5M2210ZF324I5N - 2210 LE MAX V CPLD, 324-ball FBGA | Intel
MPN: 5M2210ZF324I5N ✓ Hoạt động5M2210ZF324I5N Tóm tắt
What is a CPLD? A Complex Programmable Logic Device is a non-volatile programmable logic device that combines the instant-on characteristics of small PAL/GAL architectures with the higher logic density and I/O count of an FPGA-like fabric. In the broader system hierarchy, a CPLD sits below an FPGA in density but above discrete 74-series glue logic, and is most commonly used for I/O expansion, bus bridging, power-sequencing logic, and control-plane state machines in industrial, communications, and consumer designs. The MAX V family specifically targets low standby power (down to 25 uA typical) and instant-on operation after power-up.
Key features of the 5M2210ZF324I5N include 2210 LEs, up to 272 user I/O pins, 172 Kbits of user flash, internal oscillator support, JTAG and ISP programming, hot-socketing tolerance, and a commercial-to-industrial operating temperature range up to +100 C junction. The device is built on a 1.8 V core process with multi-voltage I/O banks that support LVCMOS, LVTTL, and LVDS-style signaling on the same die, eliminating the need for external level translation. The 324-ball FBGA package offers high board-density routing with the supply/ground pin distribution needed for low-EMI operation in noise-sensitive control loops.
Architecturally, the MAX V CPLD uses a non-volatile flash-based Look-Up Table (LUT) array combined with a global routing fabric, providing instant-on behavior (sub-1 ms configuration) and infinite in-system reprogrammability. The integrated flash eliminates an external boot PROM and reduces total BOM count versus SRAM-based FPGAs that require a configuration memory. JTAG (IEEE 1149.1) and a passive serial configuration port are supported for in-system programming and boundary-scan test.
Typical applications include industrial control and I/O expansion modules, telecommunications line cards and backplane glue logic, consumer electronics display and key-scan interfaces, automotive body and infotainment subsystems, and any embedded design that requires low standby power combined with deterministic instant-on behavior. The wide VCCIO range also makes the device a strong fit for mixed-voltage designs that bridge 3.3 V MCUs to 1.8 V ASICs or FPGAs.
When designing with this device, pay attention to VCCINT decoupling (1.8 V core) and place a 0.1 uF plus 10 uF capacitor pair close to each supply pin group. Configure unused I/O banks as LVCMOS inputs with internal weak pull-ups to reduce in-rush current at hot insertion. Quartus Prime or the legacy MAX+PLUS II toolchain is used to compile and program the device.
This page synthesizes distributor stock and pricing, drop-in same-package alternatives from the Intel MAX V family, and practical design notes that supplement the manufacturer datasheet with curated engineer-friendly context.
Bộ thay thế dễ dàng lắp đặt cho 5M2210ZF324I5N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với 5M2210ZF324I5N (cùng hình factor và footprint) — khác nhau ở Package, Configuration Memory, Operating Temperature, Programming Interface, User Flash Memory.
5M2210ZF324I5
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →5M2210ZF324C4N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →5M2210ZF324C5N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →5M2210ZF324A5N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →5M1270ZF324I5N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →5M2210ZF324I5N Tỷ lệ tối đa & tính chất điện
| Product Type | CPLD - Complex Programmable Logic Device |
| Series | MAX V |
| Logic Elements (LEs) | 2210 |
| User I/O Pins (max) | 272 |
| Embedded User Flash | 172 Kbits |
| Internal Supply Voltage VCCINT | 1.8 V (1.71 V to 1.89 V) |
| I/O Supply Voltages VCCIO | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Hộp | 324-ball FBGA (LBGA) |
| Kiểu lắp đặt | Surface Mount (BGA) |
| Operating Temperature (Industrial) | -40 C to +100 C (TJ) |
| Programming Interface | JTAG (IEEE 1149.1) + ISP |
| Configuration Method | Non-volatile flash, instant-on |
| Hot Socketing | Supported |
| Typical Standby Current | 25 uA (Iccstndby, data-dependent) |
| Internal Oscillator | Yes |
| Trạng thái RoHS | Compliant |
Hướng dẫn cấu hình chân 5M2210ZF324I5N 324-ball fbga (lbga)
Cấu hình chân cho 5M2210ZF324I5N (324-ball fbga (lbga) gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho 5M2210ZF324I5N.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
5M2210ZF324I5N phù hợp cho 6 Áp dụngs: Industrial I/O Expansion and Glue Logic, Telecommunications Backplane Bridging, Automotive Body Electronics and Infotainment, Consumer Electronics Display and Key-Scan Interfaces, Power Sequencing and Supervisory Logic, Motor Control and PWM Generation.
Industrial I/O Expansion and Glue Logic
The 5M2210ZF324I5N is purpose-built for industrial I/O expansion where an MCU's native GPIO is insufficient. With 2210 LEs, 272 user I/Os, and multi-voltage VCCIO support (1.2 V to 3.3 V), the device bridges 3.3 V MCUs to 1.8 V sensors, opto-isolators, and 5 V-tolerant legacy peripherals in a single chip. Its 1.8 V VCCINT core (1.71 V to 1.89 V) draws only 25 uA typical standby current, ideal for always-on industrial controllers. Designers typically pair the CPLD with an STM32 or similar MCU to handle address decoding, PWM fan control, and watchdog logic that would otherwise consume main-processor cycles.
Được đề xuất
Telecommunications Backplane Bridging
The 5M2210ZF324I5N serves as a deterministic, instant-on glue-logic bridge on telecom line cards where sub-millisecond boot is mandatory after power-up or brown-out recovery. The MAX V family's non-volatile flash configuration boots without an external boot PROM, while 172 Kbits of user flash accommodates small lookup tables and revision IDs. The 324-ball FBGA package supports high-pin-count parallel buses typical of TDM/PCM backplane interfaces, and the multi-voltage VCCIO banks interface cleanly to both legacy 3.3 V framers and modern 1.8 V SerDes logic on the same board.
Được đề xuất
Automotive Body Electronics and Infotainment
With an industrial temperature range of -40 C to +100 C junction and hot-socketing tolerance, the 5M2210ZF324I5N suits automotive body controllers, HVAC modules, and infotainment I/O hubs. The 2210 LEs handle CAN/LIN gateway logic, key-scan matrices, and backlight PWM without burdening the main MCU. The non-volatile instant-on behavior is critical for CAN wake-up sequences that must complete within 100 ms of ignition. The 324-ball FBGA footprint supports dense routing on space-constrained instrument-cluster PCBs.
Được đề xuất
Consumer Electronics Display and Key-Scan Interfaces
The 5M2210ZF324I5N's 272 user I/Os and instant-on flash configuration make it ideal for consumer product front-panel interfaces such as dishwasher, washing-machine, and microwave keypads that require 16x8 or larger key-scan matrices. The CPLD decodes the matrix, debounces inputs, drives LED backlight PWM at 200 Hz to 1 kHz, and presents a clean I2C or SPI interface to the main MCU. Standby current of 25 uA typical keeps always-on appliances within Energy Star idle budgets.
Được đề xuất
Power Sequencing and Supervisory Logic
The 5M2210ZF324I5N excels at multi-rail power sequencing in FPGA-based designs, DSP modules, and ASIC prototyping boards where multiple voltage rails (1.0 V, 1.2 V, 1.8 V, 3.3 V) must come up in a specific order. The CPLD's multi-voltage VCCIO banks interface directly to each rail's PG (power-good) signal, and the device drives discrete MOSFET gate signals or EN pins on point-of-load converters. The instant-on flash eliminates the boot-PROM requirement seen with SRAM-based PLDs, while JTAG support enables in-system reprogramming of the sequencing script.
Được đề xuất
Motor Control and PWM Generation
The 5M2210ZF324I5N generates precise, multi-channel PWM waveforms for BLDC motor control, stepper sequencing, and solenoid drivers where dedicated MCUs are overkill. Up to 272 user I/Os and deterministic pin-to-pin propagation delay support complementary PWM pairs with dead-time insertion, while the multi-voltage I/O banks interface directly to 3.3 V gate drivers or 1.8 V DSP controllers. JTAG-based ISP enables field firmware updates for motor-control calibration tables without disassembly.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho 5M2210ZF324I5N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | 5M2210ZF324I5 | 5M2210ZF324C4N | 5M2210ZF324C5N | 5M2210ZF324A5N | 5M1270ZF324I5N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 324-ball FBGA | 324-ball FBGA - same | 324-ball FBGA - same | 324-ball FBGA - same | 324-ball FBGA - same | 324-ball FBGA - same |
| Logic Elements | 2210 LEs | 2210 LEs | 2210 LEs | 2210 LEs | 2210 LEs | 1270 LEs |
| User Flash | 172 Kbits | 172 Kbits | 172 Kbits | 172 Kbits | 172 Kbits | 8 Kbits |
| Operating Temperature | -40 C to +100 C (Industrial) | -40 C to +100 C | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | Automotive grade | -40 C to +100 C |
| User I/O (max) | 272 | 272 | 272 | 272 | 272 | 272 |
| VCCINT | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| VCCIO Options | 1.2 / 1.5 / 1.8 / 2.5 / 3.3 V | Same multi-voltage | Same multi-voltage | Same multi-voltage | Same multi-voltage | Same multi-voltage |
| Qty-1 Price (USD, 2026-09-06) | 8.71 | Similar | Slightly lower | Slightly higher | Higher (automotive) | Lower (smaller die) |
Bảo phân biệt quan trọng
- Highest logic density in the MAX V 324-ball FBGA family (vs5M1270ZF324I5N)
- Industrial temperature grade for harsh environments (vs5M2210ZF324C4N)
- Multi-voltage I/O in a single device (vs5M160ZE64I5N (MAX V E64-package lower-density cousin))
Ghi chú thiết kế
The 5M2210ZF324I5N requires a clean 1.8 V VCCINT rail (1.71 V to 1.89 V) and one or more VCCIO rails (1.2 V to 3.3 V). Place a 0.1 uF X7R ceramic capacitor within 3 mm of each VCCINT pin pair, and a single 10 uF bulk capacitor per VCCIO bank. Use a ferrite bead on the VCCINT feed if the upstream LDO is shared with a noisy switching converter. Power-up sequence is not strictly required (the device is hot-socketing tolerant), but a monotonic 1.8 V ramp avoids I/O tri-state glitches during initialization.
The 324-ball FBGA has a 1.0 mm ball pitch, which requires laser-drilled micro-vias and a 4-layer or 6-layer stack-up for reliable assembly. Escape-route all VCCINT and GND balls to inner ground/power planes with short stubs (less than 0.5 mm). Keep JTAG TDI/TDO/TMS/TCK traces short (under 50 mm) and length-matched to within 5 mm. Use 0.8 mm or 1.0 mm BGA escape vias and follow Intel/Altera's reference layout in the MAX V handbook for fan-out details.
Estimated: at typical commercial use with 50% I/O toggling at 50 MHz, the 5M2210ZF324I5N dissipates roughly 0.3 W to 0.6 W. The 324-ball FBGA has a theta-JA of approximately 25 C/W on a JEDEC 4-layer test board, giving a junction-to-ambient rise of 8 C to 15 C. At the +100 C industrial junction limit, this keeps the design within safe thermal envelopes. For higher I/O toggle rates or extended industrial enclosures, use thermal vias under the package center balls to a dedicated ground plane.
Do not leave unused I/O pins floating - configure them as LVCMOS inputs with internal weak pull-up enabled, or drive them to a defined state in the Quartus pin planner, to avoid in-rush current at power-up. Do not apply VCCIO before VCCINT - while hot-socketing is supported, simultaneous power-up with VCCIO ahead of VCCINT by more than 100 ms can trigger I/O latch-up. Finally, when migrating from MAX II designs, note that MAX V has a different User Flash programming algorithm; recompile the POF file in Quartus Prime.
Thông tin tuân thủ
RoHS and REACH compliance per Intel/Altera material declaration as of 2026-09-06. Not AEC-Q100 qualified; for automotive-grade screening use 5M2210ZF324A5N variant. Conflict-minerals statement available from Intel supplier portal.
