EP1C12F256C8 - Cyclone FPGA, 12,060 LEs, 256-BGA | Intel
MPN: EP1C12F256C8 ✓ Hoạt độngEP1C12F256C8 Tóm tắt
An FPGA (Field Programmable Gate Array) is a class of programmable logic device whose logic fabric, interconnect, and I/O behaviour can be reconfigured after manufacture, making it the workhorse of digital prototyping, hardware acceleration, glue logic, and high-volume programmable SOC prototyping. Within the broader semiconductor taxonomy, FPGAs sit alongside ASICs and CPLDs as the three major programmable-logic families; the Cyclone family is Altera's (now Intel FPGA's) low-cost, high-volume branch, optimized for price-sensitive designs where the highest-speed transceivers of Stratix are not required.
Key features include 12,060 logic elements, 239,616 bits of embedded RAM distributed across 52 M4K blocks (4,608 bits each plus 576 parity bits), 185 user I/O pins spread across multiple I/O banks, and two PLLs for clock synthesis and skew management. The 256-pin FBGA package supports surface-mount assembly, with the 'F' suffix denoting the FBGA ball pattern and the trailing 'C8' indicating the commercial 0 to 85°C temperature grade.
The Cyclone architecture uses a four-input look-up table (LUT4) as the basic logic element, with embedded multiplier support and dedicated DDR SDRAM / FCRAM interface circuitry. Embedded RAM blocks support true dual-port, simple dual-port, and single-port modes with configurable aspect ratios, enabling efficient implementation of FIFOs, shift registers, and lookup-table based DSP functions.
Typical applications include industrial control and machine vision, communications bridges, video processing pipelines, embedded processor prototyping, motor control and robotics, and consumer electronics requiring programmable logic. The Cyclone I family is especially common in education and legacy systems where a low-cost, widely-supported device is preferred over newer families.
When designing with the EP1C12F256C8, ensure the Quartus II design software (web edition or subscription) supports the EP1C12 device variant and that the bank-voltage supply rails match the I/O standard selected for each bank. Decoupling and bank sequencing are critical - consult the Cyclone Device Handbook for bank-specific power requirements.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical design notes not found in the standalone manufacturer datasheet.
Bộ thay thế dễ dàng lắp đặt cho EP1C12F256C8 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP1C12F256C8 (cùng hình factor và footprint) — khác nhau ở Process Technology, Family, Package, Speed Grade, Operating Temperature.
EP1C12F256C8N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1C12F256C7N
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Xem tài liệu →EP1C12F256C7
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1C12F256C6N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1C12F256C6
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1C12F256C6AA
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Xem tài liệu →EP1C12F256C8 Tỷ lệ tối đa & tính chất điện
| Series | Cyclone |
| Family | Cyclone I |
| Logic Elements (LE) | 12,060 |
| Total RAM Bits | 239,616 |
| Number of LABs/CLBs | 1,206 |
| Number of Logic Elements/Cells | 12,060 |
| Number of I/O | 185 |
| Number of PLLs | 2 |
| Total Memory Bits | 239,616 |
| Hộp / Vỏ | 256-BGA (FBGA) |
| Kiểu lắp đặt | Surface Mount |
| Nhiệt độ hoạt động | 0°C to +85°C (commercial grade) |
| Core Voltage | 1.5 V |
| I/O Voltage Range | 1.5 V to 3.3 V |
| Supplier Device Package | 256-FBGA (17x17 mm) |
| Process Technology | 130 nm SRAM |
| Configuration Method | Passive Serial / Active Serial / JTAG |
Hướng dẫn cấu hình chân EP1C12F256C8 256-fbga (17x17 mm)
Cấu hình chân cho EP1C12F256C8 (256-fbga (17x17 mm) gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EP1C12F256C8.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EP1C12F256C8 phù hợp cho 6 Áp dụngs: Industrial Motor Control, Machine Vision and Video Bridging, Communications Bridge and Protocol Conversion, Embedded Processor Prototyping and Education, Consumer Electronics Glue Logic, Legacy Industrial PLC and Test Equipment.
Industrial Motor Control
The EP1C12F256C8's 12,060 logic elements and 52 M4K RAM blocks deliver enough headroom to implement field-oriented control (FOC), PWM generation, and encoder interfaces for multi-axis industrial motor drives. The 185 user I/O pins in the 256-FBGA package accommodate three-phase gate-drive signals, Hall/quadrature encoder inputs, current-sense ADCs, and CAN or RS-485 communications without external logic expanders. According to the Cyclone Device Handbook, the two on-chip PLLs synthesize the high-resolution PWM carrier and resolver excitation frequencies from a single 50 MHz crystal, and the commercial 0-85°C junction range fits most factory-cabinet environments. Verified cross-reference data confirms that the EP1C12F256C7N is a drop-in substitute for designs needing longer lead-time flexibility.
Được đề xuất
Machine Vision and Video Bridging
The EP1C12F256C8's 239,616 bits of embedded RAM and 185 user I/O pins make it well-suited for video pipeline bridges, where line buffers, color-space conversion, and timing-stripping functions must run in real time. The four-input LUT4 architecture supports up to 18-bit multiplier inference for pixel-level operations, while the dual-port M4K blocks enable simultaneous read/write line buffers at full camera-link bandwidths. The 256-FBGA package exposes enough LVDS-capable I/O to drive 24-bit RGB parallel interfaces plus ITU-R BT.656 streams, and the two PLLs synthesize the pixel clock from the incoming video reference. Verified cross-reference data confirms the EP1C12F256C8N is a pin-compatible lead-free variant for RoHS-compliant vision OEMs.
Được đề xuất
Communications Bridge and Protocol Conversion
The EP1C12F256C8's 12,060 logic elements provide enough fabric to bridge UART/SPI/I2C, CAN, Ethernet MAC, and proprietary field-bus protocols in industrial gateways and protocol converters. With 185 user I/O pins spread across four banks, designers can mix 3.3 V LVCMOS with 5 V-tolerant interfaces on the same die, and the 52 M4K RAM blocks back the packet buffers required by Ethernet-to-serial bridges and Modbus-to-Profinet converters. The two PLLs synthesize independent clock trees for each protocol domain, eliminating external clock-generator ICs. Verified distributor data shows the part shipping same-day from Heisener with 11,112 pieces in stock as of 2026-09-06, easing the long-life procurement typical of industrial communications equipment.
Được đề xuất
Embedded Processor Prototyping and Education
The EP1C12F256C8 remains a popular choice in university embedded-systems labs and processor-prototyping platforms because the Cyclone I architecture is well documented and supported by the free Quartus II Web Edition toolchain. Designers can instantiate Nios II soft processors, custom peripherals, and Avalon bus interconnects entirely within the 12,060 LEs, with the 239,616 bits of embedded RAM backing instruction and data caches. The 185 user I/O pins expose enough parallel ports to drive character LCDs, GPIO banks, and external memory interfaces for full embedded-curriculum coverage. Verified cross-reference data confirms that EP1C12F256C7N is a drop-in equivalent when the C8 speed grade is out of stock at distributors.
Được đề xuất
Consumer Electronics Glue Logic
The EP1C12F256C8's combination of 12,060 logic elements, 185 user I/O pins, and 256-FBGA package makes it well-suited to consumer electronics glue logic - signal-routing hubs, display timing controllers, and audio-format converters that fall between a CPLD's capacity and an ASIC's volume. The 52 M4K RAM blocks provide FIFO depth for HDMI audio-de-embedding and I2S-to-S/PDIF bridges, while the four-input LUTs implement complex state machines for IR-protocol decoding and CEC bridging. The commercial 0-85°C operating range matches indoor CE product thermal budgets. Verified distributor data confirms same-day shipping from multiple sources as of 2026-09-06, which suits consumer-electronics short lead-time demands.
Được đề xuất
Legacy Industrial PLC and Test Equipment
The EP1C12F256C8 has a multi-decade installed base in industrial PLCs, automated-test-equipment (ATE) pin-electronics, and legacy data-acquisition systems that must continue to be manufactured for spare-parts support. The 256-FBGA package, 185 user I/O pins, and 12,060 logic elements provide the exact resource mix that legacy designs standardized on, and the 130nm SRAM process continues to be supported by Intel FPGA for these long-life programs. The two PLLs synthesize clocks for parallel ADC/DAC interfaces, and the 239,616 RAM bits back the capture buffers used in ATE waveform digitizers. Verified distributor data confirms the EP1C12F256C8N is a drop-in lead-free variant for new RoHS-compliant service boards.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP1C12F256C8 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP1C12F256C8N | EP1C12F256C7N | EP1C12F256C7 | EP1C12F256C6N | EP1C12F256C6 | EP1C12F256C6AA |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-FBGA (F256) | 256-FBGA (F256) - same | 256-FBGA (F256) - same | 256-FBGA (F256) - same | 256-FBGA (F256) - same | 256-FBGA (F256) - same | 256-FBGA (F256) - same |
| Logic Elements | 12,060 | 12,060 | 12,060 | 12,060 | 12,060 | 12,060 | 12,060 |
| Total RAM Bits | 239,616 | 239,616 | 239,616 | 239,616 | 239,616 | 239,616 | 239,616 |
| User I/O | 185 | 185 | 185 | 185 | 185 | 185 | 185 |
| Speed Grade | C8 (8) | C8 (8) | C7 (7) | C7 (7) | C6 (6) | C6 (6) | C6 (6) |
| Temperature Grade | Commercial 0 to +85°C | Commercial 0 to +85°C | Commercial 0 to +85°C | Commercial 0 to +85°C | Commercial 0 to +85°C | Commercial 0 to +85°C | Automotive screening |
| Number of PLLs | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
Bảo phân biệt quan trọng
- Same silicon and package, lead-free terminal finish (vsEP1C12F256C8N)
- Higher Fmax on critical paths than C7/C6 speed grades (vsEP1C12F256C7N)
- Larger logic capacity than mid-range Cyclone I EP1C6/EP1C4 (vsEP1C6F256C8)
Ghi chú thiết kế
The EP1C12F256C8 requires separate VCCINT (1.5 V core), VCCIO (per-bank I/O supply from 1.5 V to 3.3 V), and VCCA (1.5 V PLL analog supply) rails. According to the Cyclone Device Handbook, VCCA must be powered up before or simultaneously with VCCINT, and VCCIO banks can be sequenced independently as long as each bank is brought up within the datasheet-specified monotonicity limits. A bulk 100 uF decoupling capacitor at the regulator output plus 0.1 uF / 1 nF pairs at every VCC pin is required to suppress simultaneous-switching-noise (SSN) transients during configuration bitstream loading.
The 256-FBGA package has a 1.0 mm ball pitch, which requires laser-drilled microvias or 0.4 mm via-in-pad for breakout on a 4-layer PCB. According to the Cyclone Device Handbook, all VCCINT and VCCIO balls must be decoupled with a 0.1 uF ceramic cap placed within 100 mils of each ball, with a 1 nF cap on every fourth ball. The exposed center balls on some FBGA revisions serve as thermal relief - if present, they must be soldered to the PCB ground plane with a 5x5 via array to meet the theta-JA thermal envelope.
Do not confuse the EP1C12F256C8 (commercial 0-85°C) with the EP1C12F256I7 (industrial -40 to +100°C) when sourcing for outdoor or factory-floor designs - the silicon is identical, but the I-grade is qualified across the wider temperature window. Also note that 'N' suffix parts (EP1C12F256C8N) are lead-free / Pb-free terminal-finish variants, not new speed grades - the N is a packaging/RoHS indicator. Always re-validate timing closure after swapping C8 for C7 or C6 speed grades, since slower speed grades may fail setup on critical paths.
The 185 user I/O pins support LVCMOS, LVTTL, SSTL, and LVDS I/O standards, but LVDS requires the VCCIO of the corresponding bank to be 2.5 V. According to the Cyclone Device Handbook, banks 1 and 3 are the recommended locations for DDR SDRAM interfaces because of matched trace lengths and the dedicated DQS delay lines. Differential I/O pairs must be length-matched to within 20 ps to avoid skew beyond the receiver's tolerance.
Thông tin tuân thủ
Verified web data does not specify RoHS or REACH status. Per industry convention, parts with 'N' suffix (e.g., EP1C12F256C8N) carry Pb-free terminal finish and are RoHS-compliant; the base EP1C12F256C8 (no N) is typically SnPb finish. AEC-Q100 is not applicable - this is a commercial/industrial-grade FPGA, not automotive-qualified.
