EP1AGX60CF484I8N - Arria GX FPGA, 60K LE, 484-BGA | Altera
MPN: EP1AGX60CF484I8N ✓ Hoạt độngEP1AGX60CF484I8N Tóm tắt
An FPGA (Field-Programmable Gate Array) is a type of integrated circuit that can be reconfigured by the designer after manufacturing. FPGAs sit in the broader taxonomy of programmable logic devices, between fixed-function ASICs (Application-Specific Integrated Circuits) and software-programmable processors. They belong to the semiconductor category and are commonly used as hardware accelerators, glue logic, and digital signal processing engines in embedded, communications, and industrial systems. Compared to an ASIC, an FPGA offers lower NRE cost and faster time-to-market; compared to a microcontroller, it offers deterministic, parallel processing at very high throughput.
Key features of the EP1AGX60CF484I8N include 60,100 logic elements (LEs), 2,528,640 bits of embedded RAM (typically referenced as 2528640 in distributor parametric data), 229 user I/O pins, embedded transceiver channels for multi-gigabit serial I/O, embedded multipliers for DSP, and a -8 speed grade designation. The 'I' suffix indicates the industrial temperature range (-40C to +100C case), and 'N' indicates lead-free / RoHS-compliant packaging.
The device uses Altera's proven logic element architecture with Look-Up Tables (LUTs), embedded memory blocks (M512, M4K, and M-RAM), and DSP blocks optimized for fixed- and floating-point arithmetic. Quartus II is the supported design toolchain for synthesis, place-and-route, timing closure, and bitstream generation.
Typical applications include communications infrastructure (SONET/SDH, CPRI, OTN, baseband processing), broadcast video processing, military and aerospace signal processing, test and measurement instrumentation, and high-speed serial interface bridging. The transceiver-rich fabric makes it a strong fit for any application that aggregates multiple SFP/SFP+ optical links into a single processing block. When designing with this part, ensure that the PCB layout supports BGA fanout with microvia stack-ups, and that the thermal solution is sized for the industrial junction-temperature envelope. This page synthesizes distributor pricing, drop-in alternative variants, and practical design notes not found in the manufacturer datasheet.
Bộ thay thế dễ dàng lắp đặt cho EP1AGX60CF484I8N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP1AGX60CF484I8N (cùng hình factor và footprint) — khác nhau ở Speed Grade, Package, Transceiver Data Rate, Family, Logic Elements.
EP1AGX60CF484I7N
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✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
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Xem tài liệu →EP1AGX60CF484I8N Tỷ lệ tối đa & tính chất điện
| Family | Arria GX |
| Logic Elements | 60,100 |
| Embedded Memory (bits) | 2,528,640 |
| User I/O | 229 |
| Hộp | 484-ball FineLine BGA (FBGA-484) |
| Kiểu lắp đặt | Surface Mount |
| Speed Grade | -8 (fastest in Arria GX) |
| Temperature Grade | Industrial (-40C to +100C case) |
| Trạng thái RoHS | Compliant (lead-free) |
| Process Technology | 90 nm |
| Design Toolchain | Altera Quartus II |
| Lead-Free | Yes (N suffix) |
Hướng dẫn cấu hình chân EP1AGX60CF484I8N 484-ball fineline bga (fbga-484)
Cấu hình chân cho EP1AGX60CF484I8N (484-ball fineline bga (fbga-484) gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EP1AGX60CF484I8N.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EP1AGX60CF484I8N phù hợp cho 6 Áp dụngs: Telecom Backhaul / SONET-SDH Aggregation, Broadcast Video Processing / SDI Bridging, Military / Aerospace Signal Processing, Test and Measurement Instrumentation, Industrial Control / Machine Vision, Medical Imaging / Ultrasound Beamforming.
Telecom Backhaul / SONET-SDH Aggregation
The EP1AGX60CF484I8N's 60,100 logic elements and embedded multi-gigabit transceivers make it well-suited for telecom backhaul designs that aggregate multiple SONET/SDH or OTN optical links. The Arria GX transceiver macro provides 3.125 Gbps operation with built-in clock-data recovery and 8B/10B encoding, eliminating an external PHY. Industrial temperature grade allows deployment in outdoor cabinets. Place between the optical SFP modules and the packet processor; expect roughly 25-30% logic utilization for a typical 4-channel aggregation design.
Được đề xuất
Broadcast Video Processing / SDI Bridging
The Arria GX EP1AGX60CF484I8N handles HD-SDI and 3G-SDI bridging through its high-speed serial I/O and rich DSP blocks, supporting de-interlacing, scaling, and frame-rate conversion in broadcast studio equipment. 60,100 LEs accommodate a multi-channel SDI pipeline plus on-chip frame buffers. The 484-BGA exposes 229 user I/Os, sufficient for parallel video buses and audio embedding. Industrial temperature range is valuable in fan-less broadcast enclosures. Expect a typical design to use 70-80% of logic elements for a 4-channel 3G-SDI processor.
Được đề xuất
Military / Aerospace Signal Processing
The EP1AGX60CF484I8N with industrial temperature range and rugged BGA package fits defense signal-processing applications such as radar front-end preprocessing, software-defined radio, and electronic-warfare subsystems. The Arria GX DSP blocks accelerate FFT and pulse-Doppler operations while transceivers drive fiber-optic links to downstream signal recorders. Conformal coating and underfilled BGA are typical for MIL applications. Plan for thermal management because sealed enclosures trap heat; budget for 8-12W typical dissipation in a 60% utilized design.
Được đề xuất
Test and Measurement Instrumentation
The EP1AGX60CF484I8N suits high-end oscilloscopes, logic analyzers, and protocol testers that require deep acquisition memory and parallel DSP. The 2,528,640 bits of embedded RAM serve as sample memory while 229 user I/Os drive parallel ADC/DAC buses at hundreds of MHz. Transceivers interface to external trigger systems. Quartus II allows rapid design iteration. The industrial temp grade supports lab and field-deployed instruments. Plan a 6-8 layer PCB with matched-length differential pairs for the ADC interface.
Được đề xuất
Industrial Control / Machine Vision
The Arria GX EP1AGX60CF484I8N drives multi-camera machine-vision pipelines with hardware-accelerated image preprocessing, GigE Vision aggregation, and deterministic real-time control logic. 60,100 LEs fit a 4-camera pre-processor plus EtherCAT or PROFINET master. The industrial temperature range is mandatory for factory-floor deployment. The 484-BGA fan-out requires 4-6 layer PCB with 0.1 mm microvias. Typical utilization: 50-60% logic, 30% DSP blocks for Sobel and threshold filters.
Được đề xuất
Medical Imaging / Ultrasound Beamforming
The EP1AGX60CF484I8N supports ultrasound beamforming and CT/MRI image reconstruction through its parallel DSP blocks and embedded transceivers. Beamforming a 128-channel probe requires tight time-domain synchronization; the Arria GX fabric meets this with deterministic routing. Industrial temp grade allows portable cart-based systems. Plan for noise-isolated analog supplies, since the FPGA's switching noise couples into sensitive receive paths. Typical power: 6-10W at 60% utilization with full DSP activity.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP1AGX60CF484I8N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP1AGX60CF484I7N | EP1AGX60CF484I6N | EP1AGX60CF484C8N | EP1AGX60CF484C7N | EP1AGX60CF484C6N |
|---|---|---|---|---|---|---|
| Package | 484-ball FineLine BGA (FBGA-484) | 484-ball FineLine BGA - same | 484-ball FineLine BGA - same | 484-ball FineLine BGA - same | 484-ball FineLine BGA - same | 484-ball FineLine BGA - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 60,100 | 60,100 | 60,100 | 60,100 | 60,100 | 60,100 |
| Embedded RAM (bits) | 2,528,640 | 2,528,640 | 2,528,640 | 2,528,640 | 2,528,640 | 2,528,640 |
| User I/O | 229 | 229 | 229 | 229 | 229 | 229 |
| Speed Grade | -8 (fastest) | -7 (about 15% slower Fmax) | -6 (about 25% slower Fmax) | -8 (same Fmax) | -7 | -6 |
| Temperature Grade | Industrial (-40C to +100C case) | Industrial -40C to +100C | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C |
| Approx. Unit Price (qty 1) | USD 1850 (as of 2026-09-06) | USD 1700 (est.) | USD 1550 (est.) | USD 1700 (est.) | USD 1500 (est.) | USD 1400 (est.) |
Bảo phân biệt quan trọng
- Highest Fmax in the Arria GX family (vsEP1AGX60CF484I7N)
- Industrial temperature range (vsEP1AGX60CF484C8N)
- Largest logic and memory in the Arria GX family (vsEP1AGX50CF484I6N)
Ghi chú thiết kế
The 484-ball FineLine BGA uses a 1.0 mm ball pitch with a 22x22 ball perimeter array. A 4-layer PCB with 0.1 mm laser-drilled microvias is the minimum recommended stack-up; 6-8 layers ease transceiver impedance control. Use a full ground plane under the BGA and stitched GND vias around the perimeter to control return paths for the multi-gigabit transceivers. Decoupling: place 0.1 uF MLCCs within 100 mils of every Vccint and Vccio ball group, plus bulk 10 uF tantalum caps at each power rail entry point.
Estimated at 60% logic utilization and 50% transceiver utilization, the EP1AGX60CF484I8N dissipates 6-10W on the industrial junction envelope. With the FBGA-484 thermal pad, theta_JA is roughly 12 C/W on a 6-layer PCB with thermal vias, so a 8W load yields a junction rise of about 96C above ambient. For sealed enclosures, design with 2 m/s forced airflow or a small heatsink stamped to the package lid. Keep thermocouple access on the lid for production screening.
The Arria GX transceivers require 100-ohm differential routing on the top microvia layer with reference ground on layer 2; keep transceiver traces length-matched to within 5 mils intra-pair and 50 mils inter-pair. AC-coupling capacitors of 100 nF must be placed within 250 mils of the transmitter ball. Avoid routing any other high-speed signal across the transceiver area, and stitch GND vias every lambda/4 along the differential pair edges to suppress common-mode resonances.
Do not mix Vccio bank voltages - each bank supports either 1.5V/1.8V/2.5V/3.3V but configuration must be programmed before I/O operation begins via the MSEL pins. Do not omit the configuration flash or JTAG header - in-field updates require a programming path. Do not exceed the in-rush current spec during power-up; sequence Vccint before Vccio to avoid partial-configuration latch-up.
Thông tin tuân thủ
RoHS compliance and lead-free packaging indicated by the 'N' suffix in the part number per Altera/Intel FPGA product marking convention. AEC-Q100 is not applicable for FPGAs; this is not an automotive-qualified part - refer to the device handbook for qualification reports.