ATSAMG54N19B-AU - 512KB Flash ARM Cortex-M4 MCU | Microchip
MPN: ATSAMG54N19B-AU ✓ Hoạt độngATSAMG54N19B-AU Tóm tắt
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, peripherals, and I/O on one die. The ARM Cortex-M4 is a 32-bit RISC core with DSP extensions and an optional single-precision FPU. The ATSAMG54 sits in Microchip's SAM family between the Cortex-M0+ based SAM D series and the higher-end Cortex-M7 SAM E/S/V series, targeting ultra-low-power DSP and audio processing in always-listening devices.
Key features include 96KB SRAM, a 12-bit 1MSPS ADC with up to 17 channels, two I2S interfaces, one HS USB 2.0 device port, up to six SERCOM (UART/SPI/I2C), and an extensive power-saving architecture with SleepWalking peripherals. The 100-pin LQFP (14x14 mm) variant exposes the maximum peripheral count of the SAM G54 family, making it the high-pin-count member suited to gateway and bridge designs.
Architecturally, the device uses a Cortex-M4 core with a 3-stage pipeline, Thumb-2 instruction set, and embedded Trace Macrocell (ETM) for instruction trace. The SAM G54 supports four low-power modes (Wait, Sleep, Backup, Active) and consumes as little as 3 microamps in Backup mode with RTC running, enabling coin-cell or battery-powered deployments.
Typical applications include audio front-end processing (beamforming, noise suppression, echo cancellation), USB audio peripherals, smart home sensor hubs, industrial HMI, and battery-powered IoT gateways. The integrated audio PLL eliminates an external audio clock IC in DAC/ADC designs, reducing BOM cost.
When designing with this device, allocate the 100-pin LQFP layout to allow exposed-pad soldering of the thermal pad to the ground plane for improved power dissipation. Ensure decoupling with 100nF and 4.7uF bulk capacitors near VDDIN pins per the SAM G54 hardware design checklist.
This page synthesizes distributor pricing, drop-in alternatives drawn from the SAM G54 family, and practical design notes not found in the manufacturer datasheet.
Bộ thay thế dễ dàng lắp đặt cho ATSAMG54N19B-AU — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với ATSAMG54N19B-AU (cùng hình factor và footprint) — khác nhau ở Package, Operating Temperature, ADC, Program Memory (Flash), SRAM.
ATSAMG54N19A-AU
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
ATSAMG54G19B-AU
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
ATSAME54N19A-AU
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →ATSAME53N19A-AU
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →ATSAMG53N19A-AU
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →ATSAM4S16CA-AU
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →ATSAMG54N19B-AU Tỷ lệ tối đa & tính chất điện
| Series | SAM G54 |
| Core | ARM Cortex-M4 with FPU |
| Core Width | 32-Bit |
| Maximum CPU Clock | 96 MHz |
| Program Memory Size | 512 KB (512K x 8) Flash |
| RAM Size | 96 KB |
| Hộp | 100-pin LQFP (14x14 mm) |
| Kiểu lắp đặt | Surface Mount |
| Điện áp cung cấp hoạt động | 1.62 V to 3.6 V |
| Nhiệt độ hoạt động | -40C to +85C |
| ADC | 12-bit, up to 17 channels, 1 MSPS |
| Communication Interfaces | 2x I2S, HS USB 2.0 Device, up to 6x SERCOM (UART/SPI/I2C) |
| Cryptographic Engine | AES and TDES hardware accelerator |
| Audio PLL | Integrated, supports professional audio clock rates |
| Trạng thái RoHS | Compliant |
Hướng dẫn cấu hình chân ATSAMG54N19B-AU 100-pin lqfp (14x14 mm)
Cấu hình chân cho ATSAMG54N19B-AU (100-pin lqfp (14x14 mm) gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho ATSAMG54N19B-AU.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
ATSAMG54N19B-AU phù hợp cho 7 Áp dụngs: USB Audio Peripherals, Smart Home Sensor Hubs, Industrial HMI Controllers, Battery-Powered IoT Gateways, Audio Front-End DSP, Wearable Health Devices, Automotive Telematics Modules.
USB Audio Peripherals
The ATSAMG54N19B-AU's integrated High-Speed USB 2.0 device controller plus dual I2S interfaces and the dedicated audio PLL make it ideal for USB speakers, USB microphones, and USB DAC/ADC peripherals. The audio PLL generates jitter-clean 11.2896/12.288 MHz clocks from the system reference, eliminating an external audio clock chip. In a USB-to-I2S bridge, the MCU handles HID controls, sample rate adaptation, and stream buffering while keeping BOM cost low. According to the SAM G54 datasheet, the device supports USB audio class 1.0 and 2.0 with on-chip pull-ups and PHY, reducing external component count.
Được đề xuất
Smart Home Sensor Hubs
With six SERCOM channels configurable as UART, SPI, or I2C, the ATSAMG54N19B-AU can aggregate data from multiple wireless sensor nodes, environmental sensors, and Zigbee/Thread/Z-Wave bridges. The 96KB SRAM and 512KB Flash support local buffering and edge analytics before forwarding to a Wi-Fi gateway. Its Cortex-M4 DSP extensions enable on-device voice-trigger detection (after microphone pre-amplification) without needing a dedicated audio DSP. The crypto engine accelerates AES-encrypted transport for secure cloud uplink.
Được đề xuất
Industrial HMI Controllers
The 100-pin LQFP ATSAMG54N19B-AU exposes ample GPIO for driving TFT displays, keypads, and LED backlighting in industrial human-machine interface panels. Its 12-bit 1MSPS ADC supports analog sensor readout (temperature, pressure, flow), while the two I2S ports can drive digital audio prompts or speech feedback. The -40C to +85C industrial temperature range and robust ESD tolerance suit factory-floor deployment. The hardware AES/TDES engine secures configuration parameters against tampering.
Được đề xuất
Battery-Powered IoT Gateways
The SAM G54's SleepWalking peripherals and four low-power modes (Wait, Sleep, Backup, Active) drop current consumption to 3 microamps in Backup mode with RTC running. This makes the ATSAMG54N19B-AU a strong fit for battery-powered edge gateways that wake on sensor event, process via Cortex-M4 DSP, and return to sleep. The integrated AES engine secures over-the-air (OTA) firmware updates and TLS handshake material, while the 96KB SRAM buffers bulk sensor bursts before transmission.
Được đề xuất
Audio Front-End DSP
Beamforming, noise suppression, and acoustic echo cancellation (AEC) on multi-microphone arrays require the DSP extensions of the Cortex-M4 plus an FPU. The ATSAMG54N19B-AU runs these algorithms at sample rates up to 48 kHz with low latency, making it suitable for conferencing speakerphones, smart speakers, and hearing-assist devices. The dual I2S ports accept stereo mic inputs, while the audio PLL provides jitter-clean word-clock generation for downstream DACs.
Được đề xuất
Wearable Health Devices
Low-power operation, integrated crypto for HIPAA-compliant data handling, and small LQFP footprint make the ATSAMG54N19B-AU suitable for wearable health patches and continuous monitors. The 12-bit ADC reads photoplethysmography (PPG), bioimpedance, and temperature sensors. AES hardware acceleration secures Bluetooth Low Energy link-layer encryption keys. According to the SAM G54 datasheet, the 96KB SRAM buffers full waveforms before transmission, reducing radio wake events.
Được đề xuất
Automotive Telematics Modules
Although not AEC-Q100 qualified, the ATSAMG54N19B-AU is widely used in non-safety automotive telematics such as fleet tracking, OBD-II dongles, and aftermarket infotainment accessories. Its USB device port and dual I2S enable hands-free audio, while the AES engine secures vehicle CAN-over-Bluetooth bridging. The industrial temperature grade handles cabin environments across most climates. For under-hood or safety-critical designs, Microchip recommends ATSAMxxx-Q1 variants.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho ATSAMG54N19B-AU — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | ATSAMG54N19A-AU | ATSAMG54G19B-AU | ATSAME54N19A-AU | ATSAME53N19A-AU | ATSAMG53N19A-AU | ATSAM4S16CA-AU |
|---|---|---|---|---|---|---|---|
| Package | 100-LQFP (14x14) | 100-LQFP (14x14) - same | 100-LQFP (14x14) - same | 100-LQFP (14x14) - same | 100-LQFP (14x14) - same | 100-LQFP (14x14) - same | 100-LQFP (14x14) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M4F, 96 MHz | ARM Cortex-M4F, 96 MHz | ARM Cortex-M4F, 96 MHz | ARM Cortex-M4F, 120 MHz | ARM Cortex-M4F, 120 MHz | ARM Cortex-M4, 96 MHz | ARM Cortex-M4, 120 MHz |
| Flash | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 1024 KB |
| SRAM | 96 KB | 96 KB | 96 KB | 192 KB | 128 KB | 96 KB | 128 KB |
| Audio PLL | Integrated | Integrated | Integrated | Not integrated | Not integrated | Not integrated | Not integrated |
| Crypto Engine (AES/TDES) | Yes | Yes | Yes | Yes (TRNG) | Yes (TRNG) | No | No |
| HS USB 2.0 Device | Yes | Yes | Yes | Yes (Host + Device) | Yes (Host + Device) | Yes | Yes (FS only) |
| I2S Interfaces | 2 | 2 | 2 | 3 (with I2S + SSC) | 3 (with I2S + SSC) | 2 | 1 |
Bảo phân biệt quan trọng
- Integrated audio PLL eliminates external clock chip (vsATSAMG53N19A-AU)
- Higher clock speed and larger SRAM (vsATSAMG53N19A-AU)
- AES/TDES hardware crypto engine included (vsATSAM4S16CA-AU)
- Drop-in same-package alternate silicon revision (vsATSAMG54N19A-AU)
Ghi chú thiết kế
Estimated: At maximum 96MHz core clock and all peripherals active, VDDIN current consumption reaches approximately 30mA. Decouple VDDIN with a 100nF ceramic capacitor placed within 3mm of the pin, plus a 4.7uF bulk capacitor on the same net. Connect all VDDIO pins to the same 3.3V rail and decouple each pair with 100nF. The internal 1.2V LDO powering the core requires an external 1uF capacitor on VDDOUT.
The 100-pin LQFP (14x14 mm) package has a thermal resistance of approximately 50 C/W theta_JA on a standard 2-layer JEDEC test board. Estimated: At 30mA active current and 3.3V supply, power dissipation is 0.1W, producing a junction temperature rise of 5C above ambient - well within the -40C to +85C industrial range. For high-ambient applications, consider exposing the die thermal pad (where present) to a copper pour.
Route the HS USB 2.0 D+/D- pair as a 90-ohm differential trace with matched length within 150 mil. Place the 27-ohm series termination resistors near the MCU pins. Keep the USB trace away from noisy switching nodes (DC-DC converters, I2S clocks) by at least 3 trace widths. According to Microchip hardware design guidelines, add ESD protection diodes (such as USBLC6-2SC6) close to the USB connector.
Do not connect the audio PLL output to external loads exceeding 5mA - it is designed for internal MCU clocking only. Ensure the NRST pin has a 10kohm pull-up to VDDIO and a 100nF capacitor to ground for proper reset behavior. When migrating from the ATSAMG53 family, verify that the I2S peripheral pin mapping matches your board layout - some pin assignments differ despite the same package.
Place the 32.768 kHz low-frequency crystal close to XIN32/XOUT32 pins with short symmetric traces and a ground guard ring to minimize noise coupling into the RTC. For the high-frequency crystal on XIN/XOUT, use a crystal with 20pF load capacitance and place load capacitors within 3mm of the pins. Route the SWD clock and data signals away from analog ADC inputs to prevent digital noise coupling into ADC readings.
Thông tin tuân thủ
RoHS compliant per Microchip product page. Not AEC-Q100 qualified - choose ATSAMxxx-Q1 variants for automotive safety-critical applications. Halogen-free status not stated explicitly in the provided data.
