EP1S30F780C8N - Stratix 32470 LEs FPGA, 597 I/O, 780-FBGA | Intel
MPN: EP1S30F780C8N ⚠ Lần mua cuốiEP1S30F780C8N Tóm tắt
A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated hard IP (memory, multipliers, transceivers, PLLs) on a single die. The Stratix family sits in the high-density, performance-oriented tier of FPGAs, above Cyclone (cost-optimized) and below the later Stratix II / Stratix III generations. EP1S30F780C8N specifically targets designers who need substantial on-chip RAM and rich DSP resources for DSP pipelines, communications baseband, and high-throughput data acquisition.
Key features for the EP1S30F780C8N include 32,470 LEs, 3,317,184 RAM bits organized as TriMatrix blocks, dedicated DSP blocks for multiply-accumulate operations, and 597 user I/O. The 780-ball FC-FBGA package provides high-density board interconnect while the 1.5 V core supply and 1.5 V/2.5 V/3.3 V I/O standards make the part straightforward to integrate with common SDRAM, SRAM, and LVCMOS/LVTTL peripherals. Configuration is supported via Altera's passive serial, fast passive parallel, passive parallel asynchronous, and JTAG modes.
Architecturally, the EP1S30F780C8N uses SRAM-based configuration cells with lookup-table (LUT)-based logic elements, carry chains for arithmetic, and dedicated routing. The embedded TriMatrix memory supports true dual-port, simple dual-port, and single-port RAM/ROM in various depths and widths, while DSP blocks provide hardware multipliers for filter and FFT structures. PLL blocks provide clock multiplication, division, and phase shifting for system timing.
Typical applications include telecom baseband processing, high-speed image and video pipelines, test-and-measurement instrumentation, DSP co-processing cards, and communications line cards. Designers commonly pair this device with external DDR SDRAM, Flash configuration memory, and high-speed ADCs/DACs. For new designs, designers are advised to evaluate Stratix II EP2S30 or Cyclone IV/MAX 10 families as modern alternatives because Stratix (original) is a mature generation.
Bộ thay thế dễ dàng lắp đặt cho EP1S30F780C8N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP1S30F780C8N (cùng hình factor và footprint) — khác nhau ở Package, Speed Grade, Operating Temperature, Process Technology, Series.
EP1S30F780C8
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Xem tài liệu →EP1S30F780C7N
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Xem tài liệu →EP1S30F780C6N
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Xem tài liệu →EP1S30F780C7
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Xem tài liệu →EP1S30F780C6GA
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Xem tài liệu →EP1S30F780C6
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Xem tài liệu →EP1S30F780C8N Tỷ lệ tối đa & tính chất điện
| Family | Stratix |
| Series | Stratix (EP1S) |
| Logic Elements (LEs) | 32,470 |
| Embedded Memory (RAM bits) | 3,317,184 |
| Total Memory Bits | 3,317,184 |
| User I/Os | 597 |
| LABs (Logic Array Blocks) | 3,247 |
| Process Technology | 130 nm CMOS |
| Supply Voltage (Core) | 1.5 V |
| Speed Grade | C8 (-8, faster bin) |
| Nhiệt độ hoạt động | 0 °C to +85 °C (Commercial) |
| Hộp | 780-ball FC-FBGA (FineLine BGA), 29 × 29 mm, 1 mm pitch |
| Kiểu lắp đặt | Surface Mount |
| Configuration | SRAM-based, JTAG / Passive Serial / Passive Parallel |
| Trạng thái RoHS | Compliant (per distributor listings) |
Hướng dẫn cấu hình chân EP1S30F780C8N 780-ball fc-fbga (fineline bga), 29 × 29 mm, 1 mm pitch
Cấu hình chân cho EP1S30F780C8N (780-ball fc-fbga (fineline bga), 29 × 29 mm, 1 mm pitch gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EP1S30F780C8N.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EP1S30F780C8N phù hợp cho 6 Áp dụngs: Telecom Baseband Processing, High-Speed Image and Video Pipelines, Test and Measurement Instrumentation, DSP Co-Processing Cards, Communications Line Cards, Industrial Control and Robotics Controllers.
Telecom Baseband Processing
The EP1S30F780C8N fits telecom baseband DSP cards because its 32,470 LEs, dedicated DSP blocks, and 3,317,184 bits of TriMatrix memory provide ample headroom for channel-card filters, FFTs, and symbol-rate processing. With 597 user I/Os in the 780-FBGA, designers can fan out to multiple external DDR SDRAM banks and high-speed serializers. The C8 speed grade maximizes Fmax on tight DSP timing paths where every percentage of headroom matters.
Được đề xuất
High-Speed Image and Video Pipelines
The 32,470 LEs plus 597 I/Os of the EP1S30F780C8N make it well-suited to image-acquisition and video-processing boards where multi-camera streams must be buffered, filtered, and passed to a host. TriMatrix memory in true dual-port mode supports line buffers and frame stores, while DSP blocks accelerate 2D convolution and color-space conversion. The C8 bin keeps critical paths fast enough for 1080p60 processing at common pixel-clock rates.
Được đề xuất
Test and Measurement Instrumentation
Test-equipment designers choose the EP1S30F780C8N for its large memory pool, abundant I/Os, and DSP blocks needed to implement arbitrary waveform generators, logic-analyzer state machines, and digital-down-conversion paths. The 780-FBGA footprint lets engineers route to many analog front-ends and high-speed ADCs/DACs without I/O bottlenecks. The C8 speed grade ensures deterministic timing for trigger logic and protocol decoding at hundreds of MHz.
Được đề xuất
DSP Co-Processing Cards
Co-processor PCIe or cPCI cards use the EP1S30F780C8N as a hardware accelerator alongside a host CPU or DSP. The device's DSP blocks deliver sustained GMACs for FIR/IIR filtering and matrix math, while the 3.3 Mbit of TriMatrix memory holds coefficients and intermediate results on-die. The 597 user I/Os allow direct interfacing to host bridges, external SRAM, and high-throughput LVDS links.
Được đề xuất
Communications Line Cards
In legacy line cards for SONET/SDH, Ethernet MAC, or proprietary backplane fabrics, the EP1S30F780C8N integrates framing logic, MAC/PHY glue, and protocol-translation functions into one device. Its 597 I/Os connect to multi-gigabit transceivers and backplane SERDES glue, while embedded memory buffers packets and cells. The C8 speed grade is appropriate for tight framing-clock and deskew paths at line rate.
Được đề xuất
Industrial Control and Robotics Controllers
Although specified for commercial 0-85 °C, the EP1S30F780C8N is used in factory-floor controllers where its logic density and DSP blocks handle multi-axis motion-control algorithms and machine-vision preprocessing. Industrial users can switch to the EP1S30F780I6 or I6N variant for the same design adapted to -40 to +100 °C environments. The 780-FBGA's high I/O count supports dozens of encoder, PWM, and Ethernet channels.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP1S30F780C8N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP1S30F780C8 | EP1S30F780C7N | EP1S30F780C6N | EP1S30F780C7 | EP1S30F780C6GA | EP1S30F780C6 |
|---|---|---|---|---|---|---|---|
| Package | 780-FBGA, 29 × 29 mm, 1 mm pitch | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Brand | Intel (formerly Altera) | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Family / Series | Stratix (EP1S) | Stratix (EP1S) | Stratix (EP1S) | Stratix (EP1S) | Stratix (EP1S) | Stratix (EP1S) | Stratix (EP1S) |
| Logic Elements | 32,470 LEs | 32,470 LEs | 32,470 LEs | 32,470 LEs | 32,470 LEs | 32,470 LEs | 32,470 LEs |
| Embedded RAM | 3,317,184 bits | 3,317,184 bits | 3,317,184 bits | 3,317,184 bits | 3,317,184 bits | 3,317,184 bits | 3,317,184 bits |
| User I/Os | 597 | 597 | 597 | 597 | 597 | 597 | 597 |
| Speed Grade | C8 (commercial, fast) | C8 | C7 (-1 bin) | C6 (-2 bins) | C7 (-1 bin) | C6 (-2 bins) | C6 (-2 bins) |
| Operating Temperature | 0 °C to +85 °C (commercial) | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Terminal Finish | Lead-free (N suffix) | Non-lead-free (no N) | Lead-free | Lead-free | Non-lead-free | Lead-free (GA suffix) | Non-lead-free |
Bảo phân biệt quan trọng
- C8 (fast) speed grade within the EP1S30 family (vsEP1S30F780C7N)
- Lead-free terminal finish (N suffix) (vsEP1S30F780C8)
- 32,470 LEs at C8 speed grade (vsEP1S30F780C6N)
- Commercial 0-85 °C temperature range (vsEP1S30F780I6)
Ghi chú thiết kế
Estimated: The 780-FBGA's 29 × 29 mm body has typical θJA in the 8-12 °C/W range with 8-layer PCB and adequate thermal via array under the package. For static Stratix designs at 1.5 V core drawing 1.5-3 A, junction-to-ambient rise typically stays under 30 °C with proper via stitching. Always check Stratix Device Family Data Sheet power-supply section and use the Quartus PowerPlay early power estimator before PCB layout.
Recommended: Use 0.8 mm or 1.0 mm PCB microvia stackups matched to the 1 mm BGA pitch. Power islands for VCCINT (1.5 V), VCCIO (1.5/1.8/2.5/3.3 V bank-dependent), and VCC_PLL should be decoupled with 0.1 µF and 10 µF ceramics within 100 mils of each supply pin. The 780-BGA requires 4+ PCB routing layers and a fanout-via array directly under the package - plan stackup before schematic capture.
Critical: Do not substitute an EP1S30F780I6 (industrial) or EP1S25F780 (lower density) part on the same PCB footprint as EP1S30F780C8N without revalidating pinout and current draw - all share the 780-FBGA but I/O count and current differ. Configuration mode pins (MSEL[0..3]) must be tied per the datasheet for the chosen configuration scheme (Passive Serial, Fast Passive Parallel, etc.). JTAG TCK should be series-terminated for long chains.
Recommended: For DDR SDRAM interfaces, follow Altera's external memory interface guidelines for the EP1S30 - place VTT termination at the midpoint of each data/strobe/clock net and use matched-length routing within 25 mils. LVDS pairs require 100 Ω differential impedance and matched-pair routing within 5 mils. Keep PLL power (VCC_PLL) quiet with a ferrite bead and isolated ground island.
Thông tin tuân thủ
RoHS compliance confirmed per distributor listings (Lisleapex, IC-Components). Lead-free finish indicated by the 'N' suffix per Altera ordering code. AEC-Q100 not applicable - this is a commercial-grade FPGA. Halogen-free status not explicitly stated in the verified web data.
