EP1AGX60CF484I8N - Arria GX FPGA, 60K LE, 484-BGA | Altera
Teilenummer: EP1AGX60CF484I8N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $1850 | $1.850,00 |
| 10 | $1725 | $17.250,00 |
| 50 | $1620 | $81.000,00 |
| 100 | $1545 | $154.500,00 |
| 500 | $1410 | $705.000,00 |
EP1AGX60CF484I8N Übersicht
An FPGA (Field-Programmable Gate Array) is a type of integrated circuit that can be reconfigured by the designer after manufacturing. FPGAs sit in the broader taxonomy of programmable logic devices, between fixed-function ASICs (Application-Specific Integrated Circuits) and software-programmable processors. They belong to the semiconductor category and are commonly used as hardware accelerators, glue logic, and digital signal processing engines in embedded, communications, and industrial systems. Compared to an ASIC, an FPGA offers lower NRE cost and faster time-to-market; compared to a microcontroller, it offers deterministic, parallel processing at very high throughput.
Key features of the EP1AGX60CF484I8N include 60,100 logic elements (LEs), 2,528,640 bits of embedded RAM (typically referenced as 2528640 in distributor parametric data), 229 user I/O pins, embedded transceiver channels for multi-gigabit serial I/O, embedded multipliers for DSP, and a -8 speed grade designation. The 'I' suffix indicates the industrial temperature range (-40C to +100C case), and 'N' indicates lead-free / RoHS-compliant packaging.
The device uses Altera's proven logic element architecture with Look-Up Tables (LUTs), embedded memory blocks (M512, M4K, and M-RAM), and DSP blocks optimized for fixed- and floating-point arithmetic. Quartus II is the supported design toolchain for synthesis, place-and-route, timing closure, and bitstream generation.
Typical applications include communications infrastructure (SONET/SDH, CPRI, OTN, baseband processing), broadcast video processing, military and aerospace signal processing, test and measurement instrumentation, and high-speed serial interface bridging. The transceiver-rich fabric makes it a strong fit for any application that aggregates multiple SFP/SFP+ optical links into a single processing block. When designing with this part, ensure that the PCB layout supports BGA fanout with microvia stack-ups, and that the thermal solution is sized for the industrial junction-temperature envelope. This page synthesizes distributor pricing, drop-in alternative variants, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für EP1AGX60CF484I8N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP1AGX60CF484I8N (gleiche Bauform und Footprint) – abweichend in Speed Grade, Package, Transceiver Data Rate, Family, Logic Elements.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP1AGX60CF484I7N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$218.75 / Stück
Datenblatt ansehen →EP1AGX60CF484I6N
✅ Drop-In✓ Auf Lager
$485.25 / Stück
Datenblatt ansehen →EP1AGX60CF484C8N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$195 / Stück
Datenblatt ansehen →EP1AGX60CF484C7N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$185 / Stück
Datenblatt ansehen →EP1AGX60CF484C6N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$294.4 / Stück
Datenblatt ansehen →EP1AGX60CF484I8N Grenzwerte & elektrische Eigenschaften
| Family | Arria GX |
| Logic Elements | 60,100 |
| Embedded Memory (bits) | 2,528,640 |
| User I/O | 229 |
| Gehäuse | 484-ball FineLine BGA (FBGA-484) |
| Montageart | Surface Mount |
| Speed Grade | -8 (fastest in Arria GX) |
| Temperature Grade | Industrial (-40C to +100C case) |
| RoHS-Status | Compliant (lead-free) |
| Process Technology | 90 nm |
| Design Toolchain | Altera Quartus II |
| Lead-Free | Yes (N suffix) |
EP1AGX60CF484I8N 484-ball fineline bga (fbga-484) Pinbelegungsleitfaden
Pinbelegung für EP1AGX60CF484I8N (484-ball fineline bga (fbga-484)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP1AGX60CF484I8N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP1AGX60CF484I8N ist geeignet für 6 Anwendungs: Telecom Backhaul / SONET-SDH Aggregation, Broadcast Video Processing / SDI Bridging, Military / Aerospace Signal Processing, Test and Measurement Instrumentation, Industrial Control / Machine Vision, Medical Imaging / Ultrasound Beamforming.
Telecom Backhaul / SONET-SDH Aggregation
The EP1AGX60CF484I8N's 60,100 logic elements and embedded multi-gigabit transceivers make it well-suited for telecom backhaul designs that aggregate multiple SONET/SDH or OTN optical links. The Arria GX transceiver macro provides 3.125 Gbps operation with built-in clock-data recovery and 8B/10B encoding, eliminating an external PHY. Industrial temperature grade allows deployment in outdoor cabinets. Place between the optical SFP modules and the packet processor; expect roughly 25-30% logic utilization for a typical 4-channel aggregation design.
Empfohlen
Broadcast Video Processing / SDI Bridging
The Arria GX EP1AGX60CF484I8N handles HD-SDI and 3G-SDI bridging through its high-speed serial I/O and rich DSP blocks, supporting de-interlacing, scaling, and frame-rate conversion in broadcast studio equipment. 60,100 LEs accommodate a multi-channel SDI pipeline plus on-chip frame buffers. The 484-BGA exposes 229 user I/Os, sufficient for parallel video buses and audio embedding. Industrial temperature range is valuable in fan-less broadcast enclosures. Expect a typical design to use 70-80% of logic elements for a 4-channel 3G-SDI processor.
Empfohlen
Military / Aerospace Signal Processing
The EP1AGX60CF484I8N with industrial temperature range and rugged BGA package fits defense signal-processing applications such as radar front-end preprocessing, software-defined radio, and electronic-warfare subsystems. The Arria GX DSP blocks accelerate FFT and pulse-Doppler operations while transceivers drive fiber-optic links to downstream signal recorders. Conformal coating and underfilled BGA are typical for MIL applications. Plan for thermal management because sealed enclosures trap heat; budget for 8-12W typical dissipation in a 60% utilized design.
Empfohlen
Test and Measurement Instrumentation
The EP1AGX60CF484I8N suits high-end oscilloscopes, logic analyzers, and protocol testers that require deep acquisition memory and parallel DSP. The 2,528,640 bits of embedded RAM serve as sample memory while 229 user I/Os drive parallel ADC/DAC buses at hundreds of MHz. Transceivers interface to external trigger systems. Quartus II allows rapid design iteration. The industrial temp grade supports lab and field-deployed instruments. Plan a 6-8 layer PCB with matched-length differential pairs for the ADC interface.
Empfohlen
Industrial Control / Machine Vision
The Arria GX EP1AGX60CF484I8N drives multi-camera machine-vision pipelines with hardware-accelerated image preprocessing, GigE Vision aggregation, and deterministic real-time control logic. 60,100 LEs fit a 4-camera pre-processor plus EtherCAT or PROFINET master. The industrial temperature range is mandatory for factory-floor deployment. The 484-BGA fan-out requires 4-6 layer PCB with 0.1 mm microvias. Typical utilization: 50-60% logic, 30% DSP blocks for Sobel and threshold filters.
Empfohlen
Medical Imaging / Ultrasound Beamforming
The EP1AGX60CF484I8N supports ultrasound beamforming and CT/MRI image reconstruction through its parallel DSP blocks and embedded transceivers. Beamforming a 128-channel probe requires tight time-domain synchronization; the Arria GX fabric meets this with deterministic routing. Industrial temp grade allows portable cart-based systems. Plan for noise-isolated analog supplies, since the FPGA's switching noise couples into sensitive receive paths. Typical power: 6-10W at 60% utilization with full DSP activity.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP1AGX60CF484I8N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP1AGX60CF484I7N | EP1AGX60CF484I6N | EP1AGX60CF484C8N | EP1AGX60CF484C7N | EP1AGX60CF484C6N |
|---|---|---|---|---|---|---|
| Package | 484-ball FineLine BGA (FBGA-484) | 484-ball FineLine BGA - same | 484-ball FineLine BGA - same | 484-ball FineLine BGA - same | 484-ball FineLine BGA - same | 484-ball FineLine BGA - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 60,100 | 60,100 | 60,100 | 60,100 | 60,100 | 60,100 |
| Embedded RAM (bits) | 2,528,640 | 2,528,640 | 2,528,640 | 2,528,640 | 2,528,640 | 2,528,640 |
| User I/O | 229 | 229 | 229 | 229 | 229 | 229 |
| Speed Grade | -8 (fastest) | -7 (about 15% slower Fmax) | -6 (about 25% slower Fmax) | -8 (same Fmax) | -7 | -6 |
| Temperature Grade | Industrial (-40C to +100C case) | Industrial -40C to +100C | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C |
| Approx. Unit Price (qty 1) | USD 1850 (as of 2026-09-06) | USD 1700 (est.) | USD 1550 (est.) | USD 1700 (est.) | USD 1500 (est.) | USD 1400 (est.) |
Wichtigste Unterscheidungsmerkmale
- Highest Fmax in the Arria GX family (vs. EP1AGX60CF484I7N)
- Industrial temperature range (vs. EP1AGX60CF484C8N)
- Largest logic and memory in the Arria GX family (vs. EP1AGX50CF484I6N)
Designhinweise
The 484-ball FineLine BGA uses a 1.0 mm ball pitch with a 22x22 ball perimeter array. A 4-layer PCB with 0.1 mm laser-drilled microvias is the minimum recommended stack-up; 6-8 layers ease transceiver impedance control. Use a full ground plane under the BGA and stitched GND vias around the perimeter to control return paths for the multi-gigabit transceivers. Decoupling: place 0.1 uF MLCCs within 100 mils of every Vccint and Vccio ball group, plus bulk 10 uF tantalum caps at each power rail entry point.
Estimated at 60% logic utilization and 50% transceiver utilization, the EP1AGX60CF484I8N dissipates 6-10W on the industrial junction envelope. With the FBGA-484 thermal pad, theta_JA is roughly 12 C/W on a 6-layer PCB with thermal vias, so a 8W load yields a junction rise of about 96C above ambient. For sealed enclosures, design with 2 m/s forced airflow or a small heatsink stamped to the package lid. Keep thermocouple access on the lid for production screening.
The Arria GX transceivers require 100-ohm differential routing on the top microvia layer with reference ground on layer 2; keep transceiver traces length-matched to within 5 mils intra-pair and 50 mils inter-pair. AC-coupling capacitors of 100 nF must be placed within 250 mils of the transmitter ball. Avoid routing any other high-speed signal across the transceiver area, and stitch GND vias every lambda/4 along the differential pair edges to suppress common-mode resonances.
Do not mix Vccio bank voltages - each bank supports either 1.5V/1.8V/2.5V/3.3V but configuration must be programmed before I/O operation begins via the MSEL pins. Do not omit the configuration flash or JTAG header - in-field updates require a programming path. Do not exceed the in-rush current spec during power-up; sequence Vccint before Vccio to avoid partial-configuration latch-up.
Compliance-Informationen
RoHS compliance and lead-free packaging indicated by the 'N' suffix in the part number per Altera/Intel FPGA product marking convention. AEC-Q100 is not applicable for FPGAs; this is not an automotive-qualified part - refer to the device handbook for qualification reports.