Intel

EP20K400BI652-2V - 400K Gates APEX 20K FPGA 652-BGA | Intel / Altera

MPN: EP20K400BI652-2V ✗ Cuối đời

2.5 V Vdss 652-ball FineLine BGA (35 × 35 mm, 1.27 mm pitch) Package 212,992 Memory

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EP20K400BI652-2V Tóm tắt

The Intel (formerly Altera) EP20K400BI652-2V is a member of the APEX 20K family of Field Programmable Gate Arrays (FPGAs), delivering 400,000 system gates with 16,640 logic elements and 212,992 bits of embedded memory in a 652-ball FineLine BGA package. The device provides 502 user I/O pins, operates from a 2.5 V core supply, and uses 0.22 μm CMOS process technology with a MultiCore architecture that integrates look-up table (LUT) logic, embedded system blocks (ESBs) for memory, and a high-speed interconnect fabric. The "-2V" speed grade indicates the industrial-grade temperature range and a 200 MHz internal performance target with approximately 2.5 ns propagation delay through the LUT-based logic elements.

An FPGA is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be reconfigured by the end user after manufacturing to implement arbitrary digital logic. FPGAs sit hierarchically between standard-cell ASICs (highest performance, highest NRE cost) and CPLDs (lower density, non-volatile), offering the optimal balance of high logic density, parallel processing, hardware-level determinism, and short time-to-market for mid-to-high complexity designs. The APEX 20K family was Altera's first multi-core architecture to combine LUT logic with embedded memory, foreshadowing the modern concept of a system-on-a-programmable-chip (SOPC).

Key features include 502 user I/Os with multi-voltage I/O support, on-chip RAM/ROM via ESBs, dedicated clock networks with PLL support, JTAG-compliant boundary-scan testing, and in-system programmability through the IEEE 1149.1 (JTAG) interface or the passive serial configuration port. The device supports PCI, LVDS, SSTL, and GTL+ I/O standards when paired with appropriate external reference voltages. The 652-ball FineLine BGA package provides a compact 35 × 35 mm footprint suitable for high-density PCB designs.

Typical applications include telecommunications infrastructure (DSLAM line cards, SONET/SDH framer interface blocks), high-speed data acquisition and DSP preprocessing pipelines, networking switches and routers, industrial control and machine vision backplanes, and embedded computing platforms that require hardware-accelerated co-processing. Designers typically target APEX 20K devices for designs that exceed the logic capacity of CPLDs but do not justify the NRE of an ASIC.

When designing with this part, verify that your Quartus II (or legacy MAX+PLUS II) design environment version supports the EP20K400 device family, and confirm PCB layout accommodates the 1.27 mm BGA pitch with proper via-in-pad or dog-bone fanout. Power sequencing of the 2.5 V VCCINT and VCCIO rails should follow Altera's application note AN-117 to avoid hot-socket damage. Long-term supply is constrained because the APEX 20K family is now in the mature/legacy lifecycle phase.

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Các biến thể trong loạt này

Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP20K400BI652-2V (cùng hình factor và footprint) — khác nhau ở Process Technology, Operating Temperature, Package, Series, Propagation Delay.

EP20K400BC652-2AA

Intel

Operating Temperature: 0 °C to 85 °C (TJ)

Package: 652-BGA

Series: APEX-20K