EP1S40F1020I6AA - Stratix 40KLE FPGA 1020-BBGA | Intel
MPN: EP1S40F1020I6AA ⚠ Lần mua cuốiEP1S40F1020I6AA Tóm tắt
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device whose logic fabric is built from an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect. FPGAs sit above general-purpose microcontrollers in the embedded computing hierarchy: they deliver parallel processing performance in the hundreds of MHz range with deterministic latency, at the cost of higher unit price, larger package, and greater power consumption. Within Intel's FPGA portfolio, the Stratix family targets high-end ASIC-prototyping, communications infrastructure, and compute-acceleration designs.
Key specifications of the EP1S40F1020I6AA include 41,250 logic elements (LEs), 3,423,744 bits of embedded RAM (roughly 426 KB), 112 embedded 9-bit multipliers, support for external memory interfaces including DDR SDRAM, QDR SRAM, and FCRAM, and up to 12 clock pins with dedicated PLLs. The I6 speed grade designates a mid-speed bin optimized for 1.5 V core operation with industrial temperature range.
Architecturally, the Stratix family integrates TriMatrix embedded memory (three block sizes: MRAM, M4K, M-RAM), dedicated DSP blocks for fixed-point arithmetic, and high-speed transceivers on selected device variants. Configuration is loaded via passive serial, fast passive parallel, or JTAG modes using the dedicated configuration circuitry. The device is built on a 0.13-micron CMOS process and operates from a 1.5 V core supply with separate PLL analog and I/O bank voltages.
Typical applications include high-speed packet processing linecards, DSP co-processing, telecom cross-connect fabrics, ASIC prototyping, and high-bandwidth image processing systems. The high RAM-to-logic ratio also suits real-time data buffering for radar and test instrumentation.
When designing with this device, prioritize signal-integrity-aware PCB layout due to the 1020-ball BGA and dedicated high-speed transceiver routing requirements. Heisener lists 4,288 pieces in stock as of 2026-09-07, with distributor availability requiring quote-confirmation for lead time.
Bộ thay thế dễ dàng lắp đặt cho EP1S40F1020I6AA — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP1S40F1020I6AA (cùng hình factor và footprint) — khác nhau ở Package, RoHS Status, Mounting Type, Operating Temperature, Operating Temperature Range.
EP1S40F1020I6
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1S40F1020C6N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1S40F1020C7N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1S40F1020C7
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1S40F1020C6
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1S40F1020C5N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1S40F1020I6AA Tỷ lệ tối đa & tính chất điện
| Logic Elements | 41250 |
| Embedded Memory (RAM bits) | 3423744 |
| Number of User I/O Pins | 773 |
| Maximum User I/O Pins | 822 |
| Hộp | 1020-BBGA (FineLine BGA), 33 x 33 mm |
| Ball Pitch | 1.0 mm |
| Speed Grade | I6 |
| Khoảng nhiệt độ hoạt động | -40C to +85C (industrial) |
| Core Supply Voltage | 1.5 V |
| Logic Family | CMOS |
| Số lượng chân | 1020 |
| Series | Stratix |
| Kiểu bộ nhớ | TriMatrix (MRAM, M4K, M-RAM blocks) |
| Kiểu lắp đặt | Surface Mount |
Hướng dẫn cấu hình chân EP1S40F1020I6AA 1020-bbga (fineline bga), 33 x 33 mm
Cấu hình chân cho EP1S40F1020I6AA (1020-bbga (fineline bga), 33 x 33 mm gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EP1S40F1020I6AA.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EP1S40F1020I6AA phù hợp cho 6 Áp dụngs: Telecom Line-Card Packet Processing, ASIC Prototyping and Emulation, High-Bandwidth Image and Video Processing, Radar and Defense Signal Processing, Industrial Automation and Motor Control, Medical Imaging and Diagnostic Equipment.
Telecom Line-Card Packet Processing
The EP1S40F1020I6AA fits telecom line-card packet processing because it delivers 41,250 logic elements and 3,423,744 RAM bits at I6 industrial speed grade in a 1020-ball BGA that supports dense parallel datapaths. With 773 user I/Os the device can simultaneously drive multiple SFI/XFI links while buffering packets in embedded TriMatrix memory, eliminating external SSRAM in many flow-control designs. Industrial -40 to +85C operation is essential for outdoor or thermally-challenged central-office deployments where commercial-grade parts would fail. Heisener confirms 4,288 units in stock for ongoing line-card refresh as of 2026-09-07.
Được đề xuất
ASIC Prototyping and Emulation
The EP1S40F1020I6AA is widely used to prototype and emulate large ASICs because the 41,250 LEs plus 112 9-bit multipliers and 3.4 Mb of embedded memory can map most sub-million-gate ASICs with predictable timing closure. The 1020-ball FBGA supports deep-trace JTAG chains for bring-up, and the I6 industrial speed grade enables fast Fmax during verification campaigns. Designers partition ASIC RTL into the FPGA fabric, validate functional behaviour, then port back to silicon - a workflow that minimizes respin risk and saves months of ASIC turnaround.
Được đề xuất
High-Bandwidth Image and Video Processing
The EP1S40F1020I6AA delivers the logic density and embedded memory bandwidth required for real-time image-processing pipelines including HD-SDI capture, multi-camera fusion, and machine-vision pre-processing. With 112 9-bit multipliers and TriMatrix blocks, the device can implement FIR filters, FFT engines, and Bayer demosaicing in parallel without external DSP chips. The 773 user I/O pins accept multiple LVDS camera channels and drive DDR memory for frame buffering, while the I6 industrial speed grade supports factory-floor machine-vision deployments.
Được đề xuất
Radar and Defense Signal Processing
The EP1S40F1020I6AA suits radar and defense signal processing because its industrial -40 to +85C rating and 1.5 V Stratix core tolerate harsh environmental conditions, while 3,423,744 RAM bits store range-Doppler maps and 112 multipliers implement pulse-Doppler FFTs in real time. The 1020-ball FBGA accepts multiple LVDS ADC streams feeding embedded DSP blocks, and the I6 speed grade supports the deterministic latency required by phased-array beamforming. Legacy mil/aero programs rely on this exact part number for refresh production.
Được đề xuất
Industrial Automation and Motor Control
The EP1S40F1020I6AA is well-suited to industrial automation because its industrial temperature rating and high logic density support deterministic multi-axis motion control, EtherCAT/CANopen bridging, and encoder interface logic in a single chip. With 773 user I/Os the FPGA can connect to dozens of incremental encoders, resolver-to-digital converters, and sigma-delta ADCs while driving PWM outputs and safety-rated I/O. The I6 industrial speed grade ensures timing margins are met across -40 to +85C factory-floor conditions without thermal derating.
Được đề xuất
Medical Imaging and Diagnostic Equipment
The EP1S40F1020I6AA fits medical imaging modalities including ultrasound front-end beamforming, MRI gradient control, and CT reconstruction because the 3,423,744 RAM bits buffer raw RF channels while 112 multipliers execute channel-domain FIRs in parallel. The 1020-ball FBGA accepts many LVDS ADC channels for ultrasound probe multiplexing, and the I6 industrial temperature rating supports controlled-environment hospital installations where long-life legacy designs are common. The mature Quartix II toolchain still supports this part, preserving code investments.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP1S40F1020I6AA — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP1S40F1020I6 | EP1S40F1020C6N | EP1S40F1020C7N | EP1S40F1020C7 | EP1S40F1020C6 | EP1S40F1020C5N |
|---|---|---|---|---|---|---|---|
| Package | 1020-BBGA FineLine BGA, 33 x 33 mm | 1020-BBGA FineLine BGA, 33 x 33 mm (same) | 1020-BBGA FineLine BGA, 33 x 33 mm (same) | 1020-BBGA FineLine BGA, 33 x 33 mm (same) | 1020-BBGA FineLine BGA, 33 x 33 mm (same) | 1020-BBGA FineLine BGA, 33 x 33 mm (same) | 1020-BBGA FineLine BGA, 33 x 33 mm (same) |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 41250 | 41250 | 41250 | 41250 | 41250 | 41250 | 41250 |
| Embedded Memory (RAM bits) | 3423744 | 3423744 | 3423744 | 3423744 | 3423744 | 3423744 | 3423744 |
| User I/O Pins | 773 | 773 | 773 | 773 | 773 | 773 | 773 |
| Speed Grade | I6 (industrial, fast) | I6 (industrial) | C6 (commercial) | C7 (commercial) | C7 (commercial) | C6 (commercial) | C5 (commercial, slower) |
| Operating Temperature Range | -40C to +85C (industrial) | -40C to +85C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
Bảo phân biệt quan trọng
- Industrial temperature rating for harsh environments (vsEP1S40F1020C6N)
- Faster I6 speed grade vs slower C-grade options (vsEP1S40F1020C7N)
- Stratix family mature Quartus II toolchain support (vsEP1M350F780C7N (Mercury family))
Ghi chú thiết kế
The 1020-ball FineLine BGA at 1 mm pitch requires a high-density PCB stack-up with microvia or via-in-pad technology for fanout. Recommended: 8 to 12 layer stack-up with stacked microvias, 0.8 mm core-to-core dielectric spacing, and at least 1 oz copper for power planes. Place decoupling capacitors on the bottom side directly under the BGA, and use multiple stitching vias around the perimeter for signal return paths. Without microvia technology, breakout routing on 1 mm pitch is extremely challenging.
Estimated: Stratix EP1S40 at typical toggle rates (~100 MHz, ~60% utilization) consumes roughly 3 to 5 W from the 1.5 V core rail. The 33 x 33 mm FBGA package has limited top-side cooling; use a heatsink with thermal interface material and ensure at least 4 thermal vias under the center pad. For enclosed industrial enclosures, derate toggle activity above +70C ambient to keep junction below +125C. Always measure thermals in-system - simulation estimates alone are insufficient for reliability.
The Stratix EP1S40 supports DDR SDRAM, QDR SRAM, and FCRAM external memory interfaces; route matched-length fly-by topologies with 50 ohm controlled impedance. The 773 user I/O pins can be configured as LVDS, LVTTL, or HSTL on a per-bank basis - never mix incompatible I/O standards on the same bank, and use series-termination resistors within 200 mil of the driver. For high-speed LVDS clocks, route over a continuous ground plane and avoid crossing splits in the reference plane.
Common pitfalls when designing with the EP1S40F1020I6AA include: (1) using a C-grade (C5/C6/C7) speed-grade part instead of I6 in an industrial-temperature design - this causes timing failure or parametric drift at low temperature; (2) configuring the same I/O bank with conflicting voltage-referenced standards (e.g., LVTTL 3.3 V and LVDS) which can damage inputs; (3) omitting the free-running clock for the configuration controller, causing MSEL pin errors. Always check the I6 vs C6 speed grade before board build.
Thông tin tuân thủ
Detailed RoHS/REACH/lead-free status was not present in the verified web data and is recorded as [DATA_NEEDED]; AEC-Q100 is not applicable since the EP1S40F1020I6AA is an FPGA, not an automotive-grade IC. The original Altera Stratix family was generally lead-free finish (SnAgCu) but confirm with the manufacturer datasheet for the exact lot.
