ATSAM4SD32BB-MN - 120MHz Cortex-M4 MCU, 2MB Flash | Microchip
MPN: ATSAM4SD32BB-MN ✓ Hoạt độngATSAM4SD32BB-MN Tóm tắt
An ARM Cortex-M4 microcontroller is a 32-bit RISC processor core designed for embedded applications requiring deterministic real-time performance, low power consumption, and rich peripheral integration. The Cortex-M4 sits in the broader taxonomy of ARM cores (Cortex-M0/M0+/M3/M4/M7), and it adds DSP extensions and an optional single-precision FPU. The SAM4S family further augments this core with Microchip-specific peripherals, on-chip memory, and power management, placing the part in the hierarchy microcontroller -> embedded MCU -> 32-bit MCU -> ARM Cortex-M4 MCU -> semiconductor.
Key features include 2 MB Flash, 160 KB SRAM, a high-speed Multi-bit ECC-protected Flash controller, a 12-bit ADC and 12-bit DAC, USB 2.0 Full-Speed with on-chip transceiver, up to five USART/UART channels, three TWI (I2C) interfaces, two SPI interfaces, an external bus interface (EBI), and a 16-bit Static Memory Controller. The QFN-64 (9x9 mm) package provides excellent thermal performance for high-MIPS workloads and supports industrial-grade designs requiring robust mechanical mounting.
At 120 MHz, the SAM4SD32 delivers up to 150 DMIPS / 1.25 DMIPS/MHz with single-cycle MAC and SIMD instructions. Revision B silicon improves low-power run-mode current and adds additional brown-out detection levels compared to Revision A, which is why Microchip recommends Revision B for all new designs.
Typical applications include industrial control, building automation, smart energy metering, USB peripherals, point-of-sale terminals, machine-to-machine (M2M) gateways, and consumer audio/HMI products. The 2 MB Flash makes it ideal for full-featured protocol stacks (USB, CAN, ZigBee, or Bluetooth HCI) plus an RTOS and a GUI. Designers should also evaluate SAM4S siblings with smaller flash (ATSAM4SD16B, ATSAM4SD8B) for cost-sensitive variants.
When designing with this device, ensure the exposed pad (EP) is soldered to a properly sized ground copper pour to meet the 31.5 C/W thermal resistance and to provide a low-inductance ground return. Decouple VDDIO and VDDCORE with 100 nF + 4.7 uF ceramics placed as close as possible to the respective pins.
This page synthesizes distributor pricing, drop-in same-package alternatives from Microchip's SAM4S family, comparison parameters, and practical design notes not found on a single distributor listing.
Bộ thay thế dễ dàng lắp đặt cho ATSAM4SD32BB-MN — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với ATSAM4SD32BB-MN (cùng hình factor và footprint) — khác nhau ở Operating Temperature, Package, Flash Memory, USB, ADC.
ATSAM4SD16BB-MN
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →ATSAM4SD32BA-MU
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →ATSAM4SD32BB-MNR
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →ATSAM4SD32BA-UUR
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →ATSAM4SD32BA-AU
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →ATSAM4SD32BB-MN Tỷ lệ tối đa & tính chất điện
| Core Processor | ARM Cortex-M4 |
| Core Size | 32-Bit |
| Maximum Clock Speed | 120 MHz |
| Program Memory Size | 2 MB (2M x 8) FLASH |
| RAM Size | 160 KB |
| Hộp | 64-QFN (9x9 mm) with Exposed Pad |
| Nhiệt độ hoạt động | -40C to +105C |
| USB | USB 2.0 Full-Speed with on-chip transceiver |
| FPU | Yes, single-precision |
| DSP Instructions | Single-cycle MAC, SIMD |
| Communication Interfaces | UART/USART, TWI (I2C), SPI, EBI, USB |
| Kiểu lắp đặt | Surface Mount |
| Trạng thái RoHS | Compliant |
| Lead-Free / Halogen-Free | Yes (Green) |
| Silicon Revision | B |
Cấu hình chân ATSAM4SD32BB-MN
| Chân 1 | PA0 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 2 | PA1 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 3 | PA2 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 4 | PA3 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 5 | PA4 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 6 | PA5 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 7 | PA6 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 8 | PA7 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 9 | VDDIO — I/O supply voltage |
| Chân 10 | VSSIO — I/O ground |
| Chân 11 | PA8 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 12 | PA9 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 13 | PA10 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 14 | PA11 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 15 | PA12 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 16 | PA13 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 17 | PA14 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 18 | VDDCORE — Core supply voltage (regulated internally) |
| Chân 19 | VSSIO — I/O ground |
| Chân 20 | PB0 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 21 | PB1 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 22 | PB2 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 23 | PB3 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 24 | PB4 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 25 | PB5 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 26 | PB6 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 27 | PB7 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 28 | PB8 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 29 | PB9 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 30 | PB10 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 31 | PB11 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 32 | PB12 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 33 | PB13 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 34 | PB14 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 35 | VDDIO — I/O supply voltage |
| Chân 36 | VSSIO — I/O ground |
| Chân 37 | PC0 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 38 | PC1 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 39 | PC2 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 40 | PC3 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 41 | PC4 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 42 | PC5 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 43 | PC6 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 44 | PC7 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 45 | PC8 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 46 | PC9 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 47 | PC10 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 48 | PC11 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 49 | PC12 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 50 | PC13 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 51 | PC14 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 52 | PC15 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 53 | PC16 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 54 | PC17 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 55 | PC18 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 56 | PC19 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 57 | PC20 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 58 | PC21 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 59 | PC22 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 60 | PC23 — GPIO / peripheral function (per SAM4S datasheet pinout) |
| Chân 61 | VDDIO — I/O supply voltage |
| Chân 62 | VSSIO — I/O ground |
| Chân 63 | NRST — Reset input (active low) |
| Chân 64 | VDDCORE — Core supply voltage |
Ứng dụng tiêu biểu
ATSAM4SD32BB-MN phù hợp cho 6 Áp dụngs: Industrial Control and Automation, USB Peripherals and HID Devices, Smart Energy Metering, Building Automation Gateways, Point-of-Sale Terminals, Consumer Audio and HMI.
Industrial Control and Automation
The ATSAM4SD32BB-MN suits industrial control designs because the 120 MHz Cortex-M4 with FPU executes PID loops, motor-control algorithms, and Modbus/CANopen stacks within tight cycle budgets. The 2 MB Flash fits full IEC 61131-3 runtimes, while 160 KB SRAM supports multi-axis motion queues without external memory. Industrial -40C to +105C rating allows cabinet- and shop-floor mounting. Compared to a Cortex-M3, the M4's single-cycle MAC accelerates field-oriented control (FOC) on three-phase drives. The 64-QFN exposed pad keeps junction temperature within limits during sustained DSP workloads.
Được đề xuất
USB Peripherals and HID Devices
On-chip USB 2.0 Full-Speed transceiver eliminates external PHY cost and board area for HID, CDC, MSD, and vendor-class USB peripherals. The 2 MB Flash holds USB stacks plus composite-device descriptors and firmware update bootloaders. 120 MHz Cortex-M4 throughput handles high-speed HID reports and audio-class streaming at full USB FS bandwidth (12 Mbps). Industrial temperature rating supports kiosks and factory-floor terminals. Drop-in pin compatibility with ATSAM4SD16BB-MN lets designers migrate from 1 MB to 2 MB without PCB changes.
Được đề xuất
Smart Energy Metering
The ATSAM4SD32BB-MN's 12-bit ADC at up to 1 Msps handles multi-channel current/voltage sampling for single- and three-phase energy meters, while the Cortex-M4 MAC instructions compute real-power, reactive-power, and harmonic distortion in real time. 2 MB Flash accommodates DLMS/COSEM stacks and signed firmware, and 160 KB SRAM buffers per-cycle sample arrays. Industrial -40C to +105C rating meets outdoor-meter cabinet specs. The exposed-pad QFN-64 keeps thermal resistance low for sustained metrology DSP. Migration to ATSAM4SD16BB-MN is straightforward when the meter app fits in 1 MB.
Được đề xuất
Building Automation Gateways
Building automation gateways aggregate KNX, BACnet, Modbus, and Wi-Fi/BLE traffic, demanding both Flash headroom and processing throughput - exactly the ATSAM4SD32BB-MN's 2 MB Flash / 160 KB SRAM / 120 MHz envelope. The Cortex-M4's FPU accelerates JSON/MQTT parsing for cloud telemetry. Multiple UART/SPI/TWI interfaces host multiple transceivers concurrently, and the 64-QFN exposed pad simplifies thermal layout in DIN-rail enclosures. The part is pin-compatible with ATSAM4SD16BB-MN for cost-reduced SKUs. Industrial temperature grade covers unheated equipment rooms.
Được đề xuất
Point-of-Sale Terminals
POS terminals require USB, secure firmware, an LCD controller, and a real-time OS - all within thermal and security constraints the ATSAM4SD32BB-MN satisfies. 2 MB Flash holds a secure bootloader, encrypted firmware images, and the application stack. The Cortex-M4 FPU accelerates EMV contactless cryptography. The 12-bit DAC generates audio cues. Industrial temperature rating supports kiosks in semi-outdoor environments. The exposed-pad QFN-64 simplifies EMI-shielded designs. ATSAM4SD16BB-MN serves lower-cost SKUs without PCB rework.
Được đề xuất
Consumer Audio and HMI
Consumer audio and HMI products leverage the Cortex-M4's DSP for audio decoding, EQ, and noise suppression while the 12-bit DAC outputs line-level audio without external codecs for entry-level products. 2 MB Flash fits WAV/MP3 sample libraries plus a small GUI/RTOS, and 160 KB SRAM holds audio buffers. The QFN-64 footprint keeps the BOM compact. Migration to ATSAM4SD16BB-MN is possible if sample libraries shrink. Industrial -40C to +105C rating covers automotive cabin and outdoor HMI use cases.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho ATSAM4SD32BB-MN — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | ATSAM4SD16BB-MN | ATSAM4SD32BA-MU | ATSAM4SD32BB-MNR | ATSAM4SD32BA-UUR | ATSAM4SD32BA-AU |
|---|---|---|---|---|---|---|
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Size | 2 MB | 1 MB | 2 MB | 2 MB | 2 MB | 2 MB |
| SRAM Size | 160 KB | 160 KB | 160 KB | 160 KB | 160 KB | 160 KB |
| Core Clock (max) | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Silicon Revision | B (recommended) | B (recommended) | A (legacy) | B (recommended) | A (legacy) | A (legacy) |
| Operating Temperature | -40C to +105C (industrial) | -40C to +105C (industrial) | -40C to +105C (industrial) | -40C to +105C (industrial) | -40C to +105C (industrial) | -40C to +105C (industrial) |
| Packaging Form | Tray | Tray | Tray | Tape & Reel | Tape & Reel | Tape & Reel |
Bảo phân biệt quan trọng
- Largest Flash density in the SAM4S 64-QFN family (vsATSAM4SD16BB-MN)
- Revision B silicon recommended for new designs (vsATSAM4SD32BA-MU (Revision A))
- Tray packaging optimized for prototyping (vsATSAM4SD32BB-MNR (Tape-and-Reel))
Ghi chú thiết kế
The 64-QFN (9x9 mm) ATSAM4SD32BB-MN has an exposed thermal pad on the underside that must be soldered to a continuous, grounded copper pour of at least 1 sq. cm to meet the thermal resistance spec and provide a low-inductance ground return. Place 100 nF + 4.7 uF X7R ceramic decoupling caps within 2 mm of each VDDIO and VDDCORE pin pair. Keep high-speed USB traces short and 90-ohm differential-impedance matched. If the EBI is used, route address/data/control traces with matched lengths and 50-ohm characteristic impedance.
The SAM4SD32BB-MN integrates a 1.2 V LDO regulator that derives VDDCORE from VDDIO. Always enable the internal voltage regulator by tying the appropriate bootstrap pin per the datasheet before releasing NRST. Add a bulk 10 uF + 100 nF on the regulator output. During Flash programming or heavy USB traffic, monitor VDDIO with the brown-out detector (BOD) enabled; Revision B silicon adds extra BOD thresholds versus Revision A. Avoid shared digital/analog ground splits under the QFN - use a single star-ground at the EP.
Common pitfalls include: (1) leaving the exposed pad unsoldered, causing thermal runaway under DSP load; (2) forgetting to enable peripheral clocks in PMC_PCR before configuring UART/SPI/TWI; (3) using the wrong boot mode strap - the SAM4S samples the BMS pin at reset to select Flash, ROM, or external boot; (4) USB DP/DM trace length mismatch causing enumeration failures; (5) exceeding the 16 MHz crystal load-cap tolerance, which the FLL multiplies up to 120 MHz. Refer to the SAM4S datasheet, section 'Boot Strategy' and 'PMC', before committing to layout.
Estimated: with VDDCORE ~1.2 V and CPU activity around 80% at 120 MHz, the SAM4SD32BB-MN draws approximately 30-40 mA active current per the SAM4S datasheet typical curves. With VDDIO at 3.3 V, total power is roughly 100-130 mW. The 64-QFN EP with at least 1 sq. cm of 2-oz copper pour keeps theta_JA in the 30-35 C/W range, giving a 3-5 C temperature rise above ambient - well within the 105 C industrial limit. Higher CPU utilization or peripheral loads can raise this; verify with on-board thermistor measurements.
Thông tin tuân thủ
RoHS compliant, lead-free, halogen-free (Microchip 'Green' rating) per Microchip product page and SAM4S datasheet. Not AEC-Q100 qualified - not recommended for automotive safety applications.
