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Intel

EP2AGX260FF35I3G - Arria II GX FPGA, 244K LE, 1152-FBGA | Intel

MPN: EP2AGX260FF35I3G ⚠ Lần mua cuối
0.9 V Vdss 1152-BBGA, FCBGA Package I3 Speed 12038144 Memory
MOQ: 1 |

EP2AGX260FF35I3G Tóm tắt

The Intel (formerly Altera) EP2AGX260FF35I3G is a high-density Arria II GX Field-Programmable Gate Array (FPGA) built on a 40 nm process, integrating 244,188 logic elements, 12,038,144 bits of embedded memory, and 612 user I/O pins in a 1152-ball FineLine Ball-Grid Array (FC-FBGA) package. The Arria II GX family is engineered for high-throughput serial connectivity, providing up to 16 transceivers at data rates suitable for PCI Express Gen2, Serial RapidIO, and multi-gigabit serial interfaces in a single programmable device. The device operates from a 0.9 V core supply with separate transceiver and auxiliary rails, and the speed grade 3 (I3) variant balances timing margin and maximum frequency for industrial temperature operation.

An FPGA (Field-Programmable Gate Array) is a semiconductor device containing configurable logic blocks, programmable interconnect, and dedicated hard IP such as transceivers and memory blocks. FPGAs occupy the top of the programmable-logic taxonomy: PLA -> CPLD -> FPGA -> SoC FPGA, and are widely used when time-to-market and design flexibility outweigh the per-unit cost advantage of an ASIC. The Arria II GX family specifically targets the mid-range transceiver-integrated segment between Cyclone (low cost) and Stratix (highest performance).

Key features include embedded transceivers, hard PCI Express Gen2 IP cores, embedded memory blocks with byte-enable parity, dedicated DSP blocks for high-throughput signal processing, and configuration support via JTAG, Active Serial, Passive Serial, and Fast Passive Parallel modes. The device supports hot-socketing and in-system programming for production-line flexibility. Industrial temperature grade (I3 suffix) supports -40 C to +100 C operation, while the trailing G indicates lead-free / RoHS-compliant lead finish on the BGA balls.

Typical applications include wireless baseband processing, high-speed serial bridging between ASICs, military radar signal processing, broadcast video engines, and PCI Express endpoint / root-port prototyping. For new designs, designers should consider migrating to Intel Cyclone V GT, Arria V GX, or Arria 10 GX families, as Arria II GX is in its end-of-life window and is increasingly sourced through distributors rather than direct Intel channels.

A practical design tip: Arria II GX transceivers require careful attention to reference-clock jitter and PCB stack-up for the channel. Use the Quartus II transceiver toolkit to characterize link margin, and de-rate the line rate by at least 10-15% during board bring-up to absorb manufacturing tolerance.

This page synthesizes distributor stock and pricing, parametric alternatives, and design notes not found in the Altera Arria II GX Device Handbook, providing an at-a-glance procurement reference for engineers and NPI buyers evaluating this legacy high-density FPGA.

Bộ thay thế dễ dàng lắp đặt cho EP2AGX260FF35I3G — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.

Các biến thể trong loạt này

Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP2AGX260FF35I3G (cùng hình factor và footprint) — khác nhau ở Package, Operating Temperature, Speed Grade, Process Technology, Family.

Altera
Package: 1152-ball FC-FBGA (FF35), 35 mm body
Operating Temperature: -40 °C to +100 °C (industrial, suffix I)
Speed Grade: 3
So sánh với EP2AGX260FF35I3G →
Intel
Operating Temperature: -40C to +100C (Industrial)
Family: Arria II GX
So sánh với EP2AGX260FF35I3G →
Intel
Package: 1152-BBGA, FC-FBGA
Operating Temperature: 0C to +85C (Commercial)
Family: Intel (Altera) Arria II GX
So sánh với EP2AGX260FF35I3G →
Intel
Package: 1152-ball FCBGA (FF35)
Speed Grade: C5 (mid-speed)
Family: Arria II GX (EP2AGX260)
So sánh với EP2AGX260FF35I3G →
Intel
Speed Grade: 6
Process Technology: 40 nm CMOS
So sánh với EP2AGX260FF35I3G →
Intel
Package: 1152-BBGA, FCBGA (35 x 35 mm)
Operating Temperature: -40C to +100C (industrial, I3)
Process Technology: CMOS
So sánh với EP2AGX260FF35I3G →
Altera
Package: 1152-ball FBGA (FF35)
Speed Grade: I3 (Industrial -40C to +100C)
Process Technology: 40 nm TSMC
So sánh với EP2AGX260FF35I3G →
Intel
Package: 1152-ball FC-FBGA (FF35), 35 mm body
Operating Temperature: -40C to +100C (Industrial, I5 grade)
Process Technology: 40 nm TSMC
So sánh với EP2AGX260FF35I3G →
Intel
Package: 1152-ball FC-FBGA
Operating Temperature: -40C to +100C (Industrial)
Family: Arria II GX
So sánh với EP2AGX260FF35I3G →
Intel
Package: 1152-BGA (FBGA, FineLine BGA)
Operating Temperature: -40C to +100C (Industrial)
Process Technology: 40 nm TSMC
So sánh với EP2AGX260FF35I3G →
Intel
Package: 1152-ball FBGA (FF35)
Operating Temperature: -40C to +100 C (I3 industrial)
Family: Arria II GZ
So sánh với EP2AGX260FF35I3G →

EP2AGX260FF35I5N

✅ Drop-In
Intel
📦 1152-FBGA (FF35)
Arria II GX · 244,188 · 12,038,144 · 10260 · 612 · 8 · 6.375 Gbps · 0.9 V

Liên hệ để biết giá

Xem tài liệu →

EP2AGX260FF35C6N

✅ Drop-In
Intel
📦 1152-FBGA (FF35)
FPGA - Field Programmable Gate Array · Arria II GX · 244,188 · 10,260 · 612 · 12,038,144 · 400 MHz · 40 nm CMOS

Liên hệ để biết giá

Xem tài liệu →

EP2AGX260FF35C5G

✅ Drop-In
Intel
📦 1152-FBGA (FF35)
Arria II GX · Arria II GX (EP2AGX260) · 244,188 · 12,038,144 · 612

Liên hệ để biết giá

Xem tài liệu →

EP2AGX260FF35C4G

✅ Drop-In
Intel
📦 1152-FBGA (FF35)
Arria II GX · Intel (Altera) Arria II GX · 0.9 V · 40 nm · 244,188 · 12,038,144 (approximately 12 Mbit) · 10,260

Liên hệ để biết giá

Xem tài liệu →

EP2AGX260EF29I3G

✅ Drop-In ⚠️ Thông số chưa được xác minh
Intel
📦 1152-FBGA (EF29)
Arria II GX · Arria II GX · 244,188 · 12,038,144 · 372 · 40 nm

Liên hệ để biết giá

Xem tài liệu →

EP2AGX190FF35I3G

✅ Drop-In
Altera
📦 1152-FBGA (FF35)
Arria II GX · 181,165 · 612 · 10,177,536 · 8 high-speed transceiver channels (multi-gigabit)

Liên hệ để biết giá

Xem tài liệu →

EP2AGX260FF35I3G Tỷ lệ tối đa & tính chất điện

Device Family Arria II GX
Logic Elements 244188
Embedded Memory Bits 12038144
Maximum User I/O 612
Hộp 1152-BBGA, FCBGA
Process Technology 40 nm
Core Supply Voltage 0.9 V
Speed Grade I3
Nhiệt độ hoạt động -40 C to +100 C (Industrial)
Kiểu lắp đặt Surface Mount
Configuration JTAG / Active Serial / Passive Serial / FPP
Lead-Free (RoHS) Yes (G suffix indicates Pb-free finish)

Hướng dẫn cấu hình chân EP2AGX260FF35I3G 1152-bbga, fcbga

Cấu hình chân cho EP2AGX260FF35I3G (1152-bbga, fcbga gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.

Bảng cấu hình chân 1152-bbga, fcbga cho EP2AGX260FF35I3G

Không có dữ liệu chân cụ thể sẵn có cho EP2AGX260FF35I3G.

Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.

Ứng dụng tiêu biểu

EP2AGX260FF35I3G phù hợp cho 7 Áp dụngs: Wireless Baseband Processing, PCI Express Endpoint and Root Port, High-Speed Serial Bridging, Broadcast Video Processing Engine, Military Radar Signal Processing, Industrial Camera Frame Grabber, Embedded Test and Measurement Instrumentation.

🌐

Wireless Baseband Processing

The EP2AGX260FF35I3G's 244K logic elements and integrated transceivers up to 6.375 Gbps support CPRI / OBSAI baseband processing for picocell and small-cell base stations. Designers partition the PHY layer into the FPGA's hard transceiver channels and use the abundant logic and embedded memory for symbol-rate processing, encryption acceleration, and framer/deframer logic. The 1152-FBGA 'FF35' package provides 612 user I/O for parallel interface to RF front ends and backhaul Ethernet PHYs. Industrial temperature grade (I3 suffix) supports outdoor and environmentally exposed deployment. For new designs, consider migrating to Arria 10 GX which offers higher logic density and transceivers up to 28 Gbps.

🖥️

PCI Express Endpoint and Root Port

Arria II GX devices integrate a hard PCI Express Gen2 IP core, enabling the EP2AGX260FF35I3G to implement Gen2 x4 or x8 endpoints in industrial and embedded computing applications such as DSP accelerator cards, frame grabbers, and signal-acquisition modules. The hard IP core consumes minimal logic, freeing the 244K LEs and DSP blocks for application-specific processing. The 1152-FBGA 'FF35' package routes the high-speed serial lanes with controlled-impedance differential pairs, simplifying PCB layout. Designers use Quartus II IP Compiler to instantiate the hard core and configure BAR mapping.

🔧

High-Speed Serial Bridging

With multi-gigabit transceiver channels, the EP2AGX260FF35I3G serves as a bridge between incompatible serial protocols such as Serial RapidIO, Aurora, and proprietary multi-gigabit links. Common bridging scenarios include ASIC-to-ASIC connectivity across board boundaries, FPGA-fabric expansion links, and protocol-conversion test fixtures. The 244K logic elements support full state-machine depth for link-layer arbitration, while the embedded memory blocks provide elastic buffering across clock domains. Industrial temperature grade allows deployment in chassis-mounted line cards without thermal derating.

📺

Broadcast Video Processing Engine

The EP2AGX260FF35I3G handles real-time broadcast video workloads including SDI de-embedding / embedding, color-space conversion, and frame-rate conversion. The dedicated DSP blocks accelerate FIR filters and chroma resampling, while the abundant embedded memory (12 Mbit) holds multiple video frames for pipelined processing. Serial transceiver channels accept SDI (Serial Digital Interface) at 270 Mbps / 1.5 Gbps / 3 Gbps without external deserializer. The 1152-FBGA 'FF35' package routes the high-speed SDI inputs alongside HDMI / DVI parallel interfaces. Designers use the Altera Video and Image Processing Suite IP cores to accelerate time-to-market.

✈️

Military Radar Signal Processing

The Arria II GX family is widely deployed in military radar and electronic-warfare systems because the industrial temperature grade (I3 suffix) and lead-free RoHS-compliant finish (G suffix) meet MIL-STD and IPC Class 3 assembly requirements. The 244K logic elements and DSP blocks perform pulse compression, moving-target-indication (MTI) filtering, and FFT-based beam forming on digitized IF samples. Serial transceiver channels digitize phased-array antenna data at multi-gigabit rates. The 1152-FBGA 'FF35' package supports chip-on-board and PCB-embedded assembly common in aerospace hardware. Note that Arria II GX requires ITAR review for export.

🎥

Industrial Camera Frame Grabber

Machine-vision and industrial inspection cameras use the EP2AGX260FF35I3G to capture Camera Link, CoaXPress, or GigE Vision streams and pre-process them before forwarding to a host CPU. The transceiver channels handle CoaXPress uplink/downlink, while parallel LVDS pairs accept Camera Link Full/Medium/Base data. The 244K logic elements implement format conversion, defect detection, and compression offload, while embedded memory buffers full frames for image processing pipelines. Industrial temperature grade and lead-free finish suit factory-floor deployment.

🧩

Embedded Test and Measurement Instrumentation

High-end protocol analyzers and bit-error-rate testers use the EP2AGX260FF35I3G as a flexible pattern generator and analyzer across multiple serial standards. Designers re-purpose the transceiver channels to monitor or generate PCI Express, SATA, USB 3.0, or custom protocols from a single instrument. The 244K logic elements implement protocol-aware decoding and event timestamping. The 1152-FBGA 'FF35' package provides ample I/O for trigger signals and front-panel controls. Industrial temperature grade supports bench and field deployment without thermal design compromises.

Tóm tắt các sản phẩm được đề xuất

EP4CE22F17C6N Companion low-cost Cyclone IV for housekeeping / management plane Được sử dụng trong: Wireless Baseband Processing EP2AGX260FF35C5G Intel Được sử dụng trong: Wireless Baseband Processing EP4CE40F23C8N Intel Được sử dụng trong: PCI Express Endpoint and Root Port EP2AGX190FF35I3G Altera Được sử dụng trong: High-Speed Serial Bridging EP4CE30F23I7N Companion Cyclone IV for control plane and housekeeping Được sử dụng trong: Broadcast Video Processing Engine EP4CE15F17I7N Companion low-power Cyclone IV for power management / housekeeping Được sử dụng trong: Military Radar Signal Processing EP2AGX125EF35I3G Intel Được sử dụng trong: Industrial Camera Frame Grabber EP2AGX45DF29I5N Intel Được sử dụng trong: Embedded Test and Measurement Instrumentation
What is the logic element count of EP2AGX260FF35I3G?
The EP2AGX260FF35I3G contains 244,188 logic elements (LEs), along with 12,038,144 embedded memory bits and 612 maximum user I/O pins. According to the Altera Arria II GX Device Handbook, the EP2AGX260 is the highest-density member of the Arria II GX family, positioned for high-throughput transceiver-based designs.
What package does EP2AGX260FF35I3G use?
The EP2AGX260FF35I3G uses a 1152-ball FineLine BGA (FC-FBGA / 1152-BBGA) package. The 'FF35' suffix identifies this specific FC-FBGA ball pattern; the 'I3' suffix indicates industrial temperature and speed grade 3, and 'G' denotes lead-free / RoHS-compliant ball finish.
Is EP2AGX260FF35I3G still in production by Intel?
The EP2AGX260FF35I3G (Arria II GX family) is in Intel's last-time-buy / end-of-life window. New designs should evaluate Arria V GX, Arria 10 GX, or Cyclone V GT as forward-compatible alternatives, since long-term inventory is sourced from authorized distributors rather than direct Intel channels.
Where can I buy EP2AGX260FF35I3G online?
Authorized distributors for the EP2AGX260FF35I3G include DigiKey (SKU 9960626), Mouser, Arrow Electronics, and Octopart-listed brokers. As of 2026-09-08, distributor listings indicate limited inventory at premium prices; lead time for large-quantity orders typically ranges from 8 to 16 weeks.
What is the price of EP2AGX260FF35I3G?
The unit price for the EP2AGX260FF35I3G as of 2026-09-08 ranges from approximately USD 2,850 at qty-1 to USD 1,985 at qty-1,000 based on aggregated distributor data. Pricing varies with stock; verified stockists include DigiKey, Mouser, and Arrow. Always confirm current quote before procurement.
What is the lead time for EP2AGX260FF35I3G?
Lead time for the EP2AGX260FF35I3G varies by distributor and stock. Authorised distributors such as DigiKey and Mouser typically ship from existing inventory within 1-2 weeks, while bulk orders may require 8-16 weeks as of 2026-09-08. Verify per order with the supplier.
What is the difference between EP2AGX260FF35I3G and EP2AGX260FF35I3N?
The EP2AGX260FF35I3G and EP2AGX260FF35I3N differ only in lead-free status: the G suffix denotes lead-free / RoHS-compliant ball finish, while the N suffix denotes a non-RoHS tin-lead finish. Both share the same silicon, 1152-FBGA package, and I3 speed grade. Choose G for RoHS-compliant assemblies, N for legacy or military use where tin-lead solder is required.
How does EP2AGX260FF35I3G compare to EP2AGX190FF35I3G?
The EP2AGX260FF35I3G has a higher logic element count than the EP2AGX190FF35I3G; both share the same Arria II GX architecture, 1152-FBGA 'FF35' package pattern, I3 speed grade, and transceiver capability. For designs that do not need the larger logic capacity, the EP2AGX190 is a lower-cost option within the same footprint.
What is the best drop-in replacement for EP2AGX260FF35I3G?
The closest drop-in replacement for the EP2AGX260FF35I3G within the same 1152-FBGA 'FF35' footprint is the EP2AGX260FF35C6N (commercial temperature, speed grade 6) or EP2AGX260FF35C5G. Both share identical pinout and silicon to the I3G, differing only in temperature grade and speed grade. For lower logic capacity, the EP2AGX190FF35I3G is also pin-compatible.
Can EP2AGX260FF35C6G replace EP2AGX260FF35I3G?
The EP2AGX260FF35C6G is pin-to-pin compatible with the EP2AGX260FF35I3G in the 1152-FBGA 'FF35' package, but the C6 suffix indicates commercial temperature (0 C to +85 C) and speed grade 6. The original I3G is industrial (-40 C to +100 C) and speed grade 3. The replacement is acceptable only when the application does not require industrial temperature range or higher speed margin.
Where to download EP2AGX260FF35I3G datasheet PDF?
The Altera / Intel Arria II GX Device Handbook is the primary datasheet PDF for the EP2AGX260FF35I3G, available at the official Altera literature archive. Third-party datasheet mirrors are also available from LCSC Electronics. Refer to the device-specific tables for electrical characteristics and pin connection guidelines.
Where to find EP2AGX260FF35I3G pinout?
The EP2AGX260FF35I3G pinout for the 1152-FBGA 'FF35' package is documented in the Altera Arria II GX Device Handbook pin connection guidelines section. The pinout is identical across all speed grades (I3/I5/C4/C5/C6) and lead-free options (G/N) within the FF35 package pattern, enabling drop-in substitution.
What is the maximum transceiver data rate of EP2AGX260FF35I3G?
The Arria II GX transceiver channels support data rates up to 6.375 Gbps, enabling PCI Express Gen2, Serial RapidIO 2.0, and multi-gigabit serial interfaces. The actual achievable rate depends on the I3 speed grade margin, reference-clock jitter, and PCB channel loss. Designers should de-rate by 10-15% for production margin.
What are the key specifications of EP2AGX260FF35I3G that engineers should know?
The EP2AGX260FF35I3G integrates 244,188 logic elements, 12,038,144 bits of embedded memory, 612 maximum user I/O, transceivers up to 6.375 Gbps, hard PCI Express Gen2 IP cores, and DSP blocks, all in a 1152-FBGA package with 0.9 V core supply, industrial temperature range, and lead-free RoHS-compliant ball finish.
What is the best Xilinx equivalent for EP2AGX260FF35I3G?
There is no exact Xilinx pin-compatible cross for the EP2AGX260FF35I3G in the 1152-FBGA 'FF35' footprint; Xilinx Virtex-6 or Kintex-7 series provide comparable logic density and transceiver capability but in different BGA packages. A board redesign is required for Xilinx migration; designers should not assume pin compatibility across vendors.

Dữ liệu tham khảo kỹ thuật cho EP2AGX260FF35I3G — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.

Hướng dẫn chọn lựa

Choose the EP2AGX260FF35I3G when you need the highest-density Arria II GX device in the 1152-FBGA 'FF35' package with industrial temperature grade and RoHS-compliant lead-free finish for industrial, broadcast, or military applications. Choose the EP2AGX260FF35I5N if you do not need the I3 speed grade and can accept the I5 timing margin. Choose the EP2AGX260FF35C6N / C5G / C4G if your application is commercial temperature (0 to +85 C); the C4G is the fastest speed grade in this family. Choose the EP2AGX190FF35I3G if your design does not require the full 244K logic elements. For new designs, evaluate migration to Arria V GX or Arria 10 GX as Arria II GX is in its last-time-buy window.

So sánh với các sản phẩm thay thế

Tham số Sản phẩm này EP2AGX260FF35I5N EP2AGX260FF35C6N EP2AGX260FF35C5G EP2AGX260FF35C4G EP2AGX190FF35I3G
Brand Intel Intel Intel Intel Intel Intel
Package 1152-FBGA (FF35) 1152-FBGA (FF35) - same 1152-FBGA (FF35) - same 1152-FBGA (FF35) - same 1152-FBGA (FF35) - same 1152-FBGA (FF35) - same
Speed Grade I3 I5 (slower) C6 C5 C4 (fastest) I3
Temperature Grade Industrial -40 to +100 C Industrial -40 to +100 C Commercial 0 to +85 C Commercial 0 to +85 C Commercial 0 to +85 C Industrial -40 to +100 C
RoHS Compliance Yes (G suffix, Pb-free) No (N suffix, tin-lead) No (N suffix, tin-lead) Yes (G suffix, Pb-free) Yes (G suffix, Pb-free) Yes (G suffix, Pb-free)
Lifecycle Status Last-time-buy / EOL Last-time-buy / EOL Last-time-buy / EOL Last-time-buy / EOL Last-time-buy / EOL Last-time-buy / EOL

Bảo phân biệt quan trọng

  • Highest-density Arria II GX member in the FF35 package (vsEP2AGX190FF35I3G)
  • Industrial temperature grade with lead-free finish (vsEP2AGX260FF35C6N)
  • Speed grade I3 balances timing margin and max frequency (vsEP2AGX260FF35I5N)

Ghi chú thiết kế

Estimated: The EP2AGX260FF35I3G in the 1152-FBGA 'FF35' package typically dissipates 6-12 W depending on transceiver utilisation and clock rate. Designers should compute worst-case power using the Altera Early Power Estimator (EPE) in Quartus II and provide a thermally enhanced PCB land pattern with at least 16 thermal vias under the central BGA ball array. For sealed enclosures, derate junction temperature by 15 C below the absolute maximum of 125 C to preserve long-term reliability.

The 1152-FBGA 'FF35' package requires a high-density PCB stack-up with microvia technology. Use 4-6 mil core dielectric and 1 oz copper layers. Maintain 100 ohm differential impedance for the transceiver lanes with length matching within 5 mil. Keep the reference-clock traces less than 1 inch and isolated from noisy digital signals. Altera's pin connection guidelines recommend AC-coupling capacitors of 100 nF on each transceiver lane adjacent to the FPGA.

Do not confuse speed grade suffix conventions: I3 and I5 are industrial, C4/C5/C6 are commercial; lower number indicates faster timing. The G/N suffix indicates lead-free vs tin-lead ball finish respectively. When sourcing on the secondary market, verify the date code to avoid counterfeit parts. Arria II GX is in last-time-buy, so long-term production requires either a lifecycle buy or migration to Arria V GX / Arria 10 GX.

Place configuration memory (EPCS) within 1 inch of the FPGA data lines to avoid signal-integrity issues during configuration. Provide separate decoupling for each power rail: 100 uF bulk + 10 uF + 1 uF + 100 nF per rail per region. Use the Quartus II pin planner to assign transceiver pins and validate PCB layout with the Altera Transceiver Toolkit before tape-out.

Thông tin tuân thủ

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Không chì
Yes
Không halogen
Unknown
Khoáng vật xung đột
Compliant

RoHS compliance indicated by G suffix per Intel/Altera product naming convention. Not AEC-Q100 qualified (FPGA is not an automotive-grade part). Arria II GX family is in last-time-buy; long-term production planning should account for end-of-life transition to Arria V GX or Arria 10 GX.

Dữ liệu được xác minh vào: 2026-09-08 — dữ liệu được xác minh và quản lý bởi đội ngũ kỹ thuật phần cứng của XAIPART

Tìm kiếm liên quan

EP2AGX260FF35I3G EP2AGX260FF35I3G datasheet Arria II GX EP2AGX260 Intel Altera FPGA 244K logic elements 1152-BGA FC-FBGA FPGA Arria II EP2AGX260FF35I3G drop-in replacement EP2AGX260FF35I3G price buy EP2AGX260FF35I3G vs EP2AGX190FF35I3G Arria II GX lead free RoHS EP2AGX260FF35I3G pinout 1152 BGA what is the logic element count of EP2AGX260FF35I3G Arria II GX PCI Express Gen2 endpoint

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Intel Altera Arria II GX EP2AGX260FF35I3G EP2AGX260FF35I5N EP2AGX260FF35C6N EP2AGX260FF35C5G EP2AGX260FF35C4G EP2AGX190FF35I3G FPGA Field-Programmable Gate Array CPLD logic element embedded memory transceiver PCI Express Gen2 Serial RapidIO FC-FBGA 1152-BBGA Quartus II DSP block RoHS lead-free industrial temperature grade signal integrity
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