Intel

EP1S40F1020C7N - Stratix 41K LE FPGA, 1020-FBGA | Intel

Name: EP1S40F1020C7N - Stratix 41K LE FPGA, 1020-FBGA | Intel
Brand: Intel
SKU: EP1S40F1020C7N
Price: 926.78 USD
Availability: InStock

MPN: EP1S40F1020C7N ⚠ Last Time Buy

In Stock Ships in 1-3 business days

1.5 V Vdss LVDS, LVTTL, LVCMOS, SSTL, HSTL Rds(on) 1020-ball FC-FBGA (33 x 33 mm, 1 mm pitch) Package 420.17 MHz Speed 3,423,744 Memory

From $926.78 USD / Unit

MOQ: 1 |

Price updated: 2026-09-07

Volume Pricing

Qty	Unit Price	Extended
1	$1323.97	$1,323.97
10	$1191.57	$11,915.70
100	$1059.18	$105,918.00
500	$992.98	$496,490.00
1,000	$926.78	$926,780.00

ℹ️ All prices are in USD

View Datasheet (PDF) View Alternatives

Quantity

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EP1S40F1020C6

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EP1S30F1020C7N

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EP1S40F1020C7N Maximum Ratings & Electrical Characteristics

Family	Stratix
Logic Elements	41,250
Logic Array Blocks (LABs)	4,125
User I/O Pins	773
Embedded Memory (bits)	3,423,744
Supply Voltage (Core)	1.5 V
Maximum Operating Frequency	420.17 MHz
Process Technology	130 nm CMOS
Package	1020-ball FC-FBGA (33 x 33 mm, 1 mm pitch)
Operating Temperature Range	0 C to 85 C (Commercial)
I/O Standards Supported	LVDS, LVTTL, LVCMOS, SSTL, HSTL
Configuration Schemes	PS, AS, JTAG
On-chip PLLs	Yes
Mounting Type	Surface Mount (BGA)
RoHS Status	Compliant (verify on quote)

EP1S40F1020C7N 1020-ball fc-fbga (33 x 33 mm, 1 mm pitch) Pin Configuration Guide

Complete pinout information for EP1S40F1020C7N (1020-ball fc-fbga (33 x 33 mm, 1 mm pitch) package) with 773 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

1020-ball fc-fbga (33 x 33 mm, 1 mm pitch) package pinout diagram for EP1S40F1020C7N

No detailed pinout data available for EP1S40F1020C7N.

Refer to the datasheet for full pin configuration.

Estimated pin count: 773 pins (digital package)

Safe Operating Area (SOA) & Thermal Characteristics

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

EP1S40F1020C7N is suitable for 6 applications: Telecommunications Line Card Processing, ASIC Prototyping and Emulation, High-Speed DSP Co-Processing, Industrial High-Speed Data Acquisition, Military and Aerospace Signal Processing, High-Speed Protocol Bridging and Glue Logic.

🌐

Telecommunications Line Card Processing

The EP1S40F1020C7N suits telecom line-card designs where 41,250 logic elements and 3.4 Mbit of embedded TriMatrix memory provide parallel packet-processing datapaths without external SRAM. Its 773 user I/O pins support multiple SFI/SPI-like interfaces, while embedded DSP blocks accelerate Viterbi or Reed-Solomon encoding at the 420.17 MHz internal clock. The 1.5 V core and 130 nm node keep power manageable for 10-15 W line-card budgets.

Recommended

🖥️

ASIC Prototyping and Emulation

The EP1S40F1020C7N is widely used to prototype multi-million-gate ASIC designs before tape-out because its 41K LE capacity maps cleanly onto partitioned ASIC blocks. The Quartus II flow supports Verilog and VHDL synthesis with timing-driven placement, while the 1020-ball FC-FBGA exposes enough user I/O to bring out wide ASIC buses. The C7 speed grade provides the timing margin needed for accurate worst-case ASIC verification at 420.17 MHz.

Recommended

EP1S40F1020C5N · Intel EP1S40F1020C6 · Altera

🏭

High-Speed DSP Co-Processing

The EP1S40F1020C7N's embedded multiplier blocks accelerate fixed-point DSP workloads such as FFTs, FIR filters, and radar pulse compression in radar and signal-intelligence systems. The 3.4 Mbit of embedded memory enables deep sample buffering without external SRAM, and the 420.17 MHz Fmax supports sample rates up to several hundred megasamples per second across parallel channels. The 130 nm process node gives predictable latency for synchronous DSP pipelines.

Recommended

EP1S40F1020C5 · Intel EP1S30F1020C7N · Intel

🔧

Industrial High-Speed Data Acquisition

The EP1S40F1020C7N functions as the central processing element in industrial data-acquisition systems, where 773 user I/O pins interface to multiple high-speed ADCs and DACs across LVDS and LVCMOS banks. Embedded block RAM buffers high-rate sample streams before downstream DSP, and on-chip PLLs generate the multiple clock domains needed for synchronous acquisition. The commercial 0-85 C operating range suits most factory-floor enclosures.

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EP1S40F1020C6N · Intel EP1S30F1020C7 · Altera

✈️

Military and Aerospace Signal Processing

The EP1S40F1020C7N's parallel DSP blocks and 41K LE capacity support radar, electronic-warfare, and software-defined-radio subsystems where deterministic latency and on-chip memory are required. Multiple I/O banks enable simultaneous connection to RF ADCs, DACs, and high-speed transceivers while preserving signal integrity. Designers pair the device with companion Stratix-II or radiation-tolerant parts for upgrade paths, using the same 1020-FBGA footprint where possible.

Recommended

EP1S40F1020C5N · Intel EP1S30F1020C7N · Intel

🌐

High-Speed Protocol Bridging and Glue Logic

The EP1S40F1020C7N serves as a programmable bridge between heterogeneous processor buses, network PHYs, and storage controllers where fixed ASSPs cannot match the required interface mix. The 773 user I/O pins support many parallel and serial protocols simultaneously, while embedded TriMatrix memory implements FIFOs and translation buffers between clock domains. The 1.5 V core supply and 130 nm node keep system power budgets reasonable for multi-rail platforms.

Recommended

EP1S40F1020C6 · Altera EP1S40F1020C5 · Intel

Recommended Products Summary

EP1S40F1020C6N Intel Used in: Telecommunications Line Card Processing, Industrial High-Speed Data Acquisition EP1S30F1020C7N Intel Used in: Telecommunications Line Card Processing, High-Speed DSP Co-Processing, Military and Aerospace Signal Processing EP1S40F1020C5N Intel Used in: ASIC Prototyping and Emulation, Military and Aerospace Signal Processing EP1S40F1020C6 Altera Used in: ASIC Prototyping and Emulation, High-Speed Protocol Bridging and Glue Logic EP1S40F1020C5 Intel Used in: High-Speed DSP Co-Processing, High-Speed Protocol Bridging and Glue Logic EP1S30F1020C7 Altera Used in: Industrial High-Speed Data Acquisition

What is the logic capacity of the EP1S40F1020C7N FPGA?

The EP1S40F1020C7N contains 41,250 logic elements organized into 4,125 LABs. According to the Altera Stratix Device Family Data Sheet, the device also integrates 3,423,744 bits of embedded TriMatrix memory and dedicated DSP blocks, placing it in the upper tier of the original Stratix family. This logic density supports wide datapaths, parallel DSP, and ASIC prototyping workloads at clock rates up to 420.17 MHz.

What package does the EP1S40F1020C7N use?

The EP1S40F1020C7N ships in a 1020-ball FC-FBGA package measuring 33 x 33 mm with a 1.0 mm ball pitch. This fine-pitch BGA requires controlled-impedance PCB stackup and via-in-pad or microvia construction. According to the Altera Stratix hardware reference, the package exposes 773 user I/O pins across multiple I/O banks supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL standards.

What is the maximum operating frequency of the EP1S40F1020C7N?

The EP1S40F1020C7N supports a maximum internal operating frequency of 420.17 MHz, as listed by distributor data sheets that reference the Stratix Device Family Data Sheet. Actual achievable performance depends on placement, routing congestion, and design fit; the 130 nm process node and 1.5 V core supply define the headline timing limits.

Where can I buy the EP1S40F1020C7N and what is the price?

The EP1S40F1020C7N is offered by authorized distributors including Arrow, Mouser, and Heisener as of 2026-09-07, with unit pricing around 1,323.98 USD at quantity 1 and lower tiers around 926 USD at 1,000 pieces. Because this part is in last-time-buy status, lead times should be confirmed at quote time, and brokers may also carry excess inventory. Request a formal quote through XAIPART to verify current stock.

What is the lead time for the EP1S40F1020C7N?

Heisener lists the EP1S40F1020C7N as 'Can Ship Immediately' as of 2026-09-07 with an estimated delivery window of 2026-06-23 to 2026-06-28 for expedited orders. Because the part is flagged as last-time-buy, lead times at authorized distributors can stretch as stock depletes. Plan ahead by qualifying a drop-in alternative in parallel with the last-time-buy order.

Is the EP1S40F1020C7N in stock today?

Heisener reports 6,176 pieces of the EP1S40F1020C7N in stock as of 2026-09-07. Other distributors, including Arrow and Mouser, list the part for quote or backorder. Because the device is in last-time-buy, treat current stock as a finite window and qualify a long-term replacement before the inventory runs out.

EP1S40F1020C7N vs EP1S40F1020C6N - which should I choose?

The EP1S40F1020C7N and EP1S40F1020C6N differ only in speed grade: -7 corresponds to a faster timing bin than -6 for the same die and 1020-FBGA package. Choose the -7 if your design requires the highest Fmax margin in critical paths; choose the -6 if you want slightly lower cost and can tolerate a small frequency reduction. Both parts share pinout, package, and Quartus support footprint.

EP1S40F1020C7N vs EP1S40F1020C5N - what is the difference?

The EP1S40F1020C5N, EP1S40F1020C6N, and EP1S40F1020C7N share the same Stratix die, 1020-ball FBGA package, and pinout, differing only in speed grade where -5 is slowest and -7 is fastest. Per the Stratix Device Family Data Sheet, Fmax scales with speed grade; choose -7 for maximum timing margin and -5 when cost outweighs peak performance. All three parts accept the same Quartus bitstream configuration options.

When should I choose EP1S40F1020C7N over EP1S30F1020C7N?

Choose EP1S40F1020C7N when you need 41,250 logic elements versus the 33,000 LE offered by the EP1S30F1020C7N, or roughly 25 percent more DSP and block RAM capacity. The EP1S30F1020C7N fits in the same 1020-ball FBGA footprint, so PCB layout is reusable. Pick the -40 variant for high-utilization designs and the -30 variant when the design fits within the smaller resource budget and unit cost matters.

Is the EP1S40F1020C7N suitable for new designs in 2026?

The EP1S40F1020C7N is in last-time-buy status and is best suited for sustaining existing production rather than new designs. New designs should consider the Stratix II (EP2S) family, Stratix III/IV, or current Intel Agilex FPGAs for better performance-per-watt and long-term support. Use the EP1S40F1020C7N only when matching a legacy BOM or sourcing for an existing deployed system.

What is the best drop-in replacement for EP1S40F1020C7N?

The best drop-in replacement is the EP1S40F1020C6N or EP1S40F1020C5N, which share the same die, 1020-ball FBGA package, and pinout but trade speed grade. Both parts reuse the same Quartus II compilation flow and bitstream format. For long-term production, migrate to Stratix II EP2S60F1020C5 or newer Intel Agilex families, which require PCB and firmware rework.

Where can I download the EP1S40F1020C7N datasheet PDF?

The authoritative source for the EP1S40F1020C7N is the Altera Stratix Device Family Data Sheet, hosted at intel.com/content/www/us/en/docs/programmable/683490/current. The PDF contains detailed timing specifications, package pinout, configuration schemes, and recommended operating conditions. Distributors such as Heisener, Veswin, and Excesschip also provide free datasheet copies on their product pages.

Where can I find the EP1S40F1020C7N pinout?

The full pinout of the EP1S40F1020C7N is documented in the Altera Stratix Device Family Data Sheet section covering the 1020-ball FBGA package. The pin list maps each ball to a function such as user I/O bank pin, dedicated clock input, configuration pin, or power/ground. Altera's Quartus II Pin Planner tool also provides a graphical view of the same package pinout for your design.

What are the key specifications of EP1S40F1020C7N that engineers should know?

The EP1S40F1020C7N is a 130 nm Stratix FPGA with 41,250 logic elements, 4,125 LABs, 3,423,744 RAM bits, 773 user I/O pins, and a 420.17 MHz maximum internal clock, all in a 1020-ball FC-FBGA package with a 1.5 V core supply. The device operates from 0 C to 85 C in commercial temperature grade. These parameters are summarized from the Altera Stratix Device Family Data Sheet and current distributor listings as of 2026-09-07.

Hey Google, what can replace the EP1S40F1020C7N?

Direct drop-in replacements for the EP1S40F1020C7N include the EP1S40F1020C6N and EP1S40F1020C5N, both sharing the same Stratix die, 1020-ball FBGA footprint, and Quartus support. Each option differs only in speed grade. For modern alternatives requiring PCB rework, migrate to Stratix II EP2S60F1020C5 or Intel Agilex 7 series FPGAs.

What is the equivalent Intel part for the EP1S40F1020C7N from another brand?

The EP1S40F1020C7N is an Intel (formerly Altera) Stratix FPGA, and there is no true drop-in cross-brand equivalent because competing FPGAs use different die architectures, pinouts, and toolchains. Xilinx Virtex-II Pro or Virtex-4 devices offer similar logic density and DSP block counts but require PCB redesign and a new bitstream toolchain. Treat any 'cross-brand equivalent' as a redesign-level substitution, not a drop-in.

Engineering reference data for EP1S40F1020C7N — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP1S40F1020C7N when you need the maximum logic capacity (41K LE) of the original Stratix family in a 1020-ball FC-FBGA and your critical-path timing requires the C7 speed grade for Fmax margin. Choose EP1S40F1020C6N or EP1S40F1020C5N when a 10-15% Fmax reduction is acceptable in exchange for lower unit cost, since all three share the same die, package, and Quartus support. Pick EP1S30F1020C7N or EP1S30F1020C7 when your design fits within 33K LE and you want to reduce BOM cost while keeping the same 1020-FBGA PCB layout. Avoid this part for new greenfield designs in 2026 because it is in last-time-buy; instead, migrate to Stratix II EP2S or current Intel Agilex families for long-term support. Use the EP1S40F1020C7N for sustaining legacy production, ASIC emulation, and cost-sensitive prototyping where the design has already been validated on this exact pinout.

Comparison with Alternatives

Parameter	This Product	EP1S40F1020C6N	EP1S40F1020C5N	EP1S40F1020C6	EP1S40F1020C5	EP1S30F1020C7N
Package	1020-ball FC-FBGA (33 x 33 mm)	1020-ball FC-FBGA (33 x 33 mm)	1020-ball FC-FBGA (33 x 33 mm)	1020-ball FC-FBGA (33 x 33 mm)	1020-ball FC-FBGA (33 x 33 mm)	1020-ball FC-FBGA (33 x 33 mm)
Brand	Intel	Intel	Intel	Intel	Intel	Intel
Logic Elements	41,250	41,250	41,250	41,250	41,250	33,000
Speed Grade	C7 (fastest)	C6	C5	C6	C5	C7
User I/O Pins	773	773	773	773	773	773
Embedded RAM (bits)	3,423,744	3,423,744	3,423,744	3,423,744	3,423,744	[DATA_NEEDED]
Core Voltage	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V
Operating Temperature	0 C to 85 C (Commercial)	0 C to 85 C (Commercial)	0 C to 85 C (Commercial)	0 C to 85 C (Commercial)	0 C to 85 C (Commercial)	0 C to 85 C (Commercial)

Key Differentiators

Fastest speed grade in the EP1S40F1020 family (vs EP1S40F1020C6N)
Highest logic capacity in the original Stratix family at 41K LE (vs EP1S30F1020C7N)
Same pinout across speed grades simplifies BOM management (vs EP1S25F1020C7N)

Design Notes

Estimated: at 1.5 V core and 2 A core current, the EP1S40F1020C7N dissipates roughly 3 W internally, plus additional IO bank power; total worst-case package power can reach 8-10 W. Use thermal vias under the 33 x 33 mm FC-FBGA exposed pad to a multilayer copper ground plane. Without a thermal spreader, the 130 nm process die can exceed 100 C junction at 25 C ambient, derating Fmax. Add airflow or a heat spreader for production deployments.

The 1020-ball FC-FBGA at 1.0 mm pitch demands a high-density PCB stackup with microvia or via-in-pad construction; standard 8/8 mil via designs cannot reliably break out the inner balls. Plan for at least 6 PCB layers to provide solid reference planes for the high-speed LVDS and SSTL I/O banks. Follow the Altera Stratix hardware reference design guidelines for power-plane decoupling, placing 0.1 uF and 0.01 uF capacitors within 100 mil of every power pin.

Use controlled-impedance routing (typically 50 ohm single-ended, 100 ohm differential) for all LVDS and SSTL I/O bank traces, with length matching within 25 mil for differential pairs. The 773 user I/O pins are organized into multiple banks, each with its own VCCIO rail; isolate clocks and high-speed buses from switching I/O by dedicating separate banks. Series-termination resistors on LVTTL outputs help reduce overshoot when driving long PCB traces back to companion ASICS.

Do not confuse the EP1S40F1020C7N with the older EP1S40B956 or smaller EP1S25 variants: the 1020-FBGA pinout is unique to the -40F1020 family. Mixing configuration modes (PS, AS, JTAG) without proper MSEL pin strapping can leave the device unconfigured. Verify the configuration memory density (EPCS16, EPCS64, etc.) supports the compressed bitstream size generated by Quartus II for your design before board bring-up.

Compliance Information

RoHS

Unknown

REACH

Unknown

AEC-Q100

Not Applicable

Lead Free

Unknown

Halogen Free

Unknown

Conflict Minerals

Unknown

Compliance status not stated in the verified distributor listings; confirm with the manufacturer or your distributor at quote time. AEC-Q100 is not applicable because the part is a commercial-grade FPGA, not an automotive-qualified IC.

Data verified on: 2026-09-07 — data verified and curated by XAIPART's component engineering team

Sources: Distributor, Distributor, Distributor, Distributor, Distributor, Distributor, Manufacturer_Datasheet

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