Measurement Front-Ends
The 10CX220YF672I5G suits test-and-measurement front-ends because its 12.5 Gbps transceivers capture multi-Gsps ADC sample streams, while 220K logic elements implement real-time FFT, FIR filtering, and trigger logic. The 13.43 Mbit block RAM is large enough for deep capture windows, and the 236 user I/Os synchronize parallel ADCs/DACs and front-panel controls. Industrial temperature operation permits bench-to-rack deployment. Power estimation must use the Intel FPGA Power and Thermal Calculator (PTC) to avoid junction-temperature overshoot.
Được đề xuất
Software-Defined Radio Front-End
The 10CX220YF672I5G's 12.5 Gbps transceivers down-convert wideband IF signals to baseband, while its hardware DSP slices run polyphase channelizers, digital down-converters, and FFT cores simultaneously. The 220K-LE fabric supports multiple demodulator chains, and 13.43 Mbit of block RAM holds sample-history windows for adaptive filtering. The 672-FCBGA package routes LVDS to high-speed ADC/DAC companion chips. Industrial -40C to +100C operation covers outdoor tactical and commercial SDR deployments.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho 10CX220YF672I5G — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | 10CX220YF672E5G | 10CX220YF672E6G | 10CX150YF672I5G | 10CX105YF672I5G |
|---|---|---|---|---|---|
| Package | 672-FCBGA (F672) | 672-FCBGA (F672) - same | 672-FCBGA (F672) - same | 672-FCBGA (F672) - same | 672-FCBGA (F672) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 220000 | 220000 | 220000 | 150000 | 105000 |
| Speed Grade | -5 | -5 | -6 (slower) | -5 | -5 |
| Temperature Grade | Industrial (-40C to +100C) | Extended Commercial (0C to +100C) | Extended Commercial (0C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| User I/Os | 236 | 236 | 236 | 236 (same package) | 236 (same package) |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
Bảo phân biệt quan trọng
- Highest-density 672-FCBGA variant of the Cyclone 10 GX family (vs10CX150YF672I5G)
- Industrial temperature grade for harsh-environment deployment (vs10CX220YF672E5G)
- Mid-tier speed grade (-5) for balanced Fmax vs cost (vs10CX220YF672E6G)
Ghi chú thiết kế
Estimated: At 0.9V core with typical 5-7W device dissipation on the 672-FCBGA, junction temperature rise must be modeled against the FCBGA's theta_JA (approximately 8-12 C/W with a 6x6 thermal-via array to inner ground plane). Run the Intel FPGA Power and Thermal Calculator (PTC) early in the design cycle using your actual toggle rate and utilization - do not rely on datasheet 'typical' values. Without a continuous thermal pad land pattern, junction temperature can exceed 125C and trigger thermal shutdown during extended 10G transceiver operation.
The 672-FCBGA requires a multi-layer PCB (8+ layers recommended) with microvia-to-BGA-pad stackups. Place at minimum 6x6 thermal-via array (0.3 mm drill, 0.5 mm pitch) under the exposed die pad, stitching all the way to the inner ground plane. Per Intel pin connection guidelines, leave dedicated GND balls adjacent to each transceiver power pin to control return-path inductance - this is critical to meet 12.5 Gbps signal-integrity masks. Decoupling: 100 nF X7R per power pin within 1 mm, plus 10 uF bulk per supply rail.
Do not assume pin compatibility with Cyclone V GX F672 packages - the 10CX220YF672I5G uses a different transceiver pin map and different power-rail sequencing. When migrating designs from Cyclone V, regenerate the pin assignment in Quartus Prime and re-spin the PCB if needed. Also confirm JTAG chain ordering: if you stack FPGAs, ensure TMS/TCK fan-out does not exceed 8 loads. Finally, validate configuration scheme (AS x4 vs JTAG vs Passive Serial) against your board's flash footprint before tape-out.
For 12.5 Gbps transceiver channels, route diff-pairs with 100 ohm differential impedance and intra-pair skew under 1 ps per cm. Use only Intel-validated transceiver reference schematics - non-standard AC-coupling capacitor values or stub lengths will degrade eye-mask margins. Reference Intel application note AN-822 for transceiver PCB layout, including via anti-pad geometry and connector break-out patterns for SFP+ cages.
Thông tin tuân thủ
RoHS compliant per Cyclone 10 GX family product page. Industrial temperature grade is not AEC-Q100 qualified - for automotive applications, evaluate AEC-Q100-qualified Cyclone 10 GX variants or use an ASSP companion. Halogen-free status not explicitly listed in the provided data.