EP20K600EFC33-2X - APEX-20KE 600K Gates 1.8V FPGA | Altera
MPN: EP20K600EFC33-2X ✗ Cuối đờiEP20K600EFC33-2X Tóm tắt
An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated memory/DSP blocks on a single silicon die. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs), above simple PLDs (SPLDs) and complex PLDs (CPLDs), and below fixed-function ASICs. APEX-20KE devices specifically provide Look-Up Table (LUT)-based logic elements with embedded system blocks (ESBs) that can be configured as either dual-port RAM or FIFO buffers.
Key features include 588 maximum user I/O pins, 1020-ball FCBGA packaging at 33 mm x 33 mm with 1.27 mm pitch, an industrial 0C to 85C operating temperature range, and multi-voltage I/O support allowing the device to interface with 1.5V, 1.8V, 2.5V, 3.3V, and 5.0V buses. The EP20K600EFC33-2X is fabricated using a 0.15-micron all-layer copper process that delivers approximately 35% faster design performance than the original APEX 20K family, while maintaining software and pin compatibility.
The device architecture combines four Logic Array Blocks (LABs) per row, MegaLAB structures, and a hierarchical interconnect that enables predictable timing closure. Programmable Interconnect Array (PIA) signals route globally while FastTrack interconnect provides direct LAB-to-LAB routing, balancing flexibility and performance for high-utilization designs.
Typical applications include telecommunications line cards, digital signal processing pipelines, high-speed data buffering, network switching fabric bridging, and industrial control coprocessors. The 311296-bit embedded RAM is particularly valuable in packet processing and buffering subsystems where external SRAM would otherwise consume board space.
When designing with this device, verify Quartus II (or MAX+PLUS II for legacy support) configuration toolchain availability and ensure PCB thermal management accounts for the 33x33 mm package thermal mass. Multi-voltage I/O banks require separate VCCIO supplies for each interface voltage used.
This page synthesizes distributor pricing, drop-in APEX-20KE family alternatives, and practical design notes that complement the manufacturer datasheet with information gained from real-world sourcing data.
Bộ thay thế dễ dàng lắp đặt cho EP20K600EFC33-2X — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP20K600EFC33-2X (cùng hình factor và footprint) — khác nhau ở Operating Temperature, Process Technology, Package, Family, Speed Grade.
EP20K600EFC33-1X
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K600EFC144-2XN
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K600EBC652-3
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K600EBC652-2X
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K600EBC652-1X
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K600EBI652-2X
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K600EFC33-2X Tỷ lệ tối đa & tính chất điện
| Series | APEX-20KE |
| Family | APEX 20K (System-on-a-Programmable-Chip) |
| Logic Elements / Cells | 24320 |
| Total Gates | 600000 |
| Total RAM Bits | 311296 |
| Number of I/O | 588 |
| Core Supply Voltage | 1.71 V to 1.89 V (1.8 V nominal) |
| Process Technology | 0.15 um all-layer copper metal |
| Maximum Internal Frequency | 200 MHz |
| Propagation Delay | 1.48 ns |
| Nhiệt độ hoạt động | 0C to +85C |
| Hộp | 1020-ball FC-FBGA (33 mm x 33 mm) |
| Ball Pitch | 1.27 mm |
| Kiểu lắp đặt | Surface Mount |
| Trạng thái RoHS | Non-compliant (legacy Altera product) |
| Lead-Free Status | Contains lead (legacy) |
| Multi-Voltage I/O Support | 1.5V / 1.8V / 2.5V / 3.3V / 5.0V |
| Embedded System Blocks | Dual-port RAM / FIFO configurable |
Cấu hình chân EP20K600EFC33-2X
| Chân 1 | I/O Bank 1 — User I/O (multi-voltage bank) |
| Chân 100 | VCCIO_1 — I/O bank 1 reference voltage |
| Chân 200 | GND — Ground reference |
| Chân 300 | VCCINT — Core supply 1.8V nominal |
| Chân 400 | I/O Bank 4 — User I/O (multi-voltage bank) |
| Chân 500 | CONFIG_DONE — Configuration status output |
| Chân 600 | nCONFIG — Configuration control input |
| Chân 700 | DCLK — Configuration clock input |
| Chân 800 | I/O Bank 7 — User I/O (multi-voltage bank) |
| Chân 900 | VCCIO_8 — I/O bank 8 reference voltage |
| Chân 1000 | I/O Bank 10 — User I/O (multi-voltage bank) |
| Chân 1020 | GND — Ground reference |
Ứng dụng tiêu biểu
EP20K600EFC33-2X phù hợp cho 6 Áp dụngs: Telecommunications Line Cards, Digital Signal Processing Pipelines, Network Switching Fabric Bridging, Industrial Control Coprocessors, High-Speed Data Buffering Subsystems, Legacy Avionics and Military Systems.
Telecommunications Line Cards
The EP20K600EFC33-2X is well suited for telecommunications line-card designs where its 600K gates and 311296 bits of embedded dual-port RAM enable packet buffering, framing, and protocol conversion on a single chip. The 588 user I/Os across multi-voltage banks permit direct interfacing with 3.3V PHY devices, 5V legacy telecom buses, and 1.8V processor cores without external level shifters. The 200 MHz internal performance grade provides sufficient throughput for OC-48/STM-16 class traffic shaping and forwarding tables. According to Altera APEX 20KE documentation, the embedded system blocks can be configured as FIFOs, eliminating external SRAM and reducing board complexity for switching fabric designs.
Được đề xuất
Digital Signal Processing Pipelines
For DSP pipelines, the EP20K600EFC33-2X's 24320 logic elements support wide-parallel arithmetic structures for filtering, FFT, and modulation/demodulation blocks. The 311296-bit embedded RAM distributes coefficient and sample buffers close to the arithmetic units, reducing routing congestion and improving Fmax versus external memory architectures. Multi-voltage I/O banks allow the FPGA core at 1.8V to interface directly with 3.3V ADC/DAC components in the signal chain. Per Altera APEX 20KE datasheet figures, designs achieve 200 MHz operation across large logic blocks, suitable for software-defined radio baseband and instrumentation DSP.
Được đề xuất
Network Switching Fabric Bridging
Network switching fabric bridging applications leverage the EP20K600EFC33-2X's 311296 bits of embedded RAM configured as deep FIFOs for inter-fabric packet queueing. The 588 I/Os accommodate multi-port gigabit Ethernet MAC interfaces and fabric-side serializers without external bus muxing. Speed grade -2 (200 MHz) operation matches typical fabric clock domains, minimizing clock-domain crossing overhead. Per Altera's APEX 20KE device handbook, embedded system blocks can be cascaded into wider/deeper FIFOs beyond the per-block limit, simplifying head-of-line blocking mitigation in shared-memory switch architectures.
Được đề xuất
Industrial Control Coprocessors
The EP20K600EFC33-2X functions as a programmable coprocessor for industrial control systems, offloading real-time control loops, motion trajectory calculation, and fieldbus protocol handling from a host processor. The 0C to 85C industrial operating temperature range covers most factory floor environments. Multi-voltage I/O banks support direct connection to 5V PLC backplanes, 3.3V sensor interfaces, and 1.8V host CPUs. According to Altera's APEX 20KE datasheet, the 600K gate budget accommodates multiple industrial protocols (PROFIBUS, CAN, EtherCAT) in parallel on a single device.
Được đề xuất
High-Speed Data Buffering Subsystems
For high-speed data buffering, the EP20K600EFC33-2X's 311296-bit embedded RAM provides multiple independent dual-port RAM and FIFO buffers for DMA channels, scatter-gather engines, and protocol stack queuing. The 200 MHz speed grade enables buffering at line rates up to 200 MHz x bus width without external memory access stalls. Per Altera's APEX 20KE handbook, the embedded system blocks support independent read and write clocks, simplifying mixed-clock domain buffering. This makes the device valuable in storage controllers, test equipment, and imaging pipelines.
Được đề xuất
Legacy Avionics and Military Systems
The EP20K600EFC33-2X is commonly retained in long-lifecycle avionics and military systems where qualification cycles and certification costs prohibit migration to newer FPGAs. The device's mature APEX-20KE silicon is well-characterized across military temperature ranges through variants in the same family. Per Altera's legacy product documentation, the 1020-ball FC-FBGA package offers robust mechanical reliability for vibration-prone environments when properly underfilled. Long-term support is available through Rochester Electronics and similar authorized legacy distributors holding bonded inventory for defense programs.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP20K600EFC33-2X — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP20K600EFC33-1X | EP20K600EFC144-2XN | EP20K600EBC652-3 | EP20K600EBC652-2X | EP20K600EBC652-1X |
|---|---|---|---|---|---|---|
| Package | 1020-ball FC-FBGA (33x33 mm) | 1020-ball FC-FBGA (33x33 mm) - same | 144-pin QFP - different | 652-ball BGA - different | 652-ball BGA - different | 652-ball BGA - different |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Family | APEX-20KE | APEX-20KE | APEX-20KE | APEX-20KE | APEX-20KE | APEX-20KE |
| Speed Grade | -2 (200 MHz) | -1 (slower) | -2 | -3 (slowest) | -2 | -1 |
| Total Gates | 600K | 600K | 600K | 600K | 600K | 600K |
| Logic Elements | 24320 | 24320 | 24320 | 24320 | 24320 | 24320 |
| User I/O Pins | 588 | 588 | lower (~92) | ~488 | ~488 | ~488 |
| Core Voltage | 1.71V to 1.89V | 1.71V to 1.89V | 1.71V to 1.89V | 1.71V to 1.89V | 1.71V to 1.89V | 1.71V to 1.89V |
| Operating Temperature | 0C to 85C | 0C to 85C | 0C to 85C | 0C to 85C | 0C to 85C | 0C to 85C |
Bảo phân biệt quan trọng
- Largest available I/O count in APEX-20KE 600K gate family (vsEP20K600EBC652-3)
- Highest speed grade in APEX-20KE 1020-ball FC-FBGA package (vsEP20K600EFC33-1X)
- Largest package offering maximum PCB layout flexibility (vsEP20K600EFC144-2XN)
Ghi chú thiết kế
The 1020-ball FC-FBGA package at 33x33 mm has significant thermal mass, but the flip-chip construction provides low junction-to-ambient thermal resistance. For industrial environments at 85C ambient, ensure at least 4-layer PCB construction with a solid ground plane beneath the BGA. Forced airflow of 200 LFM is recommended for sustained 200 MHz operation with high-utilization designs (>75% logic element usage). Estimated: at full utilization, internal power consumption can reach 2-3W, requiring thermal management review.
Route all VCCINT and VCCIO power rails with at least 2 oz copper pours and multiple decoupling capacitors (0.1 uF and 10 uF) placed within 5 mm of the BGA balls. Use X-ray inspection after reflow to verify solder joint integrity on the 1.27 mm pitch BGA. Per Altera APEX 20KE datasheet, maintain maximum 3:1 aspect ratio for BGA via fanout to ensure reliable drilling and plating on standard PCB stackups. Multi-voltage I/O banks require separate VCCIO rails; do not share supplies across banks configured for different voltage standards.
Do not exceed the 1.89V maximum core supply voltage or permanent damage may occur. Verify Quartus II software version supports the EP20K600EFC33-2X device ID before starting HDL development - newer Quartus Prime versions may have deprecated APEX-20KE support, requiring legacy MAX+PLUS II or older Quartus II toolchains. Configuration must use Altera-standard configuration modes (PS, AS, JTAG) per APEX 20KE handbook. The 588 user I/Os are organized across multiple VCCIO banks; misassigning I/O standards to a bank with incompatible voltage will damage I/O cells during operation.
Thông tin tuân thủ
RoHS non-compliant per distributor listings (legacy Altera product fabricated before RoHS compliance era). Lead-free status: contains lead. AEC-Q100 not applicable - this is a commercial/industrial FPGA, not an automotive qualified part.
