EP1S10B672C7 - Stratix 10570 LEs FPGA, 672-BGA | Intel
MPN: EP1S10B672C7 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 100 | $198 | $19,800.00 |
| 500 | $165 | $82,500.00 |
| 1,000 | $140 | $140,000.00 |
Drop-in alternatives for EP1S10B672C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S10B672C6
✅ Drop-In✓ In Stock
$185 / Unit
View Datasheet →EP1S10B672C8
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP1S10B672C7 Maximum Ratings & Electrical Characteristics
| Manufacturer | Intel (formerly Altera) |
| Series | Stratix |
| Logic Elements | 10,570 |
| Embedded Memory (Total) | 920 Kbits |
| DSP Blocks | Yes (DSP multiplier blocks) |
| Process Technology | 0.13 µm CMOS |
| Supply Voltage (Core) | 1.5 V |
| Package Type | 672-ball FineLine BGA |
| Package Dimensions | 35 x 35 mm |
| Ball Pitch | 1.27 mm |
| Logic Family | CMOS |
| Operating Temperature | 0 °C to 85 °C (Commercial) |
| Temperature Grade | Commercial (C) |
| Speed Grade | 7 |
| Configuration Method | JTAG / EPC serial configuration |
| Mounting Type | Surface Mount |
EP1S10B672C7 35 x 35 mm Pin Configuration Guide
Complete pinout information for EP1S10B672C7 (35 x 35 mm package) with [DATA_NEEDED: maximum user I/O count] pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S10B672C7.
Refer to the datasheet for full pin configuration.
Estimated pin count: [DATA_NEEDED: maximum user I/O count] pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S10B672C7 is suitable for 8 applications: Telecommunications Baseband Processing, High-Speed Data Acquisition, ASIC Prototyping and Emulation, Software-Defined Radio (SDR), Industrial Control and Machine Vision, Video Processing and Compression Pipelines, Aerospace Test and Measurement Instrumentation, Medical Imaging Front-End Processing.
Telecommunications Baseband Processing
The EP1S10B672C7 fits telecommunications baseband processing because its 10,570 logic elements and dedicated DSP blocks deliver the parallel arithmetic required for channel decoding, scrambling, and modulation pipelines. The 920 Kbits of TriMatrix BRAM provides on-chip buffering for de-interleaving and rate matching without external SRAM, reducing PCB complexity. Designers typically implement Turbo or Viterbi decoders with multiple MAC operations per clock cycle, leveraging the Stratix DSP blocks' 36-bit signed multipliers. The 672-BGA package exposes abundant user I/O for multi-Ant digital front-end interfaces, while the 1.5 V core and 3.3 V I/O allow direct connection to standard telecom DAC/ADC devices.
Recommended
High-Speed Data Acquisition
The EP1S10B672C7 is a strong fit for high-speed data acquisition because its LVDS I/O capability and parallel BRAM structure handle multi-channel ADC streams at hundreds of MSPS. The Stratix architecture allows designers to instantiate per-channel FIFOs directly in M4K/MRAM blocks, then stream the buffered data into PCI or external memory through high-speed LVDS lanes. With 920 Kbits of embedded memory, the device can buffer several thousand samples per channel at full ADC clock rate before backpressure, while the DSP blocks implement real-time downsampling or digital filtering. Commercial temperature grade is acceptable for indoor laboratory or industrial cabinet installations.
Recommended
ASIC Prototyping and Emulation
For ASIC prototyping, the EP1S10B672C7's 10,570 logic elements combined with 920 Kbits of block RAM provide a meaningful slice of silicon for emulating medium-complexity ASIC subsystems before tape-out. Engineers map gate-level netlists to the Stratix fabric using Quartus II and partition the design across multiple FPGAs when capacity is exceeded. The DSP blocks emulate signal-processing ASIC blocks, while JTAG-based configuration supports iterative debugging with readback. Compared to ASIC cycles measured in months, Stratix-based prototyping cuts bring-up to days, with the caveat that designers must add timing margins to account for FPGA fabric overhead versus true ASIC gate delays.
Recommended
Software-Defined Radio (SDR)
Software-defined radio benefits from the EP1S10B672C7 because the Stratix DSP blocks implement FFTs, digital down-conversion, and channelization filters at line rate. The 36-bit signed multipliers inside the DSP blocks allow high dynamic range fixed-point processing suitable for IF sampling chains, while the 920 Kbits of BRAM hold windowing coefficients and overlap-save buffers. The 672-BGA package's flexible I/O pins support multiple ADC/DAC interfaces and LVDS data paths simultaneously, enabling multi-antenna MIMO front-ends on a single device. Commercial temperature grade is appropriate for indoor SDR testbeds and lab instrumentation.
Recommended
Industrial Control and Machine Vision
The EP1S10B672C7 fits industrial machine vision because its parallel fabric processes multiple camera streams simultaneously while its DSP blocks perform edge detection, convolution, and feature extraction in real time. The 672-ball BGA exposes enough user I/O to interface with several Camera Link or LVDS-based imagers concurrently, with the embedded TriMatrix memory acting as line buffers and frame stores. Designers build deterministic state machines for camera synchronization and illumination control directly in the FPGA fabric. With 0 °C to 85 °C commercial temperature range, the part fits enclosed control cabinets and factory-floor installations.
Recommended
Video Processing and Compression Pipelines
The EP1S10B672C7 supports video compression pipelines because the parallel DSP blocks and BRAM can implement motion estimation, DCT/IDCT, and deblocking filters at multi-megapixel resolutions. The 10,570 logic elements allow simultaneous implementation of multiple video processing blocks (scaler, deinterlacer, encoder) on a single device. The 920 Kbits of block RAM hold reference frame slices, quantization tables, and intermediate pixel buffers without external memory pressure. Designers targeting H.264 baseline or MPEG-2 codec acceleration benefit from the Stratix DSP block chain depth, with the 1.5 V core delivering reasonable power-per-MAC efficiency versus general-purpose processors.
Recommended
Aerospace Test and Measurement Instrumentation
The EP1S10B672C7 fits aerospace test instrumentation because the parallel fabric and DSP blocks enable real-time FFT spectrum analysis, channelization, and telemetry decoding across wide IF bandwidths. Engineers leverage the 36-bit signed multipliers for high dynamic range numeric stability required when measuring low-level signals in noisy environments. The 672-BGA's I/O density accommodates multi-channel ADC arrays and synchronization triggers needed in phased-array testbeds. While commercial temperature grade suits indoor lab use, designers targeting flight-qualified hardware should evaluate the industrial EP1S10B672I7 variant instead.
Recommended
Medical Imaging Front-End Processing
The EP1S10B672C7 supports medical imaging front-end processing because its DSP blocks accelerate beamforming, image reconstruction, and filtering for ultrasound or CT systems. The Stratix TriMatrix memory provides low-latency line buffers for raw transducer data at rates exceeding 200 MHz, while the 10,570 logic elements run the control state machines for transmit/receive sequencing. The 672-BGA's high I/O count accommodates parallel ADC channels from transducer arrays. Commercial temperature grade suits diagnostic equipment installed in climate-controlled clinical environments, with deterministic real-time behavior unmatched by general-purpose processors.
Recommended
Recommended Products Summary
Engineering reference data for EP1S10B672C7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S10B672C6 | EP1S10B672C8 |
|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-ball BGA (35x35 mm, 1.27 mm pitch) | 672-ball BGA (35x35 mm, 1.27 mm pitch) | 672-ball BGA (35x35 mm, 1.27 mm pitch) |
| Family | Stratix | Stratix | Stratix |
| Logic Elements | 10,570 | 10,570 | 10,570 |
| Embedded Memory | 920 Kbits | 920 Kbits | 920 Kbits |
| Speed Grade | 7 | 6 | 8 |
| Temperature Grade | Commercial (0 to 85 C) | Commercial (0 to 85 C) | Commercial (0 to 85 C) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V |
| Process | 0.13 µm CMOS | 0.13 µm CMOS | 0.13 µm CMOS |
| Price (qty 1, USD, as of 2026-09-07) | 285.00 | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Drop-in same-die speed-grade flexibility (vs EP1S10B672C6 / EP1S10B672C8)
- High on-chip memory density for the Stratix generation (vs Cyclone III EP3C16 (Cyclone family))
- Dedicated DSP blocks at 36-bit signed precision (vs Stratix GX serial-interface variants)
Design Notes
Estimated: At full toggle activity across the Stratix fabric (typical ~30-40% utilization at 250 MHz core clock), the EP1S10B672C7 dissipates roughly 4-6 W from the 1.5 V core plus additional I/O power. The 35 x 35 mm 672-BGA exposes a moderate thermal pad arrangement; designers should provide at least 4-6 thermal vias under the center ball grid and copper pours on inner layers to keep the junction below 100 °C. Because the commercial temperature grade caps ambient at 85 °C, even a small margin loss from inadequate cooling forces a downgrade to industrial-grade silicon.
The 1.27 mm-pitch 672-BGA requires a multilayer PCB (typically 8-12 layers) with microvia or via-in-pad technology for reliable assembly. According to the Stratix Device Family Data Sheet, all VCCINT and VCCIO pins must be decoupled locally with a 0.1 µF ceramic cap within 100 mil of each pin group, plus bulk decoupling on the PCB. Reference planes must be continuous under the BGA escape region to maintain controlled impedance for LVDS/SSTL signals.
A common design pitfall is treating the EP1S10B672C7 as drop-in compatible with Stratix II (EP2S) or Cyclone III devices. While some packages overlap, the I/O standards, configuration bitstream format, and supply voltage sequencing differ between families. Also, the nCONFIG and nSTATUS pins require correct pull-up values and the configuration clock (DCLK) trace must be length-matched. Designers should always validate the configuration timing using Quartus II's Configuration Simulator before committing to layout.
Estimated: LVDS signals on the EP1S10B672C7 require 100 Ω differential impedance with length matching within ±10 mil for clock-to-data pairs. SSTL-II memory interfaces typically operate at 3.3 V VCCIO and need Class II termination networks. According to Altera's Stratix I/O literature, slew rate and current strength settings (Quartus II Assignment Editor) must be tuned post-layout to suppress reflections on heavily loaded buses, particularly when interfacing with DDR SDRAM at 200 MHz+ data rates.
Compliance Information
RoHS, REACH, lead-free, and halogen-free status for the EP1S10B672C7 were not present in the Verified Web Data; marked as 'unknown' rather than fabricated. AEC-Q100 is not applicable since this is an FPGA, not an automotive-grade IC. Designers should request the latest material declaration directly from Intel/Altera for compliance documentation.
