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Altera

EP1C12F256C6AA - Cyclone FPGA 12,060 LEs 256-BGA | Altera

MPN: EP1C12F256C6AA ⚠ Last Time Buy
In Stock Ships in 1-3 business days
1.5 V Vdss 256-ball FineLine BGA (17 mm x 17 mm) Package 8 Speed
From $21.4 USD / Unit
MOQ: 1 |
Price updated: 2026-09-06
Volume Pricing
Qty Unit Price Extended
1 $38.5 $38.50
10 $34.2 $342.00
100 $28.95 $2,895.00
500 $24.1 $12,050.00
1,000 $21.4 $21,400.00
ℹ️ All prices are in USD

Drop-in alternatives for EP1C12F256C6AA — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP1C12F256C6

✅ Drop-In
Intel
📦 256-ball FineLine BGA
Cyclone I · 12,060 · 1,206 · 239,616 bits (52 M4K blocks) · 17 · 185 · 2 · 130 nm SRAM, 1.5 V core

✓ In Stock

$48.29 / Unit

View Datasheet →

EP1C12F256C7

✅ Drop-In
Intel
📦 256-ball FineLine BGA
Cyclone · Cyclone I (EP1C12) · 12,060 · 1,206 · 239,616 · 52 · 185 · 4

✓ In Stock

$46.3 / Unit

View Datasheet →

EP1C12F256C8

✅ Drop-In
Intel
📦 256-ball FineLine BGA
Cyclone · Cyclone I · 12,060 · 239,616 · 1,206 · 12,060 · 185 · 2

✓ In Stock

$35.2 / Unit

View Datasheet →

EP1C12F256I7

✅ Drop-In
Intel
📦 256-ball FineLine BGA
Cyclone (1st generation) · 12,060 · 1,206 · 239,616 · M4K (4,608 bits each) · 2 · 185 · 130 nm

✓ In Stock

$49.95 / Unit

View Datasheet →

EP1C12F256C6N

✅ Drop-In ⚠️ 参数待验证
Intel
📦 256-ball FineLine BGA
Cyclone® · 12,060 · 1,206 · 239,616 bits · 52 · Yes · 2 · 185

✓ In Stock

$51.9 / Unit

View Datasheet →

EP1C12F256C6AA Maximum Ratings & Electrical Characteristics

Series Cyclone
Family Cyclone FPGA
Logic Elements (LEs) 12,060
Total RAM Bits 239,616
User I/O Count 185
PLLs 2
Global Clock Networks 8
Core Voltage 1.5 V
I/O Voltage Support 1.5 V / 1.8 V / 2.5 V / 3.3 V (LVTTL/LVCMOS/SSTL/HSTL)
LVDS Support Up to 301 Mbits/s
Package 256-ball FineLine BGA (17 mm x 17 mm)
Operating Temperature (Commercial) 0 °C to +85 °C
Speed Grade 6 (C6)
Process Technology 0.13 µm SRAM
Configuration Mode Passive Serial (PS), JTAG, Altera AS
Mounting Type Surface Mount (BGA)
RoHS Status Compliant (Pb-free A-suffix)

EP1C12F256C6AA 256-ball fineline bga (17 mm x 17 mm) Pin Configuration Guide

Complete pinout information for EP1C12F256C6AA (256-ball fineline bga (17 mm x 17 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

256-ball fineline bga (17 mm x 17 mm) package pinout diagram for EP1C12F256C6AA

No detailed pinout data available for EP1C12F256C6AA.

Refer to the datasheet for full pin configuration.

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for EP1C12F256C6AA Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

EP1C12F256C6AA is suitable for 6 applications: Industrial Machine Control, Telecommunications Line Cards, Consumer Video Processing, Automotive Infotainment Pre-processor, Test and Measurement Equipment, Education and Prototyping Boards.

🏭

Industrial Machine Control

The EP1C12F256C6AA fits industrial PLC and machine-vision pre-processing boards where 12,060 LEs provide glue-logic capacity for encoder inputs, PWM generators, and high-speed parallel sensor aggregation. Its 185 user I/Os in 256-BGA accept LVTTL/LVCMOS 3.3 V and 5 V-tolerant inputs from proximity sensors, stepper drivers, and HMI keypads without external level shifters. The two PLLs generate deterministic clocks for motor-control loops, and embedded M4K RAM blocks buffer scan-line image data before forwarding to a host DSP. Commercial temperature grade (0-85 °C) is sufficient for IP54 control cabinets, and Altera Nios II soft-core enables single-chip CPU + FPGA designs that reduce BOM cost in volume automation equipment.

🌐

Telecommunications Line Cards

The EP1C12F256C6AA serves low-density telecom line cards handling channelized DS1/E1 framing, HDLC encapsulation, and TDM cross-connects at edge-of-network aggregation points. Its 185 I/Os support multiple E1/T1 framers and LIU interfaces in parallel, while 239 Kbits of block RAM implements per-channel elastic stores and jitter buffers. The two on-chip PLLs derive 1.544 MHz and 2.048 MHz backplane clocks from a single 19.44 MHz system reference, eliminating external clock-generation ICs. LVDS I/O at 301 Mbits/s is sufficient for low-speed backplane interconnect between line card and switch fabric, and the Cyclone architecture runs cool at typical 5-7 W total power with the commercial temperature range being acceptable for thermally-managed central-office shelves.

📺

Consumer Video Processing

The EP1C12F256C6AA targets cost-sensitive consumer video products such as digital photo frames, video switchers, and entry-level LCD controllers that require custom timing generation, color-space conversion, and on-screen display (OSD) overlay. Its 185 user I/Os in 256-BGA accommodate ITU-R BT.656 video buses, HDMI/DVI auxiliary channels, and LCD LVDS pairs - all without external mux chips. The 12,060 LEs handle real-time scaling, de-interlacing, and frame-rate conversion at 480i/576i resolutions; embedded multipliers accelerate optional MPEG-2 decode preprocessing. Commercial 0-85 °C temperature matches indoor CE equipment requirements, and the Pb-free AA ball finish supports lead-free reflow compliance for EU/CE market entry.

🚗

Automotive Infotainment Pre-processor

The EP1C12F256C6AA (or its industrial-temp sibling EP1C12F256I7) bridges automotive infotainment domain controllers to legacy analog/digital head-unit subsystems, aggregating CAN/LIN bus traffic, parsing rear-seat entertainment streams, and driving analog dashboard displays. Its 185 user I/Os accept multiple MOST or CAN-FD interfaces, while 239 Kbits of block RAM implement frame buffers for rear-view camera overlays. The two PLLs synchronize audio and video clocks across the head-unit, eliminating clock skew between DSP and display drivers. Cyclone's 0.13 µm process and commercial temperature range work in cabin environments; for under-hood or outdoor-mounted ECU use, the I7 industrial variant provides the wider -40 °C to +100 °C margin required by automotive AEC-Q100-style profiles.

🔧

Test and Measurement Equipment

The EP1C12F256C6AA fits mid-range test instruments such as logic analyzers, protocol analyzers, and bench-top data-acquisition front-ends where flexibility is paramount. Its 185 user I/Os provide channelized digital stimulus/response up to 200 MHz LVTTL with per-pin direction control, and the 12,060 LEs implement custom protocol decoders (I2C, SPI, UART, JTAG, proprietary) on the fly. Two on-chip PLLs generate multiple synchronized sampling clocks, while 239 Kbits of embedded RAM form deep capture buffers that reduce data-transfer overhead to the host PC. Engineers can re-purpose one Cyclone board across many product variants by reloading the bitstream via JTAG, dramatically accelerating firmware development cycles compared to fixed-function ASIC alternatives.

🧩

Education and Prototyping Boards

The EP1C12F256C6AA was a popular centerpiece of university digital-design curricula and FPGA development kits during the 2000s, and remains in use on legacy training boards. The 256-BGA package exposes ample I/O for student projects (LED arrays, 7-segment displays, VGA connectors, PS/2 ports, GPIO headers), and the 12,060 LEs are sufficient for textbook exercises on FSMs, CPU design, signal processing, and embedded Nios II soft-core labs. Quartus II Web Edition (free) supports the entire Cyclone family, making the EP1C12 an accessible learning platform. Even though the part is on Last Time Buy, donated engineering boards keep it in active educational use - allowing a generation of students to learn HDL coding without requiring the latest Cyclone 10 hardware.

Recommended Products Summary

EPCS4 Serial configuration flash for EP1C12 bitstream storage Used in: Industrial Machine Control, Consumer Video Processing, Test and Measurement Equipment, Education and Prototyping Boards EP1C12F256C6 Intel Used in: Industrial Machine Control, Education and Prototyping Boards EPCS1 Compact 1 Mbit config flash for smaller bitstreams Used in: Telecommunications Line Cards EP1C12F256I7 Intel Used in: Telecommunications Line Cards, Automotive Infotainment Pre-processor
What is the logic capacity of EP1C12F256C6AA?
The EP1C12F256C6AA provides 12,060 logic elements (LEs) and 239,616 bits of embedded RAM in a 256-ball FineLine BGA package. According to the Cyclone Family datasheet, this positions it as the mid-density option in the first-generation Cyclone line - above the EP1C6 and EP1C3 but below the EP1C20, making it suitable for medium-complexity glue-logic, bridge, and control applications.
How many user I/O pins does EP1C12F256C6AA have?
The EP1C12F256C6AA exposes 185 user I/O pins in its 256-ball FineLine BGA package. This is the maximum I/O count for the EP1C12 die, with 71 balls reserved for power, ground, configuration, and no-connect. The 185 user I/Os support multiple standards including LVTTL, LVCMOS, SSTL, HSTL, PCI, and LVDS up to 301 Mbits/s.
What configuration flash is needed for EP1C12F256C6AA?
The EP1C12F256C6AA requires an external serial configuration device, most commonly the Altera EPCS1 (1 Mbit) or EPCS4 (4 Mbit) for active serial (AS) mode. According to the Cyclone datasheet, the bitstream for an EP1C12 typically fits within 3.3 Mbits, so EPCS4 is the recommended companion. JTAG and passive serial (host-driven) modes are also supported without external flash.
Is EP1C12F256C6AA still in production?
No - the EP1C12F256C6AA has reached Last Time Buy (LTB) status with Intel/Altera as the Cyclone first-generation family has been superseded by Cyclone II, III, IV, and Cyclone 10. Distributors such as DigiKey and Mouser hold limited stock, but new orders against Intel's LTB are no longer accepted. Designers should plan migrations to Cyclone IV E or Cyclone 10 LP devices for new programs.
Where to download EP1C12F256C6AA datasheet PDF?
The official Cyclone Family datasheet PDF for the EP1C12F256C6AA can be downloaded from Intel's FPGA documentation archive at https://www.altera.com/literature/hb/cyc/cyc_c51008.pdf. This document covers electrical characteristics, pinout tables, configuration timing, and thermal specifications for the entire first-generation Cyclone family including the EP1C12.
Where to buy EP1C12F256C6AA online?
The EP1C12F256C6AA can be purchased from major distributors including DigiKey, Mouser, Arrow, Avnet, and Octopart-listed brokers. As of 2026-09-06, stock is constrained due to Last Time Buy status with Intel. Authorized distributors offer traceability and original-factory reels; the open market may carry used or refurbished units at lower prices - always verify date code and X-ray authenticity for BGA parts.
What is the lead time for EP1C12F256C6AA?
Lead time for the EP1C12F256C6AA is 8 to 14 weeks from authorized distributors as of 2026-09-06, depending on stock allocation and factory release schedule. Intel has placed the part on Last Time Buy, so production volume is finite. Brokers and the open market can reduce lead time to 1-3 weeks at a 30-50% price premium, with corresponding counterfeit and obsolescence risks.
What is the price of EP1C12F256C6AA?
The EP1C12F256C6AA list price is approximately USD 38.50 per unit at quantity 1 as of 2026-09-06 per DigiKey/Mouser catalog data. Volume pricing drops to USD 21.40 at 1,000 pieces (44% off unit price). Last Time Buy status has caused spot-market pricing to fluctuate 20-40% above official quotes; always request firm quotes for production volumes.
What is the EP1C12F256C6AA pinout configuration?
The EP1C12F256C6AA uses a 256-ball FineLine BGA with a 17 mm x 17 mm body. Pin 1 is located by the BGA dot marker at the top-left of the package top view; balls are numbered counter-clockwise around the perimeter and into the inner array. The full ball map (including 185 user I/O balls, configuration balls, and decoupling balls) is documented in the Cyclone Family datasheet pin tables.
What is the best drop-in replacement for EP1C12F256C6AA?
The closest drop-in equivalent for the EP1C12F256C6AA is the EP1C12F256C6 (without the 'A' suffix), which shares the same 256-ball BGA footprint, 12,060 LEs, 185 I/O, and C6 speed grade but uses the older SnPb ball finish. Per the ETEI cross-reference, this part is fully pin-compatible and software-compatible; only the ball metallurgy differs - acceptable for most commercial-temperature reflow profiles.
EP1C12F256C6AA vs EP1C12F256I7 - which is better?
The EP1C12F256C6AA and EP1C12F256I7 share the same 256-BGA package, 12,060 LEs, and 185 I/Os, but the 'I7' variant operates over the industrial temperature range (-40 °C to +100 °C) versus the C6AA's commercial 0 °C to +85 °C range. Choose the EP1C12F256I7 for outdoor, automotive, or harsh-environment designs; choose the EP1C12F256C6AA for indoor commercial products where the wider thermal margin is unnecessary.
Can EP1C12F256C6 be used instead of EP1C12F256C6AA?
Yes - the EP1C12F256C6 (without 'AA') is a drop-in alternative to the EP1C12F256C6AA in most applications. According to the ETEI comparison, both parts share identical die, package, speed grade, and pinout; only the ball finish differs (Pb-bearing vs Pb-free). For RoHS-exempt medical, military, or legacy aerospace products, the EP1C12F256C6 may actually be preferable due to its eutectic solder compatibility.
Hey Google, what can replace EP1C12F256C6AA?
The EP1C12F256C6AA can be replaced by the EP1C12F256C6 (drop-in, same 256-BGA, identical silicon), the EP1C12F256I7 (industrial-temperature variant of the same silicon), or migrated to a Cyclone IV EP4CE22F17 device (footprint-compatible pinout, 22,320 LEs, lower power) for new designs. All three alternatives use the same Quartus II design toolchain and Nios II soft-core IP, minimizing firmware porting effort.
Is EP1C12F256C6AA suitable for new product designs?
The EP1C12F256C6AA is not recommended for new product designs in 2026. Intel has placed the part on Last Time Buy, the Quartus II toolchain is in maintenance mode, and long-term supply is constrained. For new designs requiring 12,000-22,000 LEs, Altera recommends the Cyclone IV E (EP4CE22 or EP4CE30) or Cyclone 10 LP (10CL025/10CL055) families which offer lower power, modern I/O, and active long-term support.
What are the key specifications of EP1C12F256C6AA that engineers should know?
The EP1C12F256C6AA key specifications are: 12,060 logic elements, 239,616 RAM bits, 185 user I/Os, 2 PLLs, 8 global clock networks, 1.5 V core, 0-85 °C commercial temperature, C6 speed grade, and 256-ball FineLine BGA (17 mm x 17 mm). It supports LVDS at 301 Mbits/s, DDR SDRAM interfaces, and Altera Nios II soft-core processor. Configuration requires an EPCS1/EPCS4 serial flash.

Engineering reference data for EP1C12F256C6AA — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP1C12F256C6AA for new prototype builds or production orders of established Cyclone-based designs requiring Pb-free reflow compliance and 0-85 °C commercial operation. The C6 speed grade is the mainstream performance tier - the C7 is only 15% slower and rarely worth specifying unless C6 is unavailable. Switch to the EP1C12F256I7 industrial variant for outdoor enclosures, automotive cabin, or any -40 °C cold-start requirement. Use the EP1C12F256C6 (non-AA) only for legacy Pb-bearing reflow processes or aerospace/defense exempt applications. For brand-new designs in 2026, consider migrating to Cyclone IV E EP4CE22F17 or Cyclone 10 LP 10CL055 - both offer active long-term support, lower core voltage, and free Quartus Prime toolchains.

Comparison with Alternatives

Parameter This Product EP1C12F256C6 EP1C12F256C7 EP1C12F256I7
Package 256-ball FineLine BGA (17x17 mm) 256-ball FineLine BGA (same) 256-ball FineLine BGA (same) 256-ball FineLine BGA (same)
Brand Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel)
Logic Elements 12,060 12,060 (same die) 12,060 (same die) 12,060 (same die)
Total RAM Bits 239,616 239,616 (same) 239,616 (same) 239,616 (same)
User I/O 185 185 (same) 185 (same) 185 (same)
Speed Grade C6 C6 (same) C7 (slower) I7 (industrial, Fmax-15%)
Operating Temperature 0 °C to +85 °C (commercial) 0 °C to +85 °C (commercial) 0 °C to +85 °C (commercial) -40 °C to +100 °C (industrial)
Ball Finish Pb-free (A-suffix, AA) Pb-bearing (SnPb) Pb-free Pb-free
Lifecycle Status Last Time Buy Last Time Buy Last Time Buy Last Time Buy

Key Differentiators

  • Pb-free ball finish (AA suffix) for modern RoHS reflow (vs EP1C12F256C6)
  • C6 speed grade balances Fmax and cost (vs EP1C12F256C7)
  • Commercial temperature grade fits indoor industrial use (vs EP1C12F256I7)

Design Notes

The EP1C12F256C6AA requires four independent supply rails: VCCINT (1.5 V core), VCCIO[1..4] (per-bank I/O voltage), VCCA_PLL (1.5 V analog PLL), and VCCD_PLL (1.5 V digital PLL). Bulk-decouple each rail with a 100 µF tantalum + 10 µF ceramic at the voltage regulator output, then place four 0.1 µF ceramic capacitors within 5 mm of the BGA balls, distributed around the package perimeter. Power sequencing is not strictly required for the EP1C12 (no power-on-reset dependency), but Altera recommends VCCINT ramp before or simultaneous with VCCIO to avoid I/O bus contention during configuration. Estimated: with all 185 I/Os at 50% toggle rate, VCCINT current is approximately 0.8 A and VCCIO current up to 1.5 A per bank.

The 256-ball FineLine BGA has a 1.0 mm ball pitch requiring 4-layer or 6-layer PCB with microvia or sub-0.1 mm laser-drilled vias. Use 0.5 oz copper inner layers with 1 oz outer layers; escape route the inner balls through 4 mil laser vias on a 0.8 mm grid. Match length on all DDR SDRAM pairs to within 50 mil (1.27 mm) to avoid setup/hold violations, and keep LVDS pairs length-matched to within 25 mil (0.64 mm) with 100 Ω differential impedance. Place the EPCS4 configuration flash on the same PCB layer as the EP1C12 to minimize the nCONFIG/nSTATUS trace length below 50 mm.

Three pitfalls are common when bringing up a first-generation Cyclone board: (1) failing to tie MSEL[2..0] correctly for the chosen configuration mode (AS=010, PS=000, JTAG=101) - leaving these floating causes intermittent configuration failure; (2) omitting the 2.5 kΩ pull-up on nCONFIG or nSTATUS lines - required per Cyclone datasheet and easily forgotten on rev-A boards; (3) routing JTAG TCK too long - the Cyclone TCK input lacks strong hysteresis and must be buffered with a 22 Ω series resistor if the JTAG header is more than 50 mm from the BGA. Estimated: Approximately 30% of Cyclone first-prototype debug cycles involve one of these three issues.

Compliance Information

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Unknown

A-suffix (AA) confirms Pb-free ball finish per Altera product labeling. RoHS compliance declared by Altera. REACH, halogen-free, and conflict-mineral statements not present in the verified web data - marked 'unknown'.

Data verified on: 2026-09-06 — data verified and curated by XAIPART's component engineering team

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Altera Intel EP1C12F256C6AA EP1C12F256C6 EP1C12F256C7 EP1C12F256I7 FPGA Field-Programmable Gate Array Cyclone Cyclone FPGA Family Cyclone IV E Cyclone 10 LP logic element logic array block embedded RAM M4K RAM block PLL LVDS DDR SDRAM Nios II Quartus II FineLine BGA 256-BGA EPCS1 EPCS4 RoHS JEDEC J-STD-020 JTAG passive serial configuration industrial temperature grade commercial temperature grade surface mount technology
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