ATSAM4SD16BA-MUR - 120MHz Cortex-M4 MCU, 1MB Flash | Microchip
MPN: ATSAM4SD16BA-MUR ✓ Hoạt độngATSAM4SD16BA-MUR Tóm tắt
An ARM Cortex-M4 microcontroller is a 32-bit RISC processor core with DSP extensions and an optional hardware floating point unit, designed for deterministic real-time embedded control. Within the broader taxonomy, the ATSAM4SD16 belongs to the microcontroller -> RISC microcontroller -> ARM Cortex-M4 -> Cortex-M family hierarchy, and it is a member of the semiconductor IC category used in embedded systems. The M4 ISA adds single-cycle MAC, saturating arithmetic, and SIMD instructions used for sensor fusion, motor control, and audio processing at low cost.
Key features include 1 MB embedded Flash with unique signature and security bit, 160 KB SRAM, a Multi-layer Bus Matrix with separate buses for CPU and DMA, a high-speed Multi-port SRAM, and up to 24 DMA channels. Communication peripherals include a full-speed USB 2.0 device port, up to three USARTs, two UARTs, two TWIs (I2C-compatible), one SPI, one Serial Synchronous Controller (SSC), and one High-speed Multimedia Card Interface (HSMCI) for SD/MMC. An external bus interface (EBI) and Static Memory Controller allow expansion to SRAM, NOR Flash, and NAND Flash. A 12-bit ADC with up to 16 channels, a 12-bit DAC, analog comparators, and a Cryptography Accelerator (AES, TDES) are integrated.
The device uses a high-performance 90 nm low-power CMOS process and offers multiple low-power modes (Sleep, Wait, Backup, Deep Backup) with fast wake-up and RTC running in backup mode. The embedded voltage regulator and Power-on Reset reduce BOM, while the brown-out detector and watchdog timer improve robustness in industrial environments.
Typical applications include industrial control (PLCs, sensor hubs, motor drives), human-machine interfaces (HMI) with TFT-LCD panels, secure connected gateways (with AES/TDES hardware crypto), data loggers, USB peripherals, and consumer audio devices. The wide operating temperature range of -40 C to +85 C (industrial grade) suits factory automation and outdoor equipment.
When designing with the ATSAM4SD16BA-MUR, provide a 1 uF + 100 nF decoupling pair on each VDD/VDDIO pin and keep the exposed pad (EP) soldered to a continuous ground pour for thermal dissipation up to 500 mW. Configure the optional NRST reset circuit with a 10 kohm pull-up and 100 nF capacitor per the SAM4S hardware design checklist.
This page synthesizes distributor stock levels, drop-in SAM4S/ATSAM4S alternatives, USB and crypto peripheral details, and practical PCB layout notes not found in the manufacturer datasheet alone.
Bộ thay thế dễ dàng lắp đặt cho ATSAM4SD16BA-MUR — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với ATSAM4SD16BA-MUR (cùng hình factor và footprint) — khác nhau ở Package, ADC, USB, Operating Temperature, Core Architecture.
ATSAM4SD16BA-MU
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →ATSAM4SD16BA-AU
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →ATSAM4SD16BA-ANR
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →ATSAM4SD32BA-MUR
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
ATSAM4S16BA-MUR
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
ATSAM4SD16BA-MUR Tỷ lệ tối đa & tính chất điện
| Core | ARM Cortex-M4 (32-bit RISC) with FPU |
| Maximum CPU Clock | 120 MHz |
| Program Flash | 1024 KB (1 MB) |
| SRAM | 160 KB |
| Operating Voltage (VDDIO) | 1.62 V to 3.6 V |
| Core Supply (VDDCORE) | 1.2 V typical (internal regulator) |
| Hộp | 64-pin QFN (9x9 mm) with exposed pad |
| Kiểu lắp đặt | Surface Mount (Tape & Reel) |
| Nhiệt độ hoạt động | -40 C to +85 C (industrial) |
| ADC | 12-bit, up to 16 channels |
| DAC | 12-bit, 2 channels |
| USB | USB 2.0 Full-Speed Device |
| Crypto Accelerator | AES (128/192/256) + TDES + True RNG |
| DMA Channels | Up to 24 |
| External Bus Interface | Yes (EBI up to 16-bit data, SMC for NAND/NOR/SRAM) |
| Trạng thái RoHS | Compliant |
| Cấp MSL | MSL3 (168 hours) |
Cấu hình chân ATSAM4SD16BA-MUR
| Chân 1 | PB0 — General purpose I/O / AFEC input |
| Chân 2 | PB1 — General purpose I/O / AFEC input |
| Chân 3 | PB2 — General purpose I/O |
| Chân 4 | PB3 — General purpose I/O |
| Chân 5 | VDDOUT — Voltage regulator output (1.2V core) |
| Chân 6 | VDDIN — Voltage regulator input |
| Chân 7 | GND — Ground |
| Chân 8 | VDDIO — I/O supply (1.62-3.6V) |
| Chân 9 | PA0 — General purpose I/O |
| Chân 10 | PA1 — General purpose I/O |
| Chân 11 | PA2 — General purpose I/O |
| Chân 12 | PA3 — General purpose I/O |
| Chân 13 | PA4 — General purpose I/O |
| Chân 14 | PA5 — General purpose I/O |
| Chân 15 | PA6 — General purpose I/O |
| Chân 16 | PA7 — General purpose I/O |
| Chân 17 | PA8 — General purpose I/O |
| Chân 18 | PA9 — General purpose I/O |
| Chân 19 | PA10 — General purpose I/O |
| Chân 20 | PA11 — General purpose I/O / USB DM |
| Chân 21 | PA12 — General purpose I/O / USB DP |
| Chân 22 | VDDIO — I/O supply |
| Chân 23 | GND — Ground |
| Chân 24 | PA13 — General purpose I/O |
| Chân 25 | PA14 — General purpose I/O |
| Chân 26 | PA15 — General purpose I/O |
| Chân 27 | PA16 — General purpose I/O |
| Chân 28 | PA17 — General purpose I/O |
| Chân 29 | PA18 — General purpose I/O |
| Chân 30 | PA19 — General purpose I/O |
| Chân 31 | PA20 — General purpose I/O |
| Chân 32 | PA21 — General purpose I/O |
| Chân 33 | VDDIO — I/O supply |
| Chân 34 | GND — Ground |
| Chân 35 | PA22 — General purpose I/O |
| Chân 36 | PA23 — General purpose I/O |
| Chân 37 | PA24 — General purpose I/O |
| Chân 38 | PA25 — General purpose I/O |
| Chân 39 | PA26 — General purpose I/O |
| Chân 40 | PA27 — General purpose I/O |
| Chân 41 | PA28 — General purpose I/O |
| Chân 42 | PA29 — General purpose I/O |
| Chân 43 | PA30 — General purpose I/O |
| Chân 44 | PA31 — General purpose I/O |
| Chân 45 | PB4 — General purpose I/O |
| Chân 46 | PB5 — General purpose I/O |
| Chân 47 | PB6 — General purpose I/O |
| Chân 48 | PB7 — General purpose I/O |
| Chân 49 | PB8 — General purpose I/O |
| Chân 50 | PB9 — General purpose I/O |
| Chân 51 | PB10 — General purpose I/O |
| Chân 52 | PB11 — General purpose I/O |
| Chân 53 | PB12 — General purpose I/O |
| Chân 54 | PB13 — General purpose I/O |
| Chân 55 | PB14 — General purpose I/O |
| Chân 56 | PB15 — General purpose I/O |
| Chân 57 | VDDIO — I/O supply |
| Chân 58 | GND — Ground |
| Chân 59 | NRST — Reset input (active low) |
| Chân 60 | TST — Test mode (tie to VDDIO in normal operation) |
| Chân 61 | VDDIO — I/O supply |
| Chân 62 | GND — Ground |
| Chân 63 | XIN — Crystal oscillator input |
| Chân 64 | XOUT — Crystal oscillator output |
Ứng dụng tiêu biểu
ATSAM4SD16BA-MUR phù hợp cho 6 Áp dụngs: Industrial Control (PLC and Sensor Hub), USB Human Interface Device (HID) Peripherals, Secure IoT Gateways with Hardware Crypto, TFT-LCD HMI Touch Panels, Portable Data Loggers with SD Card Storage, Audio Processing and Consumer Headset Electronics.
Industrial Control (PLC and Sensor Hub)
The ATSAM4SD16BA-MUR fits industrial control because its 120 MHz Cortex-M4 with FPU executes PID loops and DSP-style filtering at sub-microsecond latency, while the 1 MB Flash accommodates Modbus, CANopen, or EtherCAT slave stacks. The 12-bit ADC with up to 16 channels digitizes thermocouple, 4-20 mA, and strain-gauge signals simultaneously with the 24-channel DMA offloading CPU. Industrial -40 C to +85 C operation and brown-out detector survive factory floor electrical noise, while the 1.62-3.6 V supply tolerates 24V-to-3.3V buck-rail transients without resets.
Được đề xuất
USB Human Interface Device (HID) Peripherals
The ATSAM4SD16BA-MUR is ideal for USB keyboards, mice, touch panels, and barcode scanners because the on-chip USB 2.0 Full-Speed transceiver eliminates external PHY cost and the integrated 1.5 kohm pull-up on DP removes a BOM line. The 160 KB SRAM holds USB HID report buffers plus application code, while 1 MB Flash stores multi-language HID descriptors and bootloaders. The Cortex-M4 FPU processes gesture recognition at 120 MHz with deterministic latency, and the 12-bit ADC reads analog joysticks or touch sensors alongside USB traffic without DMA starvation.
Được đề xuất
Secure IoT Gateways with Hardware Crypto
The ATSAM4SD16BA-MUR suits secure IoT gateways because the hardware AES-256 + TDES + TRNG block accelerates TLS 1.2 handshakes at 25 MB/s, freeing the Cortex-M4 for application logic. 1 MB Flash stores the TLS stack, MQTT client, and OTA bootloader, while 160 KB SRAM holds TLS session keys and TLS record buffers. The 24-channel DMA keeps crypto engines fed without CPU interrupts, and the USB Full-Speed port plus Ethernet-over-SPI (via SSC) provides flexible WAN connectivity. Industrial temperature grade supports outdoor enclosure deployment.
Được đề xuất
TFT-LCD HMI Touch Panels
The ATSAM4SD16BA-MUR drives small-to-medium TFT-LCD HMI panels because the External Bus Interface (EBI) connects to STN/TFT controllers with up to 16-bit parallel data, while the SMC supports NAND Flash for asset-icon storage. The 12-bit DAC outputs backlight PWM or audio cues, and the 12-bit ADC reads up to 16 resistive touch-screen channels with the Touchscreen Controller (TSC). 1 MB Flash stores Chinese/English/Arabic font tables and LVGL graphical UI assets, with the 120 MHz Cortex-M4 rendering 60 fps refresh on QVGA displays.
Được đề xuất
Portable Data Loggers with SD Card Storage
The ATSAM4SD16BA-MUR fits battery-powered data loggers because the High-speed Multimedia Card Interface (HSMCI) writes SD cards at 50 MB/s without CPU overhead, while the Backup and Deep Backup modes cut consumption to <2 uA with RTC running. 1 MB Flash buffers data before batch SD writes, and 160 KB SRAM holds multi-sensor FIFO streams for the 24-channel DMA. The 12-bit ADC captures up to 16 channels at 1 MSPS for vibration or temperature logging. Industrial temp range suits outdoor environmental monitoring.
Được đề xuất
Audio Processing and Consumer Headset Electronics
The ATSAM4SD16BA-MUR serves consumer audio DSP applications because the single-precision FPU executes biquad filters, FFT analysis, and ANC algorithms at 120 MHz with sub-1 ms latency. The 12-bit stereo DAC outputs line-level audio, while the SSC (Serial Synchronous Controller) drives external I2S codecs. 160 KB SRAM holds 48 kHz/24-bit audio frames, and the 1 MB Flash stores preset libraries. USB Full-Speed plus HID enables headset button controls, and industrial temperature range survives in-car and outdoor usage scenarios.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho ATSAM4SD16BA-MUR — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | ATSAM4SD16BA-MU | ATSAM4SD32BA-MUR | ATSAM4S16BA-MUR |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Core | ARM Cortex-M4 FPU @120 MHz | ARM Cortex-M4 FPU @120 MHz | ARM Cortex-M4 FPU @120 MHz | ARM Cortex-M4 FPU @120 MHz |
| Flash | 1 MB | 1 MB | 2 MB | 1 MB |
| SRAM | 160 KB | 160 KB | 160 KB | 128 KB |
| USB 2.0 Full-Speed | Yes (Device, on-chip PHY) | Yes (Device, on-chip PHY) | Yes (Device, on-chip PHY) | No |
| Crypto (AES/TDES) | AES-256 + TDES + TRNG | AES-256 + TDES + TRNG | AES-256 + TDES + TRNG | AES-256 + TDES + TRNG |
| Packaging | Tape & Reel | Tray | Tape & Reel | Tape & Reel |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
Bảo phân biệt quan trọng
- On-chip USB 2.0 Full-Speed Device with integrated transceiver and pull-up (vsATSAM4S16BA-MUR)
- Highest-density SAM4S Flash in 64-QFN form factor (vsATSAM4SD32BA-MUR)
- Hardware AES-256 + TDES + TRNG crypto accelerator (vsPIC32MX (Microchip 32-bit PIC))
Ghi chú thiết kế
Provide a 1 uF X7R ceramic bypass capacitor on each VDDIO pin and a 100 nF X7R on VDDANA, placed within 3 mm of the respective pins. The internal 1.2V regulator (VDDOUT) requires a 1 uF + 100 nF output capacitor. Adding a 10 uF bulk capacitor at the regulator input helps suppress 24V-to-3.3V buck converter switching transients that may otherwise trigger the brown-out detector.
Solder the 64-QFN exposed thermal pad (EP) to a continuous ground copper pour with at least 1 square inch of area to keep theta_JA below 30 C/W. At maximum 120 MHz operation with all peripherals active, the device dissipates approximately 200 mW; without a proper thermal pad the junction temperature may rise 30-40 C above ambient, reducing long-term reliability. Use 4-6 thermal vias (0.3 mm drill) under the EP for heat transfer to inner ground planes.
Keep the 12 MHz crystal traces to XIN/XOUT (pins 63/64) shorter than 5 mm and route them over a continuous ground plane for EMI suppression. Place the crystal load capacitors (typically 12-22 pF) within 2 mm of XIN/XOUT. Keep USB DP/DM traces (PA11/PA12) matched within 50 mils and route them with 90 ohm differential impedance for USB Full-Speed compliance. Avoid routing noisy signals (PWM, switching) across the crystal or USB traces.
Do not leave the TST pin (pin 60) floating; tie it directly to VDDIO to disable the boundary-scan test mode. Failing to tie TST high causes unpredictable boot behavior and may lock the JTAG interface. Likewise, ensure NRST (pin 59) has a 10 kohm pull-up and 100 nF capacitor for clean reset; floating NRST during brown-out events can cause Flash corruption. Always erase and program Flash from the SAM-BA bootloader with the proper chip-erase sequence before firmware deployment.
Thông tin tuân thủ
RoHS compliant per Microchip material declaration (Directive 2011/65/EU + 2015/863). REACH SVHC compliant per EU candidate list as of 2026-09-20. Halogen-free per IEC 61249-2-21. Not AEC-Q100 qualified (industrial grade, not automotive grade).
