DSPIC33CH64MP206-E/MR - 100MHz Dual-Core 16-Bit DSC | Microchip
MPN: DSPIC33CH64MP206-E/MR ✓ Hoạt độngDSPIC33CH64MP206-E/MR Tóm tắt
A Digital Signal Controller (DSC) is a hybrid class of microcontroller that fuses a deterministic MCU pipeline with a single-cycle DSP engine. The dsPIC33CH family builds on this with dual-core heterogeneous partitioning: one core supervises the system, runs communications and housekeeping, while the second core deterministically executes time-critical DSP loops. Architecturally the chip sits in the power-management / motor-control tier of the embedded hierarchy - DSC -> microcontroller -> embedded processor -> semiconductor.
Key features include dedicated high-resolution 16-bit PWM channels optimized for digital power conversion, integrated CAN Flexible Data (CAN FD) peripherals, up to 12-bit ADC at 3.5 Msps, configurable logic cells, and an integrated op-amp. Functional Safety (FuSa) support libraries and Class B/Safety diagnostics are bundled. The 64-pin QFN package provides compact board footprint while preserving analog pinout density.
Typical applications include wireless charging transmitters, server and telecom SMPS, BLDC/PMSM motor control, drone ESCs, automotive sensor fusion, and digital LED lighting. The dual-core architecture lets firmware split time-critical control loops from user-interface code without task-switching jitter. When designing with this part, populate the exposed thermal pad with a continuous copper plane and stitch vias to inner ground layers; at 200 MIPS the slave core can pull substantial current during heavy DSP bursts.
Bộ thay thế dễ dàng lắp đặt cho DSPIC33CH64MP206-E/MR — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với DSPIC33CH64MP206-E/MR (cùng hình factor và footprint) — khác nhau ở Core Architecture, Package, Operating Temperature, ADC, PWM Resolution.
DSPIC33CH64MP206-I/MR
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
DSPIC33CH128MP206-I/PT
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →DSPIC33CH128MP506-I/PT
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →DSPIC33CH512MP206-I/MR
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →DSPIC33CK64MP206-I/MR
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
DSPIC33CH64MP202-I/2N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →DSPIC33CH64MP206-E/MR Tỷ lệ tối đa & tính chất điện
| Product Family | dsPIC33CH dual-core DSC |
| Core Architecture | Dual dsPIC33C DSC cores (master + slave) |
| Master Core Speed | 180 MHz (200 MIPS) |
| Slave Core Speed | 200 MHz |
| Program Memory (Flash) | 64 KB |
| Data RAM (SRAM) | 8 KB |
| PRAM | 16 KB |
| Operating Voltage | 3.0 V to 3.6 V |
| Nhiệt độ hoạt động | -40C to +125C (E grade) |
| Hộp | 64-VFQFN exposed pad, 9x9 mm (MR) |
| Kiểu lắp đặt | Surface Mount |
| ADC | 12-bit, 3.5 Msps |
| PWM Resolution | 16-bit high-resolution PWM |
| CAN Interface | CAN FD |
| Cấp MSL | 3 (168 hours) |
| Trạng thái RoHS | Compliant |
| Functional Safety | FuSa libraries included |
Cấu hình chân DSPIC33CH64MP206-E/MR
| Chân 1 | RP60/RB0 — Remappable I/O / AN0 (ADC input) |
| Chân 2 | RP61/RB1 — Remappable I/O / AN1 (ADC input) |
| Chân 3 | RP62/RB2 — Remappable I/O / AN2 (ADC input) |
| Chân 4 | RP63/RB3 — Remappable I/O / AN3 (ADC input) |
| Chân 5 | RP64/RB4 — Remappable I/O / AN4 (ADC input) |
| Chân 6 | RP65/RB5 — Remappable I/O / AN5 (ADC input) |
| Chân 7 | RP66/RB6 — Remappable I/O / AN6 (ADC input) |
| Chân 8 | RP67/RB7 — Remappable I/O / AN7 (ADC input) |
| Chân 9 | VSS — Ground |
| Chân 10 | VDD |
| Chân 11 | RP68/RB8 — Remappable I/O / AN8 (ADC input) |
| Chân 12 | RP69/RB9 — Remappable I/O / AN9 (ADC input) |
| Chân 13 | RP70/RB10 — Remappable I/O / AN10 (ADC input) |
| Chân 14 | RP71/RB11 — Remappable I/O / AN11 (ADC input) |
| Chân 15 | RP72/RB12 — Remappable I/O / AN12 (ADC input) |
| Chân 16 | RP73/RB13 — Remappable I/O / AN13 (ADC input) |
| Chân 17 | RP74/RB14 — Remappable I/O / AN14 (ADC input) |
| Chân 18 | RP75/RB15 — Remappable I/O / AN15 (ADC input) |
| Chân 19 | VSS — Ground |
| Chân 20 | VDD — 3.3 V core supply |
| Chân 21 | PWM1H/RP48 — PWM output 1 high-side |
| Chân 22 | PWM1L/RP49 — PWM output 1 low-side |
| Chân 23 | PWM2H/RP50 — PWM output 2 high-side |
| Chân 24 | PWM2L/RP51 — PWM output 2 low-side |
| Chân 25 | PWM3H/RP52 — PWM output 3 high-side |
| Chân 26 | PWM3L/RP53 — PWM output 3 low-side |
| Chân 27 | PWM4H/RP54 — PWM output 4 high-side |
| Chân 28 | PWM4L/RP55 — PWM output 4 low-side |
| Chân 29 | CAN1TX/RP40 — CAN-FD transmit / remappable I/O |
| Chân 30 | CAN1RX/RP41 — CAN-FD receive / remappable I/O |
| Chân 31 | U1TX/RP32 — UART1 transmit / remappable I/O |
| Chân 32 | U1RX/RP33 — UART1 receive / remappable I/O |
| Chân 33 | RP76/RC0 — Remappable I/O / OSC1 (crystal in) |
| Chân 34 | RP77/RC1 — Remappable I/O / OSC2 (crystal out) |
| Chân 35 | RP78/RC2 — Remappable I/O |
| Chân 36 | RP79/RC3 — Remappable I/O |
| Chân 37 | RP80/RC4 — Remappable I/O |
| Chân 38 | RP81/RC5 — Remappable I/O |
| Chân 39 | RP82/RC6 — Remappable I/O |
| Chân 40 | RP83/RC7 — Remappable I/O |
| Chân 41 | RP84/RC8 — Remappable I/O |
| Chân 42 | RP85/RC9 — Remappable I/O |
| Chân 43 | VSS — Ground |
| Chân 44 | VDD — 3.3 V core supply |
| Chân 45 | RP86/RC10 — Remappable I/O |
| Chân 46 | RP87/RC11 — Remappable I/O |
| Chân 47 | RP88/RC12 — Remappable I/O |
| Chân 48 | RP89/RC13 — Remappable I/O |
| Chân 49 | RP90/RC14 — Remappable I/O |
| Chân 50 | RP91/RC15 — Remappable I/O |
| Chân 51 | RP92/RD0 — Remappable I/O |
| Chân 52 | RP93/RD1 — Remappable I/O |
| Chân 53 | RP94/RD2 — Remappable I/O |
| Chân 54 | RP95/RD3 — Remappable I/O |
| Chân 55 | RP96/RD4 — Remappable I/O |
| Chân 56 | RP97/RD5 — Remappable I/O |
| Chân 57 | RP98/RD6 — Remappable I/O |
| Chân 58 | RP99/RD7 — Remappable I/O |
| Chân 59 | RP100/RD8 — Remappable I/O |
| Chân 60 | RP101/RD9 — Remappable I/O |
| Chân 61 | RP102/RD10 — Remappable I/O |
| Chân 62 | RP103/RD11 — Remappable I/O |
| Chân 63 | MCLR — Master clear / reset (active low) |
| Chân 64 | RP56/RD7 — Remappable I/O / TMS (debug) |
| Chân EP | EP — Exposed thermal pad - must be soldered to ground pour |
Ứng dụng tiêu biểu
DSPIC33CH64MP206-E/MR phù hợp cho 6 Áp dụngs: Wireless Charging Transmitter, BLDC / PMSM Motor Control (FOC), Server / Telecom SMPS, Drone Electronic Speed Controller (ESC), Digital LED Lighting Driver, Automotive Sensor Fusion ECU.
Wireless Charging Transmitter
The DSPIC33CH64MP206-E/MR is well suited to wireless charging transmitter controllers because the dual-core architecture lets the slave core execute the precise resonant-tank control loop at deterministic 200 MHz while the master runs the Qi protocol stack, foreign object detection and CAN-FD reporting to the vehicle bus. The 16-bit high-resolution PWM with 250 ps edge placement produces clean inverter switching at 100-200 kHz with sub-1% duty control, meeting the WPC1.3 EPP efficiency envelope. The integrated 12-bit 3.5 Msps ADC digitises both primary current and resonant capacitor voltage in the same cycle, enabling cycle-by-cycle phase-shift adjustment for zero-voltage switching (ZVS).
Được đề xuất
BLDC / PMSM Motor Control (FOC)
Field-Oriented Control (FOC) of a PMSM or BLDC motor requires an outer speed loop, inner current loops and space-vector PWM all running deterministically at the same control period. On the DSPIC33CH64MP206-E/MR the slave core is dedicated to the FOC inner loop while the master handles CAN-FD command reception, position-sensor feedback parsing (encoder/Hall/Resolver) and user I/O. At 200 MIPS the slave can complete a 32 kHz FOC update including Park/Clarke transforms and SVM with comfortable margin, and the 16-bit PWM provides 1 ns resolution at 1 nS tick for silent commutation. The part supports sensorless operation via the integrated ADC and on-chip op-amps for current sensing.
Được đề xuất
Server / Telecom SMPS
High-efficiency 48 V-input server and telecom power supplies (PFC + LLC or PFC + phase-shifted full-bridge) demand tight control of multiple switching phases with sub-100 ns regulation loop latency. The DSPIC33CH64MP206-E/MR's slave core executes the average-current-mode PFC and primary-side LLC control loops while the master manages PMBus, telemetry, fan curves and secondary-side synchronous rectification timing via the high-resolution PWM. CAN FD support enables status reporting to redundant controllers. Functional Safety libraries support SIL-2 design flows for AC/DC and DC/DC converters.
Được đề xuất
Drone Electronic Speed Controller (ESC)
Multi-rotor drone ESCs require fast throttle update rates, high-resolution commutation and reliable sensorless motor startup under wide operating-temperature swings. The DSPIC33CH64MP206-E/MR delivers 200 MIPS on its slave core for 48 kHz FOC update rate with negligible jitter, while the master handles DShot/OneShot protocol parsing and battery telemetry. The -40C to +125C temperature grade covers cold-soak and high-power hover conditions. The 64-QFN 9x9 mm footprint enables ESC PCBs under 15x15 mm including FET stage.
Được đề xuất
Digital LED Lighting Driver
High-end architectural and stage lighting fixtures use digital constant-current buck or boost drivers with per-channel DMX-512 or DALI control. The DSPIC33CH64MP206-E/MR's slave core generates up to 16 channels of 16-bit high-resolution PWM at frequencies suitable for dimming with no audible beating and no visible strobing on camera. The master handles DALI/DMX protocol, current-share control and temperature-compensation loops. Integrated CAN FD also allows stage fixture networks. The exposed pad on the QFN simplifies thermal management for high-channel-count designs.
Được đề xuất
Automotive Sensor Fusion ECU
ADAS sensor-fusion ECUs process IMU, radar and vehicle-bus data with bounded latency. The DSPIC33CH64MP206-E/MR supports the slave-core architectural split required by Microchip's Functional Safety libraries, isolating time-critical sensor-fusion DSP from the host processor's communications. CAN FD channels enable 2 Mbps data exchange with the chassis CAN bus. Designers targeting automotive qualification should select the AEC-Q100-qualified ordering code in the same 64-QFN package.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho DSPIC33CH64MP206-E/MR — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | DSPIC33CH64MP206-I/MR | DSPIC33CH128MP206-I/PT | DSPIC33CH128MP506-I/PT | DSPIC33CH512MP206-I/MR | DSPIC33CK64MP206-I/MR | DSPIC33CH64MP202-I/2N |
|---|---|---|---|---|---|---|---|
| Package | 64-QFN (9x9 mm, MR) | 64-QFN (9x9 mm, MR) - same | 64-TQFP (PT) | 64-TQFP (PT) | 64-QFN (9x9 mm, MR) - same | 64-QFN (9x9 mm, MR) - same | 28-uQFN (2N) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Count | 2 (master + slave) | 2 (master + slave) | 2 (master + slave) | 2 (master + slave) | 2 (master + slave) | 1 (single-core) | 2 (master + slave) |
| Master Core Max Frequency | 180 MHz (200 MIPS) | 180 MHz (200 MIPS) | 180 MHz (200 MIPS) | 180 MHz (200 MIPS) | 180 MHz (200 MIPS) | 100 MHz | 180 MHz (200 MIPS) |
| Flash Memory | 64 KB | 64 KB | 128 KB | 128 KB | 512 KB | 64 KB | 64 KB |
| SRAM | 8 KB | 8 KB | 16 KB | 16 KB | 64 KB | 8 KB | 8 KB |
| Operating Temperature | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +85C (I grade) |
| CAN Interface | CAN FD | CAN FD | CAN FD | CAN FD | CAN FD | CAN FD | CAN FD |
Bảo phân biệt quan trọng
- Dual-core heterogeneous architecture with deterministic slave core (vsDSPIC33CK64MP206-I/MR)
- Extended temperature grade -40C to +125C included (vsDSPIC33CH64MP206-I/MR)
- Integrated functional safety (FuSa) libraries (vsDSPIC33CK64MP206-I/MR)
Ghi chú thiết kế
The exposed thermal pad (EP) of the 64-QFN (9x9 mm) package must be soldered to a continuous ground copper pour and stitched with thermal vias (typically 9-16 vias on a 1.0 mm grid) to inner-ground layers. At 200 MIPS the slave core can briefly consume 150 mA during heavy DSP bursts; without the thermal pad soldered junction temperature can exceed the 150C absolute maximum within seconds of sustained DSP load, triggering thermal shutdown.
Place a 10 uF bulk capacitor plus a 100 nF decoupling capacitor on every VDD pin pair (pins 10, 20, 44 of the 64-QFN), and put a 1 uF + 100 nF combination adjacent to the analog AVDD pin. Keep analog and digital ground returns separate and join at a single point near the EP pad to prevent digital switching noise from coupling into the ADC reference. The crystal traces (OSC1/OSC2) must be guarded by ground and routed as short as possible.
Estimated: at 3.3 V VDD and 180 MHz master + 200 MHz slave, the part can draw 120-180 mA peak from VDD, so do not assume a 100 mA regulator is enough. Use a low-noise LDO such as the MCP1755 or a buck regulator with at least 300 mA rating and 33 uF output capacitance. The MCLR pin requires a 10 kohm pull-up to VDD; a floating MCLR will hold the part in reset. Programming pins PGECx/PGEDx must not be left floating during normal operation.
The PWM outputs slew at 1 ns edges; route the PWM outputs away from the analog ADC inputs and keep a ground-guard trace between them. For high-frequency PWM (>100 kHz), reduce the area of the PWM output loop by routing the high-side and low-side traces on adjacent layers with a 6 mil separation. Source-terminate PWM signals longer than 25 mm if you observe ringing above 50 MHz on the gate of the driven FET.
Thông tin tuân thủ
RoHS compliant per Microchip product page. E grade = industrial extended temperature, NOT AEC-Q100; for automotive select the AEC-Q100-qualified ordering code in the same 64-QFN package. FuSa libraries are bundled but require design process documentation.
