EP1S30F780C8N - Stratix 32470 LEs FPGA, 597 I/O, 780-FBGA | Intel
MPN: EP1S30F780C8N ⚠ آخر فرصة للشراءEP1S30F780C8N نظرة عامة
A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated hard IP (memory, multipliers, transceivers, PLLs) on a single die. The Stratix family sits in the high-density, performance-oriented tier of FPGAs, above Cyclone (cost-optimized) and below the later Stratix II / Stratix III generations. EP1S30F780C8N specifically targets designers who need substantial on-chip RAM and rich DSP resources for DSP pipelines, communications baseband, and high-throughput data acquisition.
Key features for the EP1S30F780C8N include 32,470 LEs, 3,317,184 RAM bits organized as TriMatrix blocks, dedicated DSP blocks for multiply-accumulate operations, and 597 user I/O. The 780-ball FC-FBGA package provides high-density board interconnect while the 1.5 V core supply and 1.5 V/2.5 V/3.3 V I/O standards make the part straightforward to integrate with common SDRAM, SRAM, and LVCMOS/LVTTL peripherals. Configuration is supported via Altera's passive serial, fast passive parallel, passive parallel asynchronous, and JTAG modes.
Architecturally, the EP1S30F780C8N uses SRAM-based configuration cells with lookup-table (LUT)-based logic elements, carry chains for arithmetic, and dedicated routing. The embedded TriMatrix memory supports true dual-port, simple dual-port, and single-port RAM/ROM in various depths and widths, while DSP blocks provide hardware multipliers for filter and FFT structures. PLL blocks provide clock multiplication, division, and phase shifting for system timing.
Typical applications include telecom baseband processing, high-speed image and video pipelines, test-and-measurement instrumentation, DSP co-processing cards, and communications line cards. Designers commonly pair this device with external DDR SDRAM, Flash configuration memory, and high-speed ADCs/DACs. For new designs, designers are advised to evaluate Stratix II EP2S30 or Cyclone IV/MAX 10 families as modern alternatives because Stratix (original) is a mature generation.
بدائل مباشرة لـ EP1S30F780C8N — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EP1S30F780C8N (نفس عامل الشكل والبصمة) — يختلف في Package, Speed Grade, Operating Temperature, Process Technology, Series.
EP1S30F780C8
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP1S30F780C7N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP1S30F780C6N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP1S30F780C7
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP1S30F780C6GA
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP1S30F780C6
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP1S30F780C8N الحدود القصوى والخصائص الكهربائية
| Family | Stratix |
| Series | Stratix (EP1S) |
| Logic Elements (LEs) | 32,470 |
| Embedded Memory (RAM bits) | 3,317,184 |
| Total Memory Bits | 3,317,184 |
| User I/Os | 597 |
| LABs (Logic Array Blocks) | 3,247 |
| Process Technology | 130 nm CMOS |
| Supply Voltage (Core) | 1.5 V |
| Speed Grade | C8 (-8, faster bin) |
| درجة حرارة التشغيل | 0 °C to +85 °C (Commercial) |
| العلبة | 780-ball FC-FBGA (FineLine BGA), 29 × 29 mm, 1 mm pitch |
| نوع التركيب | Surface Mount |
| Configuration | SRAM-based, JTAG / Passive Serial / Passive Parallel |
| حالة RoHS | Compliant (per distributor listings) |
دليل تكوين أطراف EP1S30F780C8N 780-ball fc-fbga (fineline bga), 29 × 29 mm, 1 mm pitch
تكوين الأطراف لـ EP1S30F780C8N (حزمة 780-ball fc-fbga (fineline bga), 29 × 29 mm, 1 mm pitch). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ EP1S30F780C8N.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
EP1S30F780C8N مناسب لـ 6 التطبيقs: Telecom Baseband Processing, High-Speed Image and Video Pipelines, Test and Measurement Instrumentation, DSP Co-Processing Cards, Communications Line Cards, Industrial Control and Robotics Controllers.
Telecom Baseband Processing
The EP1S30F780C8N fits telecom baseband DSP cards because its 32,470 LEs, dedicated DSP blocks, and 3,317,184 bits of TriMatrix memory provide ample headroom for channel-card filters, FFTs, and symbol-rate processing. With 597 user I/Os in the 780-FBGA, designers can fan out to multiple external DDR SDRAM banks and high-speed serializers. The C8 speed grade maximizes Fmax on tight DSP timing paths where every percentage of headroom matters.
موصى به
High-Speed Image and Video Pipelines
The 32,470 LEs plus 597 I/Os of the EP1S30F780C8N make it well-suited to image-acquisition and video-processing boards where multi-camera streams must be buffered, filtered, and passed to a host. TriMatrix memory in true dual-port mode supports line buffers and frame stores, while DSP blocks accelerate 2D convolution and color-space conversion. The C8 bin keeps critical paths fast enough for 1080p60 processing at common pixel-clock rates.
موصى به
Test and Measurement Instrumentation
Test-equipment designers choose the EP1S30F780C8N for its large memory pool, abundant I/Os, and DSP blocks needed to implement arbitrary waveform generators, logic-analyzer state machines, and digital-down-conversion paths. The 780-FBGA footprint lets engineers route to many analog front-ends and high-speed ADCs/DACs without I/O bottlenecks. The C8 speed grade ensures deterministic timing for trigger logic and protocol decoding at hundreds of MHz.
موصى به
DSP Co-Processing Cards
Co-processor PCIe or cPCI cards use the EP1S30F780C8N as a hardware accelerator alongside a host CPU or DSP. The device's DSP blocks deliver sustained GMACs for FIR/IIR filtering and matrix math, while the 3.3 Mbit of TriMatrix memory holds coefficients and intermediate results on-die. The 597 user I/Os allow direct interfacing to host bridges, external SRAM, and high-throughput LVDS links.
موصى به
Communications Line Cards
In legacy line cards for SONET/SDH, Ethernet MAC, or proprietary backplane fabrics, the EP1S30F780C8N integrates framing logic, MAC/PHY glue, and protocol-translation functions into one device. Its 597 I/Os connect to multi-gigabit transceivers and backplane SERDES glue, while embedded memory buffers packets and cells. The C8 speed grade is appropriate for tight framing-clock and deskew paths at line rate.
موصى به
Industrial Control and Robotics Controllers
Although specified for commercial 0-85 °C, the EP1S30F780C8N is used in factory-floor controllers where its logic density and DSP blocks handle multi-axis motion-control algorithms and machine-vision preprocessing. Industrial users can switch to the EP1S30F780I6 or I6N variant for the same design adapted to -40 to +100 °C environments. The 780-FBGA's high I/O count supports dozens of encoder, PWM, and Ethernet channels.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EP1S30F780C8N — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EP1S30F780C8 | EP1S30F780C7N | EP1S30F780C6N | EP1S30F780C7 | EP1S30F780C6GA | EP1S30F780C6 |
|---|---|---|---|---|---|---|---|
| Package | 780-FBGA, 29 × 29 mm, 1 mm pitch | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Brand | Intel (formerly Altera) | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Family / Series | Stratix (EP1S) | Stratix (EP1S) | Stratix (EP1S) | Stratix (EP1S) | Stratix (EP1S) | Stratix (EP1S) | Stratix (EP1S) |
| Logic Elements | 32,470 LEs | 32,470 LEs | 32,470 LEs | 32,470 LEs | 32,470 LEs | 32,470 LEs | 32,470 LEs |
| Embedded RAM | 3,317,184 bits | 3,317,184 bits | 3,317,184 bits | 3,317,184 bits | 3,317,184 bits | 3,317,184 bits | 3,317,184 bits |
| User I/Os | 597 | 597 | 597 | 597 | 597 | 597 | 597 |
| Speed Grade | C8 (commercial, fast) | C8 | C7 (-1 bin) | C6 (-2 bins) | C7 (-1 bin) | C6 (-2 bins) | C6 (-2 bins) |
| Operating Temperature | 0 °C to +85 °C (commercial) | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Terminal Finish | Lead-free (N suffix) | Non-lead-free (no N) | Lead-free | Lead-free | Non-lead-free | Lead-free (GA suffix) | Non-lead-free |
أبرز الفروقات
- C8 (fast) speed grade within the EP1S30 family (مقابلEP1S30F780C7N)
- Lead-free terminal finish (N suffix) (مقابلEP1S30F780C8)
- 32,470 LEs at C8 speed grade (مقابلEP1S30F780C6N)
- Commercial 0-85 °C temperature range (مقابلEP1S30F780I6)
ملاحظات التصميم
Estimated: The 780-FBGA's 29 × 29 mm body has typical θJA in the 8-12 °C/W range with 8-layer PCB and adequate thermal via array under the package. For static Stratix designs at 1.5 V core drawing 1.5-3 A, junction-to-ambient rise typically stays under 30 °C with proper via stitching. Always check Stratix Device Family Data Sheet power-supply section and use the Quartus PowerPlay early power estimator before PCB layout.
Recommended: Use 0.8 mm or 1.0 mm PCB microvia stackups matched to the 1 mm BGA pitch. Power islands for VCCINT (1.5 V), VCCIO (1.5/1.8/2.5/3.3 V bank-dependent), and VCC_PLL should be decoupled with 0.1 µF and 10 µF ceramics within 100 mils of each supply pin. The 780-BGA requires 4+ PCB routing layers and a fanout-via array directly under the package - plan stackup before schematic capture.
Critical: Do not substitute an EP1S30F780I6 (industrial) or EP1S25F780 (lower density) part on the same PCB footprint as EP1S30F780C8N without revalidating pinout and current draw - all share the 780-FBGA but I/O count and current differ. Configuration mode pins (MSEL[0..3]) must be tied per the datasheet for the chosen configuration scheme (Passive Serial, Fast Passive Parallel, etc.). JTAG TCK should be series-terminated for long chains.
Recommended: For DDR SDRAM interfaces, follow Altera's external memory interface guidelines for the EP1S30 - place VTT termination at the midpoint of each data/strobe/clock net and use matched-length routing within 25 mils. LVDS pairs require 100 Ω differential impedance and matched-pair routing within 5 mils. Keep PLL power (VCC_PLL) quiet with a ferrite bead and isolated ground island.
معلومات الامتثال
RoHS compliance confirmed per distributor listings (Lisleapex, IC-Components). Lead-free finish indicated by the 'N' suffix per Altera ordering code. AEC-Q100 not applicable - this is a commercial-grade FPGA. Halogen-free status not explicitly stated in the verified web data.
