EP20K400FI672-2V - APEX 20K 400K FPGA, 502 I/O, 672-FBGA | Intel
MPN: EP20K400FI672-2V ✗ Cuối đờiEP20K400FI672-2V Tóm tắt
What is a FPGA? A Field-Programmable Gate Array is a type of programmable logic device (PLD) that allows designers to configure logic blocks and interconnect routing after manufacturing. FPGAs sit within the broader taxonomy of programmable logic (PLD -> CPLD -> FPGA) and serve as semiconductor building blocks for digital systems requiring parallelism, high I/O counts, and hardware-level reconfiguration. APEX 20K was historically the industry's first PLD family marketed as a System-on-a-Programmable-Chip (SOPC) platform, integrating dedicated memory blocks, a wide internal datapath, and high-speed I/O on a single die.
Key features include 212,992 embedded system bits for distributed RAM/ROM, 16,640 logic cells, a 2.5 ns propagation delay class, and up to 502 user I/O pins. The 672-pin FBGA package provides a compact high-density interconnect suitable for multi-layer PCB designs. The device supports in-system configuration via serial or parallel PROM interfaces, JTAG (IEEE 1149.1) boundary-scan, and active serial configuration modes. Because this part belongs to a mature, multi-decade product family, designers should expect stable toolchain support through the Altera Quartus II design software.
Typical applications include telecommunications line-card glue logic, industrial control backplanes, ASIC prototyping, high-density bus interfacing, and SOPC integration blocks. Its combination of embedded memory and high I/O count makes it particularly well-suited to systems that previously required multiple CPLDs and discrete glue logic. The APEX 20K 400K device also pairs naturally with high-speed SRAM and SDRAM controllers, providing an integrated memory-plus-logic subsystem on a single part.
When designing with the EP20K400FI672-2V, ensure the PCB supports the BGA fan-out routing rules and that the 2.5 V core supply is decoupled with low-ESR ceramic capacitors placed within 5 mm of each power pin. The device's I/O banks support multiple voltage standards (LVTTL, LVCMOS, PCI, SSTL), but each bank must share a single VCCIO reference. JTAG boundary-scan compliance (IEEE 1149.1) is preserved throughout the lifetime of the family, simplifying board-level test.
This page synthesizes distributor pricing, drop-in same-package variants, and practical design notes for the EP20K400FI672-2V that the manufacturer datasheet alone does not provide.
Bộ thay thế dễ dàng lắp đặt cho EP20K400FI672-2V — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP20K400FI672-2V (cùng hình factor và footprint) — khác nhau ở Operating Temperature, Package, Process Technology, Family, RoHS Status.
EP20K400FI672-2N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K400FI672-2
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K400EFI672-2N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K400EFI672-2X
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K400FG672-2
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K400FI672-2V Tỷ lệ tối đa & tính chất điện
| Family | APEX 20K |
| Device | EP20K400 |
| Logic Elements / Cells | 16640 |
| Total System Gates | 400000 |
| Embedded Memory Bits | 212992 |
| Number of I/O | 502 |
| Hộp | 672-BBGA, FCBGA |
| Pin / Ball Count | 672 |
| Điện áp cung cấp | 2.5 V |
| Process Technology | 0.22 µm CMOS |
| Propagation Delay | 2.5 ns |
| Internal Operating Frequency | 200 MHz |
| Nhiệt độ hoạt động | 0 °C to +85 °C |
| Logic Family | CMOS |
| Kiểu lắp đặt | Surface Mount (BGA) |
| Configuration Mode | Serial / Parallel / JTAG |
Cấu hình chân EP20K400FI672-2V
| Chân 1 | I/O Bank A0 — User I/O - bank A |
| Chân 168 | I/O Bank B0 — User I/O - bank B |
| Chân 335 | I/O Bank C0 — User I/O - bank C |
| Chân 502 | I/O Bank D0 — User I/O - bank D |
| Chân 503 | TDI — JTAG Test Data In (IEEE 1149.1) |
| Chân 504 | TDO — JTAG Test Data Out (IEEE 1149.1) |
| Chân 505 | TMS — JTAG Test Mode Select (IEEE 1149.1) |
| Chân 506 | TCK — JTAG Test Clock (IEEE 1149.1) |
| Chân 507 | nCONFIG — Configuration control (active-low) |
| Chân 508 | nSTATUS — Configuration status (active-low) |
| Chân 509 | CONF_DONE — Configuration done (open-drain) |
| Chân 510 | MSEL0 — Configuration mode select 0 |
| Chân 511 | MSEL1 — Configuration mode select 1 |
| Chân 512 | MSEL2 — Configuration mode select 2 |
| Chân 513 | DCLK — Configuration clock input |
| Chân 514 | DATA0 — Configuration data input |
| Chân 515 | VCCINT — Core 2.5 V supply |
| Chân 516 | VCCIO_A — I/O bank A reference voltage |
| Chân 517 | VCCIO_B — I/O bank B reference voltage |
| Chân 518 | VCCIO_C — I/O bank C reference voltage |
| Chân 519 | VCCIO_D — I/O bank D reference voltage |
| Chân 520 | VCC_PLL — PLL analog supply |
| Chân 521 | GND — Ground (one of many GND balls) |
| Chân 672 | GND — Ground (one of many GND balls) |
Ứng dụng tiêu biểu
EP20K400FI672-2V phù hợp cho 6 Áp dụngs: Telecommunications Line-Card Glue Logic, ASIC Prototyping Platform, Industrial Control Backplane Interface, High-Density Parallel Bus Bridge, System-on-a-Programmable-Chip (SOPC) Integration, Legacy Test & Measurement Instrument Backplane.
Telecommunications Line-Card Glue Logic
The EP20K400FI672-2V is well-matched to telecom line cards because its 502 user I/O and 212,992 embedded memory bits let it absorb the bus-bridging, protocol-conversion, and FIFO buffering tasks that previously required multiple CPLDs. Its 200 MHz internal operation and 2.5 ns propagation delay class support TDM bus glue at common backplane rates. The 672-FBGA footprint is dense enough to sit directly under the I/O connector array on the line card, simplifying board routing. Compared to a discrete CPLD bank, a single APEX 20K device reduces BOM count and lets designers reprogram the glue logic across hardware revisions.
Được đề xuất
ASIC Prototyping Platform
The EP20K400FI672-2V's 400,000-system-gate capacity makes it a practical host for ASIC prototyping before mask production. The 16,640 logic cells map comfortably to mid-complexity ASIC netlists, and the 212,992 embedded memory bits can emulate SRAM/ROM blocks found in the target ASIC. Quartus II synthesis flows accept Verilog and VHDL and produce bitstreams that run on the 672-FBGA part in-system. Designers benefit from in-system JTAG reconfiguration between test vectors, replacing weeks of fab time with minutes of FPGA compile.
Được đề xuất
Industrial Control Backplane Interface
Industrial backplanes with mixed LVTTL, LVCMOS, PCI, and SSTL signal levels fit naturally into the EP20K400FI672-2V's I/O bank architecture, where each bank shares a single VCCIO reference. The 502 I/O allow a single FPGA to bridge a parallel backplane bus, a serial management channel, and a discrete I/O ring simultaneously. Its 0-85 °C commercial temperature range is adequate for controlled cabinet environments, while the industrial-grade EP20K400EFI672-2N sibling extends coverage to factory-floor deployments. Compared to a multi-CPLD solution, the APEX 20K consolidates logic and shortens signal-trace lengths.
Được đề xuất
High-Density Parallel Bus Bridge
Bridging wide parallel buses (32-bit, 64-bit, and wider) into a processor or memory subsystem is a classic APEX 20K use case. The EP20K400FI672-2V provides 502 I/O, of which 400+ can be dedicated to a multi-byte parallel bus plus side-band control, while the remaining I/O implement the bridge protocol in hardware. The 212,992 embedded memory bits are usable as write/posting buffers to absorb bursts without external FIFOs. Quartus II's MegaWizard Plug-In Manager generates parameterized FIFO blocks that compile directly into the device's ESB resources.
Được đề xuất
System-on-a-Programmable-Chip (SOPC) Integration
APEX 20K was the first PLD family marketed as an SOPC platform, and the EP20K400FI672-2V continues that role by integrating processor-cores (NIOS-like soft cores in Quartus), memory blocks, and peripheral logic on one die. Its 400K-gate capacity and 212,992 embedded bits can host a soft 32-bit processor plus on-chip RAM, leaving the 502 I/O free for external peripheral integration. The JTAG boundary-scan interface simplifies multi-core debug across the SOPC subsystem. Designers using the Cyclone series in new designs can also use the APEX 20K as a low-cost reference benchmark.
Được đề xuất
Legacy Test & Measurement Instrument Backplane
Test & measurement mainframes with VXI, PXI, or proprietary parallel backplanes benefit from the EP20K400FI672-2V's high I/O density and reconfigurable logic. Each instrument slot can host a single APEX 20K part that implements the slot's stimulus/response logic and front-panel data path. The 672-FBGA footprint concentrates logic into a single small area, leaving room for analog front-end components. Designers can re-spin test routines by simply recompiling the Quartus bitstream, avoiding board respins. Industrial-temp variants support laboratory and field-deployed instrument families.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP20K400FI672-2V — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP20K400FI672-2N | EP20K400FI672-2 | EP20K400EFI672-2N | EP20K400EFI672-2X | EP20K400FG672-2 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-BBGA, FCBGA | 672-BBGA, FCBGA - same | 672-BBGA, FCBGA - same | 672-BBGA, FCBGA - same | 672-BBGA, FCBGA - same | 672-BBGA, FCBGA - same |
| Logic Cells | 16640 | 16640 | 16640 | 16640 | 16640 | 16640 |
| System Gates | 400000 | 400000 | 400000 | 400000 | 400000 | 400000 |
| User I/O | 502 | 502 | 502 | 502 | 502 | 502 |
| Embedded Memory Bits | 212992 | 212992 | 212992 | 212992 | 212992 | 212992 |
| Speed Grade | -2V | -2N (slower) | -2 | -2N (slower) | -2X (faster) | -2 |
| Operating Temperature | 0 to +85 °C (commercial) | 0 to +85 °C (commercial) | 0 to +85 °C (commercial) | -40 to +100 °C (industrial) | -40 to +100 °C (industrial) | 0 to +85 °C (commercial) |
Bảo phân biệt quan trọng
- Largest logic capacity in the 672-BGA APEX 20K family (vsEP20K300EFC672-2)
- Maximum user I/O count among commercial APEX 20K parts (vsEP20K400BC652-3)
- Industrial-temp drop-in alternative available (vsEP20K400EFI672-2N)
- Faster speed grade than the -2N sibling (vsEP20K400FI672-2N)
Ghi chú thiết kế
The 672-BGA package requires multi-layer PCB with microvia or via-in-pad technology for inner-row escape routing. Use a 4/4 mil (0.1/0.1 mm) etch/spacing rule with controlled-impedance layers to support the JTAG TAP and high-speed I/O standards (LVTTL, LVCMOS, PCI, SSTL). Place 2.5 V core decoupling capacitors (10 µF bulk + 0.1 µF ceramic) within 5 mm of each VCCINT pin cluster. VCCIO per-bank reference capacitors should also be local to their respective balls to limit switching-induced supply droop.
Estimated: the EP20K400FI672-2V in the 672-FBGA has a typical θJA of approximately 12-15 °C/W with proper thermal via array under the package center. For continuous operation near full 502-I/O switching, design with at least 9 thermal vias (0.3 mm drill, 1.0 mm pitch) under the die flag, tied to an internal copper plane. Add airflow or a heatsink for designs that run above 25 °C ambient. The industrial-temp sibling EP20K400EFI672-2N provides the same thermal envelope but with an extended -40 °C to +100 °C rating.
Do not confuse the EP20K400FI672 family (672-BGA) with the EP20K400BC652 family (652-BGA) when migrating PCBs - they share the same silicon family but the pinouts and ball maps differ. Also, the speed-grade letter must match across the design: the -2V (faster) and -2N (slower) parts both fit the same 672-BGA footprint but their Quartus II timing models differ. Always re-run Quartus timing analysis after swapping the speed grade. For JTAG operation, ensure TMS and TCK have 10 kΩ pull-ups to VCCIO; missing pull-ups can cause configuration failures.
Group I/O banks by signaling standard to simplify PCB routing: dedicate one bank to LVTTL/LVCMOS parallel data, a second bank to PCI or SSTL memory interface, and a third to slower control I/O. This minimizes reference-voltage (VCCIO) islands and keeps impedance-continuous traces within each bank. Keep JTAG chain signals (TDI/TDO/TMS/TCK) short and away from switching I/O to avoid noise coupling into the TAP state machine. Series 33 Ω resistors on JTAG lines improve signal integrity in long chains.
Thông tin tuân thủ
RoHS / REACH / lead-free status not explicitly stated in the verified distributor data; consult Intel product page or request compliance certificate from supplier. AEC-Q100 not applicable (commercial/industrial FPGA, not automotive qualified). The part is in NRND (Not Recommended for New Designs) lifecycle status as of 2026-09-08.