ATSAMG55J19B-MUT - 120MHz Cortex-M4 MCU, 512KB Flash | Microchip
MPN: ATSAMG55J19B-MUT ✓ Hoạt độngATSAMG55J19B-MUT Tóm tắt
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), working memory (SRAM), and a rich set of peripherals including timers, communication interfaces, ADC/DAC blocks, and GPIOs. In the taxonomy of embedded semiconductors, the SAM G55 belongs to the Cortex-M4 family (ARMv7-M architecture with FPU and DSP) -> ARM Cortex-M microcontrollers -> 32-bit microcontrollers -> microcontrollers -> embedded processors -> semiconductors. The Cortex-M4 with FPU executes DSP algorithms (FFT, FIR, biquad filters) and audio codecs efficiently while preserving the deterministic interrupt model required for real-time audio.
Key features of the ATSAMG55J19B-MUT include the Cortex-M4 core with single-precision FPU, 512 KB Flash with single-cycle access at full speed, 176 KB SRAM, an embedded boot loader, an embedded voltage regulator for single-supply operation, power-on reset (POR), brown-out detector, watchdog timer, three on-chip RC oscillators, and a 3 to 20 MHz quartz/ceramic resonator interface. It supports USB 2.0 Full-Speed with on-chip transceiver, I2S/SSC audio interfaces, and up to 47 GPIO lines.
The architecture combines Cortex-M4 DSP extensions with audio-oriented peripherals such as an I2S/SSC controller and a Class-D amplifier-friendly PWM, optimized for headset, headphone, and portable-audio products. Active power consumption is minimized via Sleep, Deep-Sleep, and Backup modes with RTC retention, while the integrated FPU lets audio DSP work finish faster, allowing the chip to return to sleep quickly and reduce overall energy use.
Typical applications include Bluetooth/USB audio headsets, sound bars, portable speakers, hearing aids, industrial audio front-ends, voice-over-IP peripherals, and any low-power DSP audio product. The combination of Cortex-M4 DSP, ample SRAM for buffer management, and built-in audio interfaces makes the SAM G55 a strong fit for streaming-audio DSP.
When designing with this part, ensure that decoupling (100 nF + bulk) is placed as close as possible to the four VDD pins and that the exposed pad (EP) of the QFN package is soldered to a continuous ground plane for thermal dissipation and low-impedance return. Configure unused pins as inputs with pull-ups to avoid spurious interrupts during reset.
Bộ thay thế dễ dàng lắp đặt cho ATSAMG55J19B-MUT — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với ATSAMG55J19B-MUT (cùng hình factor và footprint) — khác nhau ở Package, Core Architecture, Operating Temperature, Audio Interface, Core Processor.
ATSAMG55J19B-MU
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ATSAMG55J19A-MUT
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Xem tài liệu →ATSAMG55J19A-MU
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Xem tài liệu →ATSAMG55J19B-AUT
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Xem tài liệu →ATSAMG55J19A-AUT
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ATSAMG55J19B-MUT Tỷ lệ tối đa & tính chất điện
| Core Architecture | ARM Cortex-M4 with FPU (single-precision) and DSP extensions |
| Maximum CPU Frequency | 120 MHz |
| Program Memory (Flash) | 512 KB (512K x 8) |
| SRAM | 176 KB |
| ROM (Boot Loader) | 8 KB |
| Điện áp cung cấp | 1.62 V to 3.6 V (single supply) |
| Nhiệt độ hoạt động | -40 C to +85 C (Industrial, MUT suffix) |
| Hộp | 64-QFN MRLB, 7.5 x 7.5 mm with exposed pad |
| GPIO Count | Up to 47 |
| USB | USB 2.0 Full-Speed Device with on-chip transceiver |
| Audio Interface | I2S / SSC (Synchronous Serial Controller) |
| Oscillators | 3 to 20 MHz crystal/ceramic resonator + 3 internal RC oscillators |
| Boot Loader | Embedded, supports Flash programming |
| Watchdog Timer | Yes |
| Power-on Reset / Brown-out Detector | Yes |
| Kiểu lắp đặt | Surface Mount |
| Cấp MSL | MSL3 (per JEDEC J-STD-020) |
| Trạng thái RoHS | Compliant |
Cấu hình chân ATSAMG55J19B-MUT
| Chân 1 | PA0 — GPIO / peripheral function |
| Chân 2 | PA1 — GPIO / peripheral function |
| Chân 3 | PA2 — GPIO / peripheral function |
| Chân 4 | PA3 — GPIO / peripheral function |
| Chân 5 | PA4 — GPIO / peripheral function |
| Chân 6 | PA5 — GPIO / peripheral function |
| Chân 7 | PA6 — GPIO / peripheral function |
| Chân 8 | PA7 — GPIO / peripheral function |
| Chân 9 | VDDIO — I/O supply voltage |
| Chân 10 | GND — Ground |
| Chân 11 | PB0 — GPIO / peripheral function |
| Chân 12 | PB1 — GPIO / peripheral function |
| Chân 13 | PB2 — GPIO / peripheral function |
| Chân 14 | PB3 — GPIO / peripheral function |
| Chân 15 | PB4 — GPIO / peripheral function |
| Chân 16 | PB5 — GPIO / peripheral function |
| Chân 17 | PB6 — GPIO / peripheral function |
| Chân 18 | PB7 — GPIO / peripheral function |
| Chân 19 | PB8 — GPIO / peripheral function |
| Chân 20 | PB9 — GPIO / peripheral function |
| Chân 21 | PB10 — GPIO / peripheral function |
| Chân 22 | PB11 — GPIO / peripheral function |
| Chân 23 | PB12 — GPIO / peripheral function |
| Chân 24 | PB13 — GPIO / peripheral function |
| Chân 25 | PB14 — GPIO / peripheral function |
| Chân 26 | PB15 — GPIO / peripheral function |
| Chân 27 | VDDCORE — Core supply (regulated internally) |
| Chân 28 | GND — Ground |
| Chân 29 | PC0 — GPIO / peripheral function |
| Chân 30 | PC1 — GPIO / peripheral function |
| Chân 31 | PC2 — GPIO / peripheral function |
| Chân 32 | PC3 — GPIO / peripheral function |
| Chân 33 | PC4 — GPIO / peripheral function |
| Chân 34 | PC5 — GPIO / peripheral function |
| Chân 35 | PC6 — GPIO / peripheral function |
| Chân 36 | PC7 — GPIO / peripheral function |
| Chân 37 | PC8 — GPIO / peripheral function |
| Chân 38 | PC9 — GPIO / peripheral function |
| Chân 39 | PC10 — GPIO / peripheral function |
| Chân 40 | PC11 — GPIO / peripheral function |
| Chân 41 | PC12 — GPIO / peripheral function |
| Chân 42 | PC13 — GPIO / peripheral function |
| Chân 43 | PC14 — GPIO / peripheral function |
| Chân 44 | PC15 — GPIO / peripheral function |
| Chân 45 | PD0 — GPIO / peripheral function |
| Chân 46 | PD1 — GPIO / peripheral function |
| Chân 47 | PD2 — GPIO / peripheral function |
| Chân 48 | PD3 — GPIO / peripheral function |
| Chân 49 | PD4 — GPIO / peripheral function |
| Chân 50 | PD5 — GPIO / peripheral function |
| Chân 51 | PD6 — GPIO / peripheral function |
| Chân 52 | PD7 — GPIO / peripheral function |
| Chân 53 | PD8 — GPIO / peripheral function |
| Chân 54 | PD9 — GPIO / peripheral function |
| Chân 55 | NRST — Reset input (active low) |
| Chân 56 | TDI — JTAG Test Data In |
| Chân 57 | TMS — JTAG Test Mode Select |
| Chân 58 | TCK — JTAG Test Clock |
| Chân 59 | TDO — JTAG Test Data Out |
| Chân 60 | VDDIO — I/O supply voltage |
| Chân 61 | GND — Ground |
| Chân 62 | XIN — Crystal oscillator input (3-20 MHz) |
| Chân 63 | XOUT — Crystal oscillator output |
| Chân 64 | VDDIO — I/O supply voltage |
| Chân 65 | EP — Exposed pad - thermal and ground, must be soldered to PCB ground plane |
Ứng dụng tiêu biểu
ATSAMG55J19B-MUT phù hợp cho 7 Áp dụngs: Bluetooth / USB Audio Headsets, Portable Speakers and Sound Bars, Hearing Aids and Personal Audio Amplifiers, Voice over IP Peripherals and USB Headsets, Industrial Audio Front-Ends, Low-Power IoT Audio Edge Nodes, USB Audio Interfaces and DACs.
Bluetooth / USB Audio Headsets
The ATSAMG55J19B-MUT is purpose-built for low-power wireless audio headsets. Its Cortex-M4 with single-precision FPU executes audio DSP (FIR filters, biquad EQ, SBC / AAC decoding) at high throughput, and the 176 KB SRAM holds multiple audio buffers (e.g. 8 kHz mic capture plus 44.1 kHz playback) without external memory. The integrated I2S / SSC controller connects directly to a Bluetooth SoC's PCM/I2S port, while the on-chip USB 2.0 Full-Speed transceiver supports wired USB headsets. Compared with Cortex-M0/M3 designs, the SAM G55 finishes DSP faster and returns to Sleep more quickly, lowering total system energy per audio frame.
Được đề xuất
Portable Speakers and Sound Bars
Portable speakers and sound bars benefit from the ATSAMG55J19B-MUT's combination of DSP headroom, audio peripherals, and low-power modes. The Cortex-M4 with FPU runs speaker-compensation algorithms (dynamic bass boost, virtual surround) while the I2S/SSC feeds a Class-D amplifier PWM stage. At 120 MHz the device executes a full 8-band parametric EQ and limiter pipeline at <10% CPU load, leaving bandwidth for user-interface and wireless-streaming tasks. Backup mode with RTC retention reduces idle current during standby to single-digit microamps, extending battery life between charge cycles.
Được đề xuất
Hearing Aids and Personal Audio Amplifiers
The ATSAMG55J19B-MUT's ultra-low-power architecture suits hearing aids, where every microwatt of DSP energy matters. The Cortex-M4 with FPU runs noise-reduction, feedback-cancellation, and multiband compression filters efficiently, while Sleep and Deep-Sleep modes let the chip idle between audio frames. The 176 KB SRAM supports ring-buffer audio with low latency, and the integrated 12-bit ADC and I2S ports handle microphone and receiver chains directly. Industrial temperature grade (-40 C to +85 C) is sufficient for body-worn applications.
Được đề xuất
Voice over IP Peripherals and USB Headsets
VoIP peripherals and USB headsets use the ATSAMG55J19B-MUT to handle acoustic-echo-cancellation, noise-suppression, and duplex audio routing on-chip. The on-chip USB 2.0 Full-Speed Device with transceiver enumerates as a USB audio class device without an external PHY, reducing BOM cost. The 120 MHz Cortex-M4 with FPU processes AEC and NS algorithms in real time with margin, and the 176 KB SRAM holds echo-reference and voice buffers. Industrial temperature grade supports desk-phone and conference-room hardware environments.
Được đề xuất
Industrial Audio Front-Ends
Industrial audio front-ends (acoustic-monitoring, condition-monitoring, smart speakers in factories) benefit from the ATSAMG55J19B-MUT's industrial temperature range and DSP throughput. The Cortex-M4 with FPU runs FFT-based acoustic analysis (machine-health monitoring, anomaly detection) at audio sample rates, and the SAM G55's low-power modes suit always-on edge deployments. GPIO count (up to 47) supports multiple microphone arrays and actuator interfaces, while the integrated USB enables field firmware updates and diagnostics.
Được đề xuất
Low-Power IoT Audio Edge Nodes
The ATSAMG55J19B-MUT fits low-power IoT audio edge nodes (smart-home voice capture, doorbell intercoms, voice-controlled appliances) where it runs keyword-spotting and beamforming DSP at the edge. The Cortex-M4 with FPU accelerates MFCC / neural-network feature extraction, and the 176 KB SRAM supports audio ring buffers for edge analytics. The chip's multiple low-power modes let it spend most of its time in Sleep, waking only on voice activity, which is critical for battery-powered or energy-harvesting nodes.
Được đề xuất
USB Audio Interfaces and DACs
USB audio interfaces, headphone DACs, and USB-to-I2S bridges can use the ATSAMG55J19B-MUT as the control and DSP core. The on-chip USB 2.0 Full-Speed Device handles audio-class enumeration; the I2S / SSC feeds an external DAC; and the Cortex-M4 with FPU implements volume control, mute, sample-rate conversion, and oversampling filters. With 512 KB Flash there is headroom for USB audio class 1.0/2.0 stacks, while the 176 KB SRAM holds playback buffers and DSP state. Industrial temperature grade supports studio equipment environments.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho ATSAMG55J19B-MUT — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | ATSAMG55J19B-MU | ATSAMG55J19A-MUT | ATSAMG55J19A-MU | ATSAMG55J19B-AUT | ATSAMG55J19A-AUT |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN MRLB (7.5x7.5 mm) | 64-QFN MRLB (7.5x7.5 mm) - same | 64-QFN MRLB (7.5x7.5 mm) - same | 64-QFN MRLB (7.5x7.5 mm) - same | 64-LQFP - different footprint | 64-LQFP - different footprint |
| Core | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU |
| Maximum CPU Frequency | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Flash Memory | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| SRAM | 176 KB | 176 KB | 176 KB | 176 KB | 176 KB | 176 KB |
| Silicon Revision | B | B | A | A | B | A |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) |
| Supply Voltage | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V |
| USB 2.0 FS | Yes (on-chip transceiver) | Yes (on-chip transceiver) | Yes (on-chip transceiver) | Yes (on-chip transceiver) | Yes (on-chip transceiver) | Yes (on-chip transceiver) |
Bảo phân biệt quan trọng
- Audio-optimized Cortex-M4 with FPU and integrated audio peripherals (vsGeneric Cortex-M4 MCU without FPU)
- Largest on-chip SRAM in SAM G55 family (176 KB) (vsCortex-M0+ MCUs in same price tier)
- On-chip USB 2.0 Full-Speed transceiver eliminates external PHY (vsCortex-M MCUs without USB)
Ghi chú thiết kế
The 64-QFN MRLB package has an exposed thermal pad (EP) that must be soldered to a continuous ground plane on the PCB. Use a 7.5x7.5 mm land pattern with at least 0.5 mm thermal via array (0.3 mm vias, 1 mm pitch) underneath the EP to provide low-impedance thermal and electrical return. Insufficient EP soldering raises junction temperature and degrades USB signal integrity. Place four 100 nF decoupling capacitors as close as possible to the four VDDIO pins and one bulk 4.7 uF within 5 mm.
The ATSAMG55J19B-MUT integrates a core voltage regulator that derives VDDCORE from VDDIO, so only a single 1.62 V to 3.6 V external supply is required. For low-noise analog peripherals (ADC, audio), add a ferrite bead or pi-filter between the digital VDDIO rail and the analog AVSS-supplied pins, and provide a clean 3.3 V LDO with <30 uVrms noise for AVCC. Backup mode with RTC retention reduces quiescent current to single-digit microamps; the VDDIO rail must remain present for RTC to function.
Do not leave the NRST pin floating - tie it to VDDIO through a 10 kohm pull-up and a 100 nF capacitor to ground for a clean POR behavior. Unused GPIO pins must be configured as inputs with internal pull-ups enabled, or as outputs driving a defined level, to prevent spurious interrupts and extra current draw. The XIN/XOUT pins require a 3-20 MHz crystal or ceramic resonator with proper load capacitors per the datasheet's Crystal Oscillator Characteristics table; incorrect loading will cause start-up failure.
For USB 2.0 Full-Speed signals (D+, D-), route the differential pair with 90-ohm differential impedance, length-matched within 2 mm, and keep the pair away from switching regulator nodes. The on-chip USB transceiver requires a 1.5 kohm pull-up on D+ (or D- for low-speed) selected by software to enumerate as Full-Speed. The I2S / SSC audio bus signals should be length-matched within 5 mm and series-terminated with 33 ohm if the cable or trace exceeds 50 mm to avoid ringing at 3.072 MHz MCLK harmonics.
Thông tin tuân thủ
RoHS and REACH compliant per Microchip product page. Lead-free and halogen-free packaging. Tape-and-reel packaging qualified to JEDEC J-STD-020 MSL3 at 260 C peak reflow. Not AEC-Q100 qualified - this is a commercial/industrial grade part.
