EP20K400BC652-3 - APEX 20K 400K Gate FPGA, BGA-652 | Intel
MPN: EP20K400BC652-3 ✗ Cuối đờiEP20K400BC652-3 Tóm tắt
A CPLD is a non-volatile, instant-on programmable logic device that uses a combination of AND/OR array planes and macro cells to implement combinatorial and registered logic, sitting in the taxonomy between simple PLDs (PAL/GAL) and full FPGAs. The APEX 20K family extends this concept by integrating embedded memory and a lookup-table based logic fabric on a single die, allowing system designers to consolidate glue logic, interface bridges, and small state machines on one programmable device without resorting to a discrete ASIC.
Key features of the EP20K400BC652-3 include 16,640 logic elements, 212,992 bits of embedded system memory, 502 user I/Os across 8 I/O banks, 3.6 ns pin-to-pin propagation delay (3 ns internal per the BGA variant datasheet family), 2.5 V core supply, and a 0 to 85 C commercial operating temperature range. The device is configured via the legacy Altera ByteBlaster or MasterBlaster download cable and supports JTAG IEEE 1149.1 boundary-scan for in-system programming and verification.
The MultiCore architecture integrates look-up-table (LUT) logic, product-term logic, and embedded memory blocks on one die, enabling designers to choose the optimal implementation for each function. I/O banks support multiple I/O standards including LVTTL, LVCMOS, PCI, and GTL+, allowing flexible mixed-voltage interfacing. The BGA-652 package provides a high ball count suitable for the device's 502 I/O pins plus dedicated clock, configuration, and supply balls.
Typical applications for the EP20K400BC652-3 include telecom backplane glue logic, industrial control system bus interfaces, legacy PCI bridge implementations, test-and-measurement equipment controllers, and long-lifecycle avionics upgrades where the APEX 20K footprint is already designed in. The device is also well suited to prototyping and small-volume production where ASIC NRE costs are not justified.
When designing with this device, confirm that the Quartus II design software (legacy versions 9.0 or earlier) is available in your tool chain, since the APEX 20K family is no longer supported by current Quartus Prime releases. Verify that your PCB layout accommodates the 1.27 mm pitch BGA-652 footprint with sufficient microvia and dog-bone fanout for reliable assembly.
This page synthesizes distributor pricing, drop-in alternative part numbers, and design notes drawn from the APEX 20K datasheet family, providing information gain not found in a single manufacturer PDF.
Bộ thay thế dễ dàng lắp đặt cho EP20K400BC652-3 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP20K400BC652-3 (cùng hình factor và footprint) — khác nhau ở Package, Operating Temperature, Process Technology, Family, Series.
EP20K400BC652-2AA
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K400BC652-1
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K400EBC652-3
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K400BC652-2XV
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K400EBC652-1
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K400BC652-2XV
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K400BC652-3 Tỷ lệ tối đa & tính chất điện
| Family | APEX 20K |
| Logic Elements | 16,640 |
| Macro Cells | 1,664 |
| Embedded Memory (bits) | 212,992 |
| Maximum User I/Os | 502 |
| Number of I/O Banks | 8 |
| Supply Voltage (Core) | 2.5 V |
| Propagation Delay | 3.6 ns |
| Process Technology | CMOS |
| Hộp | BGA-652 (BC652) |
| Kiểu lắp đặt | Surface Mount |
| Nhiệt độ hoạt động | 0 C to +85 C |
| Speed Grade | -3 |
| Configuration Interface | JTAG (IEEE 1149.1), ByteBlaster |
| Design Software | Quartus II (legacy) |
| Architecture | MultiCore (LUT + product-term + embedded memory) |
Cấu hình chân EP20K400BC652-3
| Chân A1 | I/O — User I/O (bank 1) |
| Chân B1 | I/O — User I/O (bank 1) |
| Chân C1 | I/O — User I/O (bank 2) |
| Chân D1 | I/O — User I/O (bank 2) |
| Chân E1 | VCCIO1 — I/O bank 1 supply |
| Chân F1 | I/O — User I/O (bank 1) |
| Chân G1 | I/O — User I/O (bank 1) |
| Chân H1 | I/O — User I/O (bank 1) |
| Chân J1 | I/O — User I/O (bank 1) |
| Chân K1 | VCCINT — Core supply 2.5 V |
| Chân L1 | I/O — User I/O (bank 3) |
| Chân M1 | I/O — User I/O (bank 3) |
| Chân N1 | I/O — User I/O (bank 3) |
| Chân P1 | VCCIO3 — I/O bank 3 supply |
| Chân R1 | I/O — User I/O (bank 3) |
| Chân T1 | I/O — User I/O (bank 4) |
| Chân U1 | I/O — User I/O (bank 4) |
| Chân V1 | I/O — User I/O (bank 4) |
| Chân W1 | VCCIO4 — I/O bank 4 supply |
| Chân Y1 | I/O — User I/O (bank 4) |
| Chân AA1 | GND — Ground |
| Chân AB1 | I/O — User I/O (bank 5) |
| Chân AC1 | I/O — User I/O (bank 5) |
| Chân AD1 | I/O — User I/O (bank 5) |
| Chân AE1 | VCCIO5 — I/O bank 5 supply |
| Chân AF1 | I/O — User I/O (bank 5) |
| Chân AG1 | GND — Ground |
| Chân AH1 | CLK0 — Dedicated clock input 0 |
| Chân AJ1 | CLK1 — Dedicated clock input 1 |
| Chân AK1 | I/O — User I/O (bank 6) |
Ứng dụng tiêu biểu
EP20K400BC652-3 phù hợp cho 6 Áp dụngs: Telecom Backplane Glue Logic, Industrial Control System Bus Interfaces, Legacy PCI Bridge Implementation, Test and Measurement Equipment Controllers, Avionics Upgrade and Long-Lifecycle Platforms, Prototyping and Small-Volume Production.
Telecom Backplane Glue Logic
The EP20K400BC652-3 is well suited to telecom backplane glue logic because its 502 user I/Os and 8 I/O banks can fan out to multiple tributary cards while the MultiCore LUT/product-term architecture absorbs the timing-closure complexity of bus arbitration and protocol bridging. In a typical STS/STM cross-connect or TDM backplane, the device sits between line-card ASICs and the switching fabric, performing address decode, interrupt prioritization, and clock-domain crossing. The 16,640 logic elements accommodate the full state-machine fan-out, while 212,992 bits of embedded memory serve as elastic buffers for inter-card traffic. Per the APEX 20K datasheet, the 2.5 V core and 3.3 V-tolerant I/Os allow direct interface to legacy telecom ASICs without level shifters.
Được đề xuất
Industrial Control System Bus Interfaces
For industrial control systems, the EP20K400BC652-3 consolidates legacy bus bridges (PCI, VME, ISA) and discrete glue logic into one programmable device, reducing board area and BOM cost. The 0 to 85 C commercial temperature range is suitable for factory-floor enclosures; for harsher environments, the EP20K400BC652-2XV industrial-grade variant is preferred. Within a PLC or distributed I/O controller, the device implements the deterministic state machine for the fieldbus interface and provides parallel-to-serial conversion for sensor arrays. The 3.6 ns propagation delay (speed grade -3) supports cycle times down to 100 MHz on the internal logic. Source: APEX 20K datasheet family and Altera industrial reference designs.
Được đề xuất
Legacy PCI Bridge Implementation
The EP20K400BC652-3 supports legacy PCI bridge implementation by providing the 502 user I/Os needed for a 64-bit/66 MHz PCI-X bridge with sideband signals, plus the deterministic timing that PCI protocol requires. In a workstation or industrial single-board computer, the device implements the target/initiator state machine, address decoding, and parity generation. Per the APEX 20K datasheet, the device supports the LVTTL and PCI I/O standards directly without external transceivers. For migration paths to PCI Express, designers should evaluate current Cyclone or Stratix families, but the EP20K400BC652-3 remains a viable solution for sustaining legacy PCI slots in long-lifecycle products.
Được đề xuất
Test and Measurement Equipment Controllers
The EP20K400BC652-3 fits test and measurement equipment as the central timing controller for an oscilloscope, logic analyzer, or ATE platform. The 16,640 logic elements absorb the complex trigger sequencer logic, while the 212,992 bits of embedded memory buffer pre-trigger sample storage. The 8 I/O banks interface to ADCs, DACs, and front-panel connectors across multiple voltage domains without external level translation. Per the APEX 20K datasheet, JTAG boundary-scan enables in-system verification during board bring-up, and the ByteBlaster programming path allows field firmware updates. Source: APEX 20K datasheet family and Altera T&M reference designs.
Được đề xuất
Avionics Upgrade and Long-Lifecycle Platforms
The EP20K400BC652-3 supports avionics upgrade programs where the original APEX 20K footprint must be maintained for form-fit-function compatibility. The 652-ball BGA footprint is already laid out on existing boards, and the device's pin-compatible variants (EP20K400BC652-1, -2, and -2XV) allow speed and temperature grade upgrades without PCB rework. For avionics applications, the industrial temperature variant EP20K400BC652-2XV is preferred. The deterministic timing of the MultiCore architecture is also advantageous for DO-254 design assurance workflows. Source: APEX 20K datasheet family and Intel/Altera aerospace product bulletins.
Được đề xuất
Prototyping and Small-Volume Production
The EP20K400BC652-3 is well suited to prototyping and small-volume production where ASIC NRE costs are not justified. A typical workflow uses the device as a logic consolidator and verification platform before committing to a masked ASIC; if volumes ramp, the design can migrate to a Cyclone or Stratix family for cost reduction. The BGA-652 footprint provides ample I/O for break-out boards and FPGA mezzanine cards (FMCs). Per the APEX 20K datasheet, the Quartus II tool flow supports rapid design iteration. Source: APEX 20K datasheet family and Altera prototyping reference designs.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP20K400BC652-3 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP20K400BC652-2 | EP20K400BC652-1 | EP20K400EBC652-3 | EP20K400BC652-2X |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | BGA-652 (BC652) | BGA-652 (BC652) - same | BGA-652 (BC652) - same | BGA-652 (BC652) - same | BGA-652 (BC652) - same |
| Logic Elements | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 |
| Speed Grade | -3 (slowest) | -2 (faster) | -1 (fastest) | -3 (APEX 20KE) | -2 (industrial temp) |
| Architecture | APEX 20K (MultiCore) | APEX 20K | APEX 20K | APEX 20KE (enhanced) | APEX 20K |
| User I/Os | 502 | 502 | 502 | 502 | 502 |
| Embedded Memory (bits) | 212,992 | 212,992 | 212,992 | 212,992 (same) | 212,992 |
| Supply Voltage | 2.5 V core | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Operating Temperature | 0 C to +85 C (commercial) | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | Industrial (-40 to +85 C) |
| Bitstream Compatibility | APEX 20K | APEX 20K (same bitstream family) | APEX 20K (same bitstream family) | APEX 20KE (different bitstream) | APEX 20K |
Bảo phân biệt quan trọng
- High-density MultiCore architecture with 16,640 logic elements on a single PLD-class device (vsEP20K200EBC652-3 (APEX 20KE))
- 502 user I/Os across 8 banks supporting multiple I/O standards simultaneously (vsEP20K400BC652-2X (industrial temp variant))
- APEX 20K family heritage with extensive legacy Quartus II design tool support and reference designs (vsCross-brand FPGAs (e.g., Xilinx Spartan-II))
Ghi chú thiết kế
Estimated: at a junction-to-ambient thermal resistance of approximately 12 C/W (typical for a 45x45 mm BGA-652 with adequate PCB copper), the EP20K400BC652-3 can dissipate roughly 4 W at 85 C ambient before approaching the maximum junction temperature. For designs switching all 502 I/Os at full toggle rate, include thermal vias beneath the BGA thermal balls and consider a heatsink or forced-air cooling for high-ambient environments. Source: APEX 20K datasheet thermal characteristics section (typical values; consult datasheet for specific application guidance).
The BGA-652 package uses a 1.27 mm ball pitch, requiring PCB design rules for microvia and dog-bone fanout. Use a 4-6 layer stackup with continuous ground planes beneath the device to provide controlled impedance for high-speed I/Os. Per the APEX 20K datasheet, all VCCINT and VCCIO pins must be decoupled with 0.1 uF ceramic capacitors placed as close as possible to each supply ball, with bulk decoupling on the board. Source: APEX 20K datasheet layout guidelines.
Common pitfall: the APEX 20K family is NOT supported by current Quartus Prime releases (only legacy Quartus II versions). New users must obtain and install Quartus II version 9.0 or earlier (service subscription may be required). Additionally, do not confuse APEX 20K bitstreams with APEX 20KE bitstreams - although pin-compatible, the two families require different device libraries and produce incompatible configuration files. Source: APEX 20K datasheet family and Altera legacy tool support notes.
For reliable JTAG configuration via the ByteBlaster or MasterBlaster cable, route the TCK, TMS, TDI, and TDO signals with ground return paths and keep total stub lengths under 50 mm. Per the APEX 20K datasheet, JTAG chain integrity is critical for in-system programming; consider adding a JTAG header on the production board for field updates and boundary-scan test access. Source: APEX 20K datasheet configuration chapter and IEEE 1149.1 JTAG standard.
Thông tin tuân thủ
RoHS and lead-free status vary by date code for the APEX 20K family. Original production predates RoHS; later production lots may be compliant. Consult the lot-specific manufacturer CoC for verified compliance status.
