EP1S10B672C6 - Stratix 10,570 LEs FPGA 672-BGA | Intel / Altera
MPN: EP1S10B672C6 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $299.12 | $299.12 |
| 10 | $275 | $2,750.00 |
| 100 | $240 | $24,000.00 |
| 500 | $210 | $105,000.00 |
| 1,000 | $185 | $185,000.00 |
Drop-in alternatives for EP1S10B672C6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S10F672C7N
✅ Drop-In✓ In Stock
$171 / Unit
View Datasheet →EP1S10F672C6N
✅ Drop-In📋 Reference alternative (not in catalog)
EP1S10F672I6N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP1S10B672C7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$67.9 / Unit
View Datasheet →EP1S10B672I6
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP1S10B672C7
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$140 / Unit
View Datasheet →EP1S10B672C6 Maximum Ratings & Electrical Characteristics
| Manufacturer | Intel / Altera |
| Series | Stratix |
| Logic Elements / Cells | 10,570 |
| LABs / CLBs | 1,057 |
| User I/Os | 345 |
| Package | 672-BBGA (35 x 35 mm, 1.27 mm pitch) |
| Supply Voltage (Core) | 1.5 V (1.425 V - 1.575 V) |
| Process Technology | 130 nm CMOS |
| Maximum Operating Frequency | 450.05 MHz |
| Operating Temperature | 0 C to 85 C (Commercial Extended) |
| Logic Family | CMOS |
| Mounting Type | Surface Mount (BGA) |
| Supplier Device Package | 672-BGA |
| Memory | Embedded TriMatrix (MRAM/M4K) blocks |
| DSP Blocks | Yes, dedicated multiply-accumulate blocks |
| Clock Management | PLLs for clock synthesis |
| Configuration | JTAG / passive serial / fast passive parallel |
| RoHS Status | Compliant |
EP1S10B672C6 672-bga Pin Configuration Guide
Complete pinout information for EP1S10B672C6 (672-bga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S10B672C6.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S10B672C6 is suitable for 7 applications: Telecom Line-Card Interface Logic, DSP Co-Processor for Video Processing, Industrial Control and Factory Automation, DDR SDRAM Memory Controller Bridge, PCI / PCI-X Bus Bridge, Aerospace and Defense Legacy Systems, High-Speed Custom Test Equipment.
Telecom Line-Card Interface Logic
The EP1S10B672C6 fits telecom line-card interface logic because its 10,570 logic elements and 345 user I/Os provide ample capacity for backplane bridges, framer interfaces, and serializer/deserializer glue logic. The Stratix family's embedded TriMatrix memory supports packet buffer FIFOs up to 512 Kbits per M4K block, while dedicated DSP blocks accelerate Reed-Solomon and CRC operations. Compared with ASIC alternatives, this FPGA enables field reprogrammability for protocol updates (POS-PHY, Utopia, SPI-4.2) without respin.
Recommended
DSP Co-Processor for Video Processing
With its dedicated DSP blocks optimized for multiply-accumulate operations, the EP1S10B672C6 suits DSP co-processing in video broadcast and image processing systems. At 450 MHz fabric speed, the device can sustain hundreds of MMACs per second, sufficient for SD/HD video scaling, deinterlacing, and color-space conversion. The 345 I/Os handle parallel video buses (BT.656, BT.1120) and DDR SDRAM interfaces, with on-chip TriMatrix memory acting as line buffers.
Recommended
Industrial Control and Factory Automation
The EP1S10B672C6's 345 I/Os and commercial-extended temperature range (0-85 C) make it suitable for industrial control PLCs, motor-drive controllers, and factory automation fabrics. The 1.5 V core with 130 nm process provides reliable operation in control cabinet environments, while BGA package ensures mechanical robustness against vibration. Engineers typically implement custom protocols (EtherCAT, Profinet) and deterministic timing using the on-chip PLLs.
Recommended
DDR SDRAM Memory Controller Bridge
The Stratix family's dedicated DDR SDRAM controllers and 345 I/Os make the EP1S10B672C6 a natural fit as a memory bridge between legacy processors and DDR1/DDR2 SDRAM. The 1.5 V core matches DDR memory voltage requirements, simplifying power design, while abundant I/O banks support 32/64-bit memory interfaces with parity/ECC. TriMatrix memory blocks store address-translation tables for processor-memory mapping.
Recommended
PCI / PCI-X Bus Bridge
The 672-BGA variant of the EP1S10B672C6 with its abundant I/O count and embedded memory is widely deployed as a PCI/PCI-X bridge in workstation and server mainboards. The fabric implements 32-bit/64-bit PCI-X 133 MHz interfaces with built-in transaction-layer logic, while on-chip TriMatrix buffers write posting queues. BGA package ensures signal integrity at 133 MHz bus speeds.
Recommended
Aerospace and Defense Legacy Systems
The EP1S10B672C6 remains in service across aerospace and defense platforms where formal qualification of the original part makes redesign prohibitive. Its 1.5 V core, commercial-extended temperature range, and BGA robustness suit avionics databuses, radar signal pre-processing, and military comms encryption engines. Long-term supply via Rochester Electronics ensures availability for multi-decade support windows typical in defense programs.
Recommended
High-Speed Custom Test Equipment
Test and measurement equipment including logic analyzers, protocol exercisers, and bit-error-rate testers leverage the EP1S10B672C6's 450 MHz fabric and abundant I/Os to generate and capture parallel data streams. Engineers implement custom pattern generators, BERT cores, and protocol-state machines in HDL, with the JTAG chain enabling rapid iteration. The BGA package's thermal performance supports continuous high-utilization operation.
Recommended
Recommended Products Summary
Engineering reference data for EP1S10B672C6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S10F672C7N | EP1S10F672C6N | EP1S10F672I6N | EP1S10B672C7N | EP1S10B672I6 | EP1S10B672C7 |
|---|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 672-BGA (35x35 mm) | 672-BGA - same | 672-BGA - same | 672-BGA - same | 672-BGA - same | 672-BGA - same | 672-BGA - same |
| Logic Elements | 10,570 | 10,570 - same | 10,570 - same | 10,570 - same | 10,570 - same | 10,570 - same | 10,570 - same |
| Speed Grade | -6 | -7 (faster) | -6 (same) | -6 (same) | -7 (faster) | -6 (same) | -7 (faster) |
| Operating Temperature | 0 C to 85 C (Commercial Extended) | 0 C to 85 C - same | 0 C to 85 C - same | -40 C to +100 C (Industrial) | 0 C to 85 C - same | -40 C to +100 C (Industrial) | 0 C to 85 C - same |
| User I/Os | 345 | 345 - same | 345 - same | 345 - same | 345 - same | 345 - same | 345 - same |
| Core Voltage | 1.5 V (1.425-1.575 V) | 1.5 V - same | 1.5 V - same | 1.5 V - same | 1.5 V - same | 1.5 V - same | 1.5 V - same |
| Maximum Frequency | 450.05 MHz | Higher Fmax (speed grade -7) | 450.05 MHz - same | 450.05 MHz - same | Higher Fmax (speed grade -7) | 450.05 MHz - same | Higher Fmax (speed grade -7) |
| Lifecycle Status | Obsolete (last-time-buy) | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Drop-in compatible with -7 speed grade variant for higher Fmax (vs EP1S10F672C7N)
- Commercial-extended temperature support within same Stratum die (vs EP1S10B672I6)
- 10,570 LEs in 672-BGA positions for highest-density Stratix-1 (vs EP1S10F484 (484-BGA variant))
- Long-term supply via Rochester Electronics for legacy support (vs Cyclone 10 LP (newer family))
Design Notes
Estimated: the Stratix EP1S10 core draws 0.5-1.5 W at typical toggle rates (15-30% utilization), with peak I/O bank current reaching 2-4 A during simultaneous switching. Provide at least four 0.1 uF + four 10 uF ceramic decoupling capacitors per VCCINT and VCCIO bank, plus a single 100 uF bulk capacitor per supply rail. PLL analog supplies (VCC_PLL) require additional pi-filter (ferrite + 10 uF + 0.1 uF) to minimize jitter. Estimated power assumes 25 C ambient and 200 MHz typical clock.
The 672-BGA package at 1.27 mm pitch demands controlled-impedance PCB routing (50 ohm single-ended, 100 ohm differential) and 4-6 layer stackup with continuous ground planes beneath the BGA. Escape routing of inner-row balls requires microvia or sequential lamination build-up; standard 8 mil via-in-pad may not suffice for all inner rows. Use X-ray inspection post-assembly to verify BGA joint integrity, especially on prototype builds.
Estimated: the 672-BGA package has theta_JA of approximately 15-20 C/W with a properly designed thermal via array (4-9 thermal vias under the die, 0.3 mm drill). At 2 W dissipation this yields a 40 C rise above ambient, well within the 85 C commercial-extended limit. For continuous high-utilization workloads (>4 W), add a copper heat spreader or forced-air cooling. Industrial-temperature variants (EP1S10B672I6) require derating curves beyond 70 C ambient.
Three common pitfalls when designing with the EP1S10B672C6: (1) incorrect MSEL pin configuration can prevent JTAG recognition - refer to the Stratix handbook Chapter 1 for the proper MSEL pull-up/pull-down scheme; (2) configuration data corruption from noisy power-up requires proper nCONFIG/nSTATUS sequencing; (3) confusing 'B' (commercial-extended temp) with 'I' (industrial temp) in the part number leads to out-of-spec operation in harsh environments - verify temperature grade carefully when sourcing.
The 672-BGA package at 1.27 mm pitch creates dense signal escape routing that requires careful stackup planning. Maintain 3W spacing rule (3x trace width) between adjacent high-speed signals to minimize crosstalk; use length matching within 50 mils for DDR SDRAM interfaces. Series-damping resistors (33 ohm) on clocks and high-speed bus lines reduce overshoot. Perform post-layout signal integrity simulation with the Quartus II IBIS models before committing to fabrication.
Compliance Information
RoHS compliance per Altera/Intel product page. AEC-Q100 not applicable - this is an FPGA, not an automotive-qualified IC. Industrial-temperature variants (EP1S10B672I6) extend operating range to -40 C to +100 C.
