EP1S10B672C7 - Stratix 10570 LEs FPGA, 672-BGA | Intel
MPN: EP1S10B672C7 ⚠ Lần mua cuốiEP1S10B672C7 Tóm tắt
An FPGA (Field Programmable Gate Array) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware blocks such as block RAM (BRAM), DSP multipliers, PLLs, and high-speed transceivers. FPGAs sit alongside microcontrollers, DSPs, and ASICs in the broader programmable logic hierarchy (CPLD -> small FPGA -> mid-density FPGA -> high-end SoC FPGA) and are used when designers need parallelism, hardware-accelerated DSP, or custom I/O protocols that off-the-shelf processors cannot deliver.
Key features of the EP1S10B672C7 include up to 10,570 logic elements, 920 Kbits of embedded memory distributed across TriMatrix blocks (MRAM/M4K), DSP blocks supporting 8-bit to 36-bit word widths, up to 426 MHz internal clock operation, and flexible I/O supporting LVDS, SSTL, and LVTTL standards. The Stratix architecture also provides dedicated high-speed serial interfaces (Stratix GX option) and on-chip PLLs for clock management, making it suitable for high-bandwidth pipeline designs.
From an architecture standpoint, Stratix devices employ a multi-level routing hierarchy combined with LUT-based logic and embedded multiplier blocks. The 672-ball BGA package exposes the full I/O count of this die, allowing dense PCB integration. Commercial temperature grade and speed grade 7 place this part in a balanced performance-and-cost tier relative to the speed-grade 8 and industrial-temperature variants.
Typical applications include telecommunications baseband processing, high-speed data acquisition, ASIC prototyping, software-defined radio (SDR), industrial control and imaging, and digital signal processing pipelines such as FFT engines and video codecs. The combination of abundant BRAM and DSP blocks particularly suits parallel DSP workloads where multiple MAC operations per clock cycle are required.
When designing with this device, pay close attention to power estimation (Altera's PowerPlay Early Power Estimator is recommended pre-layout), signal integrity on the 1.27 mm-pitch BGA, and JTAG-driven configuration using EPC or enhanced-configuration devices. Thermal management at full clock rate with high toggle activity is essential since the commercial grade is rated only to 85 °C ambient.
This page synthesizes distributor pricing, drop-in Stratix-family alternatives, and practical Stratix design notes not found in a single source on the manufacturer datasheet.
Bộ thay thế dễ dàng lắp đặt cho EP1S10B672C7 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP1S10B672C7 (cùng hình factor và footprint) — khác nhau ở Operating Temperature, DSP Blocks, Package, Process Technology, Configuration Method.
EP1S10B672C6
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1S10B672C8
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
EP1S10B672C7 Tỷ lệ tối đa & tính chất điện
| Manufacturer | Intel (formerly Altera) |
| Series | Stratix |
| Logic Elements | 10,570 |
| Embedded Memory (Total) | 920 Kbits |
| DSP Blocks | Yes (DSP multiplier blocks) |
| Process Technology | 0.13 µm CMOS |
| Supply Voltage (Core) | 1.5 V |
| Package Type | 672-ball FineLine BGA |
| Package Dimensions | 35 x 35 mm |
| Ball Pitch | 1.27 mm |
| Logic Family | CMOS |
| Nhiệt độ hoạt động | 0 °C to 85 °C (Commercial) |
| Temperature Grade | Commercial (C) |
| Speed Grade | 7 |
| Configuration Method | JTAG / EPC serial configuration |
| Kiểu lắp đặt | Surface Mount |
Hướng dẫn cấu hình chân EP1S10B672C7 35 x 35 mm
Cấu hình chân cho EP1S10B672C7 (35 x 35 mm gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EP1S10B672C7.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EP1S10B672C7 phù hợp cho 8 Áp dụngs: Telecommunications Baseband Processing, High-Speed Data Acquisition, ASIC Prototyping and Emulation, Software-Defined Radio (SDR), Industrial Control and Machine Vision, Video Processing and Compression Pipelines, Aerospace Test and Measurement Instrumentation, Medical Imaging Front-End Processing.
Telecommunications Baseband Processing
The EP1S10B672C7 fits telecommunications baseband processing because its 10,570 logic elements and dedicated DSP blocks deliver the parallel arithmetic required for channel decoding, scrambling, and modulation pipelines. The 920 Kbits of TriMatrix BRAM provides on-chip buffering for de-interleaving and rate matching without external SRAM, reducing PCB complexity. Designers typically implement Turbo or Viterbi decoders with multiple MAC operations per clock cycle, leveraging the Stratix DSP blocks' 36-bit signed multipliers. The 672-BGA package exposes abundant user I/O for multi-Ant digital front-end interfaces, while the 1.5 V core and 3.3 V I/O allow direct connection to standard telecom DAC/ADC devices.
Được đề xuất
High-Speed Data Acquisition
The EP1S10B672C7 is a strong fit for high-speed data acquisition because its LVDS I/O capability and parallel BRAM structure handle multi-channel ADC streams at hundreds of MSPS. The Stratix architecture allows designers to instantiate per-channel FIFOs directly in M4K/MRAM blocks, then stream the buffered data into PCI or external memory through high-speed LVDS lanes. With 920 Kbits of embedded memory, the device can buffer several thousand samples per channel at full ADC clock rate before backpressure, while the DSP blocks implement real-time downsampling or digital filtering. Commercial temperature grade is acceptable for indoor laboratory or industrial cabinet installations.
Được đề xuất
ASIC Prototyping and Emulation
For ASIC prototyping, the EP1S10B672C7's 10,570 logic elements combined with 920 Kbits of block RAM provide a meaningful slice of silicon for emulating medium-complexity ASIC subsystems before tape-out. Engineers map gate-level netlists to the Stratix fabric using Quartus II and partition the design across multiple FPGAs when capacity is exceeded. The DSP blocks emulate signal-processing ASIC blocks, while JTAG-based configuration supports iterative debugging with readback. Compared to ASIC cycles measured in months, Stratix-based prototyping cuts bring-up to days, with the caveat that designers must add timing margins to account for FPGA fabric overhead versus true ASIC gate delays.
Được đề xuất
Software-Defined Radio (SDR)
Software-defined radio benefits from the EP1S10B672C7 because the Stratix DSP blocks implement FFTs, digital down-conversion, and channelization filters at line rate. The 36-bit signed multipliers inside the DSP blocks allow high dynamic range fixed-point processing suitable for IF sampling chains, while the 920 Kbits of BRAM hold windowing coefficients and overlap-save buffers. The 672-BGA package's flexible I/O pins support multiple ADC/DAC interfaces and LVDS data paths simultaneously, enabling multi-antenna MIMO front-ends on a single device. Commercial temperature grade is appropriate for indoor SDR testbeds and lab instrumentation.
Được đề xuất
Industrial Control and Machine Vision
The EP1S10B672C7 fits industrial machine vision because its parallel fabric processes multiple camera streams simultaneously while its DSP blocks perform edge detection, convolution, and feature extraction in real time. The 672-ball BGA exposes enough user I/O to interface with several Camera Link or LVDS-based imagers concurrently, with the embedded TriMatrix memory acting as line buffers and frame stores. Designers build deterministic state machines for camera synchronization and illumination control directly in the FPGA fabric. With 0 °C to 85 °C commercial temperature range, the part fits enclosed control cabinets and factory-floor installations.
Được đề xuất
Video Processing and Compression Pipelines
The EP1S10B672C7 supports video compression pipelines because the parallel DSP blocks and BRAM can implement motion estimation, DCT/IDCT, and deblocking filters at multi-megapixel resolutions. The 10,570 logic elements allow simultaneous implementation of multiple video processing blocks (scaler, deinterlacer, encoder) on a single device. The 920 Kbits of block RAM hold reference frame slices, quantization tables, and intermediate pixel buffers without external memory pressure. Designers targeting H.264 baseline or MPEG-2 codec acceleration benefit from the Stratix DSP block chain depth, with the 1.5 V core delivering reasonable power-per-MAC efficiency versus general-purpose processors.
Được đề xuất
Aerospace Test and Measurement Instrumentation
The EP1S10B672C7 fits aerospace test instrumentation because the parallel fabric and DSP blocks enable real-time FFT spectrum analysis, channelization, and telemetry decoding across wide IF bandwidths. Engineers leverage the 36-bit signed multipliers for high dynamic range numeric stability required when measuring low-level signals in noisy environments. The 672-BGA's I/O density accommodates multi-channel ADC arrays and synchronization triggers needed in phased-array testbeds. While commercial temperature grade suits indoor lab use, designers targeting flight-qualified hardware should evaluate the industrial EP1S10B672I7 variant instead.
Được đề xuất
Medical Imaging Front-End Processing
The EP1S10B672C7 supports medical imaging front-end processing because its DSP blocks accelerate beamforming, image reconstruction, and filtering for ultrasound or CT systems. The Stratix TriMatrix memory provides low-latency line buffers for raw transducer data at rates exceeding 200 MHz, while the 10,570 logic elements run the control state machines for transmit/receive sequencing. The 672-BGA's high I/O count accommodates parallel ADC channels from transducer arrays. Commercial temperature grade suits diagnostic equipment installed in climate-controlled clinical environments, with deterministic real-time behavior unmatched by general-purpose processors.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP1S10B672C7 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP1S10B672C6 | EP1S10B672C8 |
|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-ball BGA (35x35 mm, 1.27 mm pitch) | 672-ball BGA (35x35 mm, 1.27 mm pitch) | 672-ball BGA (35x35 mm, 1.27 mm pitch) |
| Family | Stratix | Stratix | Stratix |
| Logic Elements | 10,570 | 10,570 | 10,570 |
| Embedded Memory | 920 Kbits | 920 Kbits | 920 Kbits |
| Speed Grade | 7 | 6 | 8 |
| Temperature Grade | Commercial (0 to 85 C) | Commercial (0 to 85 C) | Commercial (0 to 85 C) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V |
| Process | 0.13 µm CMOS | 0.13 µm CMOS | 0.13 µm CMOS |
Bảo phân biệt quan trọng
- Drop-in same-die speed-grade flexibility (vsEP1S10B672C6 / EP1S10B672C8)
- High on-chip memory density for the Stratix generation (vsCyclone III EP3C16 (Cyclone family))
- Dedicated DSP blocks at 36-bit signed precision (vsStratix GX serial-interface variants)
Ghi chú thiết kế
Estimated: At full toggle activity across the Stratix fabric (typical ~30-40% utilization at 250 MHz core clock), the EP1S10B672C7 dissipates roughly 4-6 W from the 1.5 V core plus additional I/O power. The 35 x 35 mm 672-BGA exposes a moderate thermal pad arrangement; designers should provide at least 4-6 thermal vias under the center ball grid and copper pours on inner layers to keep the junction below 100 °C. Because the commercial temperature grade caps ambient at 85 °C, even a small margin loss from inadequate cooling forces a downgrade to industrial-grade silicon.
The 1.27 mm-pitch 672-BGA requires a multilayer PCB (typically 8-12 layers) with microvia or via-in-pad technology for reliable assembly. According to the Stratix Device Family Data Sheet, all VCCINT and VCCIO pins must be decoupled locally with a 0.1 µF ceramic cap within 100 mil of each pin group, plus bulk decoupling on the PCB. Reference planes must be continuous under the BGA escape region to maintain controlled impedance for LVDS/SSTL signals.
A common design pitfall is treating the EP1S10B672C7 as drop-in compatible with Stratix II (EP2S) or Cyclone III devices. While some packages overlap, the I/O standards, configuration bitstream format, and supply voltage sequencing differ between families. Also, the nCONFIG and nSTATUS pins require correct pull-up values and the configuration clock (DCLK) trace must be length-matched. Designers should always validate the configuration timing using Quartus II's Configuration Simulator before committing to layout.
Estimated: LVDS signals on the EP1S10B672C7 require 100 Ω differential impedance with length matching within ±10 mil for clock-to-data pairs. SSTL-II memory interfaces typically operate at 3.3 V VCCIO and need Class II termination networks. According to Altera's Stratix I/O literature, slew rate and current strength settings (Quartus II Assignment Editor) must be tuned post-layout to suppress reflections on heavily loaded buses, particularly when interfacing with DDR SDRAM at 200 MHz+ data rates.
Thông tin tuân thủ
RoHS, REACH, lead-free, and halogen-free status for the EP1S10B672C7 were not present in the Verified Web Data; marked as 'unknown' rather than fabricated. AEC-Q100 is not applicable since this is an FPGA, not an automotive-grade IC. Designers should request the latest material declaration directly from Intel/Altera for compliance documentation.