EP1S40F1020C6N - Stratix 41.25K LE FPGA, 1.5V, FBGA-1020 | Altera
MPN: EP1S40F1020C6N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $870 | $870.00 |
| 10 | $825 | $8,250.00 |
| 50 | $780 | $39,000.00 |
| 100 | $740 | $74,000.00 |
| 500 | $695 | $347,500.00 |
Drop-in alternatives for EP1S40F1020C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S40F1020C6
✅ Drop-In✓ In Stock
$1380 / Unit
View Datasheet →EP1S40F1020I6N
✅ Drop-In✓ In Stock
$365 / Unit
View Datasheet →EP1S40F1020C5N
✅ Drop-In✓ In Stock
$280 / Unit
View Datasheet →EP1S30F1020C6N
✅ Drop-In✓ In Stock
$1015 / Unit
View Datasheet →EP1S25F1020C6N
✅ Drop-In✓ In Stock
$450 / Unit
View Datasheet →EP1S40F1020C6N Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Logic Elements | 41,250 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Maximum Operating Frequency | 450.05 MHz |
| Package Type | FBGA-1020 (33 x 33 mm, 1 mm pitch) |
| Pin Count | 1020 |
| Operating Temperature Range | 0 C to 85 C (Commercial Extended) |
| Logic Family | CMOS |
| Programmable Logic Type | FPGA (SRAM-based) |
| Mounting Type | Surface Mount |
| Configuration Method | EPC serial/parallel configuration device |
EP1S40F1020C6N fbga-1020 (33 x 33 mm, 1 mm pitch) Pin Configuration Guide
Complete pinout information for EP1S40F1020C6N (fbga-1020 (33 x 33 mm, 1 mm pitch) package) with 1020 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S40F1020C6N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 1020 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S40F1020C6N is suitable for 6 applications: Legacy Telecom Line Card, ASIC Prototyping and Emulation, Software-Defined Radio Front End, Industrial Motor Control, High-Speed Data Acquisition, Network Switch Datapath Acceleration.
Legacy Telecom Line Card
The EP1S40F1020C6N fits legacy telecom line card designs because its 41,250 logic elements and dedicated DSP blocks handle channelized voice and data processing at line rate, while the FBGA-1020 package exposes sufficient I/O for multiple SFP/QSFP interfaces. At 1.5 V core supply and 450.05 MHz internal performance it provides adequate timing margin for OC-48/STM-16 framer implementations. Compared with a switching ASIC, it lets carriers extend the life of installed base stations without a full PCB redesign. The same die also integrates TriMatrix block RAM, eliminating external SRAM for packet buffer storage.
Recommended
ASIC Prototyping and Emulation
The EP1S40F1020C6N suits ASIC prototyping because the 41,250 logic elements map cleanly onto mid-complexity ASIC netlists in the 200-300K gate range, and the FBGA-1020 footprint exposes enough user I/O to break out the entire ASIC pin list. The 130nm process means timing behavior correlates within 10-15% of typical 130/90nm ASIC flows, giving realistic pre-silicon validation. Quartus II SOPC Builder supports soft-core Nios II integration for control-plane emulation. Compared with newer FPGAs, the EP1S40 is widely available in design archives and licensed IP libraries.
Recommended
Software-Defined Radio Front End
The EP1S40F1020C6N fits SDR front-end preprocessing because its embedded multiplier blocks can run 18x18 signed multiplies at the rated 450.05 MHz, supporting channelization and digital down-conversion for signals up to ~150 MHz bandwidth. The Stratix I/O banks accept LVDS from high-speed ADCs without external buffers, and the PLL-based clock network aligns ADC sampling to baseband processing. Against a DSP+FPGA partition, integrating both on the EP1S40 reduces board area and BOM cost while keeping the signal chain programmable for evolving waveforms.
Recommended
Industrial Motor Control
The EP1S40F1020C6N fits industrial motor drives because the 41,250 logic elements run field-oriented control (FOC) loops at multi-MHz PWM rates, while dedicated hardware multipliers accelerate Park/Clarke transforms and observer math. The commercial-extended 0-85C rating covers most factory-floor enclosures; pair with the EP1S40F1020I6N industrial variant for outdoor cabinets. LVDS I/O drives encoder feedback directly, and the FBGA-1020 ball map supports parallel ADC sampling for current/voltage sensing. Compared with a microcontroller+ASIC split, it consolidates the control and commutation logic on one programmable device.
Recommended
High-Speed Data Acquisition
The EP1S40F1020C6N fits high-speed data acquisition because its LVDS I/O banks accept parallel ADC data at 400-500 MHz DDR rates, and the on-chip TriMatrix memory buffers deep captures before DMA transfer. The 1.5 V core dissipates roughly 5-10 W under typical utilization, manageable with the FBGA-1020 thermal pad. Compared with a Cyclone or Spartan, it provides more block RAM per logic element and faster DSP blocks. Pair with an EPC16 configuration device for instant-on capture mode without host intervention.
Recommended
Network Switch Datapath Acceleration
The EP1S40F1020C6N fits network switch datapath acceleration because its 41,250 logic elements and wide internal buses handle 10-Gbps packet parsing, classification, and queue management, while the FBGA-1020 I/O connects to multiple SFP+ transceivers via LVDS. The PLL-based clock tree aligns multi-gigabit serial streams with minimal jitter. Against an NPU, the EP1S40 is reprogrammable for evolving protocols. The commercial-extended temperature grade suits controlled-environment central-office installations.
Recommended
Recommended Products Summary
Engineering reference data for EP1S40F1020C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S40F1020C6 | EP1S40F1020I6N | EP1S40F1020C5N | EP1S30F1020C6N | EP1S25F1020C6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-1020 (33x33 mm) | FBGA-1020 (33x33 mm) - same | FBGA-1020 (33x33 mm) - same | FBGA-1020 (33x33 mm) - same | FBGA-1020 (33x33 mm) - same | FBGA-1020 (33x33 mm) - same |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | ~30,000 | ~25,000 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | -40 C to 100 C (Industrial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) |
| Speed Grade | 6 (fastest) | 6 | 6 | 5 (slower) | 6 | 6 |
| Terminal Finish | Lead-free (N suffix) | Lead-bearing (no N) | Lead-free (N suffix) | Lead-free (N suffix) | Lead-free (N suffix) | Lead-free (N suffix) |
| Approx Unit Price (USD, as of 2026-09-07) | $870 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Pin-compatible temperature grade swap option (vs EP1S40F1020C6)
- Faster speed grade at same LE count (vs EP1S40F1020C5N)
- Highest logic density in Stratix family at FBGA-1020 (vs EP1S30F1020C6N)
- Lead-free terminal finish (vs EP1S40F1020C6)
Design Notes
Estimated: at 1.5 V core supply with typical 41K LE utilization (~70%) the EP1S40F1020C6N draws 4-7 A from VCCINT and an additional 0.5-2 A from VCCIO banks, depending on switching activity. Use a buck regulator with at least 10 A headroom and a low-ESR bulk capacitor bank on each voltage rail. Place 0.1 uF and 0.01 uF decoupling within 5 mm of every VCCINT/VCCIO ball pair to suppress simultaneous-switching noise on the 1020-ball array.
The FBGA-1020 package requires a multi-layer PCB (8+ layers recommended) with microvia or via-in-pad fanout to escape the 1 mm pitch ball grid. Use the manufacturer's reference stackup with continuous VCCINT and GND planes directly beneath the device. Thermal vias (0.3 mm diameter, 1.2 mm pitch) under the central ball array provide a low-thermal-resistance path to the internal copper pour. Match the BGA pad finish (ENIG or OSP) to your assembly process.
Do not confuse the EP1S40F1020C6N ball map with Cyclone, Stratix II, Stratix III, or Stratix IV - they all use different FBGA pinouts even at the same ball count. Verify configuration mode (FPP, PPA, AS, or JTAG) against the EPC configuration device datasheet. The original Stratix silicon does not support passive serial (PS) configuration, only FPP and PPA, so check your design files. Altera's legacy NCONF and nCONFIG pins require 4.7 kohm pull-ups per the Stratix Device Handbook.
LVDS I/O on the EP1S40F1020C6N requires 100 ohm differential impedance traces routed as length-matched pairs with 5 mil tolerance. SSTL-II and SSTL-18 memory interfaces need termination resistors (25 ohm to VTT) within 200 mil of the FPGA ball. Source-synchronous interfaces (DDR, QDR) should use the dedicated DQS/DQSn pins rather than regular LVDS pairs, and enable the on-chip dynamic phase alignment (DPA) circuitry for sub-300 MHz clock centering.
Compliance Information
RoHS compliance inferred from 'N' suffix (lead-free terminal finish) per Altera/Intel legacy ordering convention. REACH, halogen-free, and conflict-mineral status not present in verified web data and are marked unknown. AEC-Q100 not applicable for commercial-grade FPGA.
